Izizathu zokuwa kweoyile eluhlaza ekuchaseni iwelding yebhodi yesekethe kwaye zeziphi iingxaki ezinokubangelwa yioyile eluhlaza kakhulu

Ngokwesiqhelo, sibona ifilimu yomphezulu eluhlaza kumphezulu we ibhodi yesekethe. Ngapha koko, le yeyona bhodi yesekethe iyathengisa iyinki. Ishicilelwe kwi-PCB ikakhulu ukuthintela ukuwelda, ke ikwabizwa ngokuba yi-solder yokumelana ne-inki. Eyona solder ye-PCB ixhaphakileyo yokumelana nee-inki ziluhlaza, luhlaza okwesibhakabhaka, mhlophe, mnyama, tyheli kwaye zibomvu, kunye neminye imibala enqabileyo. Olu luhlu lwe-inki lunokugubungela abaqhubi abangalindelekanga ngaphandle kweepads, kuthintele ukuwelda isekethe emfutshane kunye nokwandisa ubomi benkonzo ye-PCB kwinkqubo yokusetyenziswa; Oku kubizwa ngokuba welding ukumelana okanye ukuwelda anti; Nangona kunjalo, ngexesha lokulungiswa kwe-PCB, kukho iingxaki ezininzi amaxesha ngamaxesha, kwaye enye yeengxaki eziqhelekileyo kukuhla kwe-solder yokumelana neoyile eluhlaza kwibhodi yesekethe. Yintoni isizathu sokuwa kweinki kwibhodi yesekethe?

Kukho izizathu ezintathu eziphambili zokuwa kweoyile eluhlaza yokumelana nokudibanisa ibhodi yesekethe:

Enye kukuba xa ushicilela i-inki kwi-PCB, ukwenziwa kwangaphambili akukwenziwa endaweni. Umzekelo, kukho amabala, uthuli okanye ubumdaka kumphezulu wePCB, okanye ezinye iindawo zineoksijini. Ngapha koko, indlela elula yokusombulula le ngxaki kukuphinda wenze oko ngaphambi kwexesha, kodwa uzame ukucoca amabala, ukungcola okanye umaleko we-oxide kumphezulu we-PCB;

Isizathu sesibini kukuba kusenokwenzeka ukuba ibhodi yesekethe ibhakwe ehovini okwexeshana okanye ubushushu abonelanga, kuba ibhodi yesekethe kufuneka ibhakwe kubushushu obuphezulu emva kokuprinta i-ink ye-thermosetting. Ukuba iqondo lokushisa lokubhaka okanye ixesha alonelanga, amandla e-inki phezu kwebhodi ayonelanga, kwaye ekugqibeleni ukumelana ne-solder yebhodi yesekethe kuya kuwa.

Isizathu sesithathu yingxaki yomgangatho we-inki okanye ukuphela kwe-inki. Zombini ezi zizathu ziya kubangela ukuba i-inki ebhodini yesekethe iwe. Ukusombulula le ngxaki, sinokutshintsha kuphela umthengisi we-inki.

Umgangatho we-IPC weshishini lebhodi yesekethe awuchazi ubukhulu beoyile eluhlaza ngokwawo. Ngokubanzi, ukutyeba kweoyile eluhlaza kumphezulu womgca kulawulwa kwi-10-35um; Ukuba ioyile eluhlaza ityebile kakhulu kwaye iphezulu kakhulu kunephedi, kuya kubakho iingozi ezimbini ezifihlakeleyo:

Enye kukuba ubukhulu beplate budlula umgangatho. Ukuxinana kweoyile eluhlaza kakhulu kuya kukhokelela kubungakanani beplate ukuba bukhulu kakhulu, ekunzima ukuyifaka okanye kungenakusetyenziswa;

Okwesibini, umnatha wentsimbi ujijelwe ngeoyile eluhlaza ngexesha le-SMT, kwaye ubukhulu be-solder paste obushicilelweyo kwiphedi yintlama, ekulula ukuyibangela isekethe emfutshane phakathi kwezikhonkwane emva kokufaka kwakhona.