Izizathu zokuwa kukawoyela oluhlaza ekushiseni kokumelana nebhodi lesifunda nokuthi yiziphi izinkinga ezizobangelwa uwoyela oluhlaza kakhulu

Imvamisa, sibona ifilimu engaphezulu eluhlaza ebusweni be- ibhodi yesifunda. Eqinisweni, leli yibhodi lesifunda elimelene ne-inki. Iphrintiwe ku-PCB ikakhulukazi ukuvimbela ukushisela, ngakho-ke ibizwa nangokuthi i-solder Resist ink. I-PCB solder evame kakhulu ukumelana nama-inks iluhlaza okotshani, oluhlaza okwesibhakabhaka, omhlophe, omnyama, ophuzi nokubomvu, kanye neminye imibala ehlukahlukene engajwayelekile. Lolu ungqimba lukayinki lungahlanganisa abaqhubi abangalindelekile ngaphandle kwamapayipi, gwema ukushisela isifunda esifushane futhi wandise impilo yenkonzo ye-PCB ngenkathi isetshenziswa; Ngokuvamile ibizwa ngokuthi i-resistance welding noma i-anti welding; Kodwa-ke, ngesikhathi sokucutshungulwa kwe-PCB, kunezinkinga eziningi ngezikhathi ezithile, futhi enye yezinkinga ezivame kakhulu ukwehla kwe-solder kumelana namafutha aluhlaza ebhodini lesifunda. Siyini isizathu sokwehla kukayinki ebhodini lesifunda?

Kunezizathu ezintathu eziyinhloko zokuwa kukawoyela oluhlaza wokushisela ukumelana nebhodi lesifunda:

Eyokuqala ukuthi lapho kuprintwa uyinki ku-PCB, ukwelashwa kwangaphambili akukwenziwa endaweni. Isibonelo, kunamabala, uthuli noma ukungcola ebusweni be-PCB, noma ezinye izindawo zifakwe i-oxidized. Eqinisweni, indlela elula yokuxazulula le nkinga ukwenza i-pretreatment futhi, kepha zama ukuhlanza amabala, ukungcola noma ungqimba lwe-oxide ebusweni be-PCB;

Isizathu sesibili ukuthi kungenzeka ukuthi yingoba ibhodi lesifunda libhakwe kuhhavini isikhashana noma izinga lokushisa alanele, ngoba ibhodi lesifunda kufanele libhakwe ezingeni lokushisa eliphezulu ngemuva kokuphrinta uyinki we-thermosetting. Uma izinga lokushisa lokubhaka noma isikhathi singenele, amandla ayinki ebhodini azobe enganele, futhi ekugcineni ukumelana kwe-solder kwebhodi lesifunda kuzokuwa.

Isizathu sesithathu inkinga yekhwalithi uyinki noma ukuphelelwa isikhathi kukayinki. Zombili lezi zizathu zizokwenza ukuthi uyinki ebhodini lesifunda uwe. Ukuxazulula le nkinga, singamiselela kuphela umphakeli wenki.

Izinga le-IPC lomkhakha webhodi lesifunda alicacisi ukushuba kukawoyela oluhlaza uqobo. Ngokuvamile, ukushuba kukawoyela oluhlaza ebusweni bomugqa kulawulwa ku-10-35um; Uma uwoyela oluhlaza ukhulu kakhulu futhi uphakeme kakhulu kunephedi, kuzoba nezingozi ezimbili ezifihliwe:

Okunye ukuthi ubukhulu bepuleti budlula okujwayelekile. Uwindi oluwugqinsi oluluhlaza kakhulu luzoholela kusayizi wepuleti kukhulu kakhulu, okunzima ukufaka noma ngisho nokusetshenziswa;

Okwesibili, i-mesh yensimbi iboshwe uwoyela oluhlaza ngesikhathi se-SMT, futhi ukushuba kokunamathisela kwe-solder okuphrintwe ku-pad kuyisigaxa ngesigaxa, okulula ukudala ukujikeleza okufushane phakathi kwezikhonkwane ngemuva kokufakwa kabusha kwe-solder.