Ann an dealbhadh PCB bòrd, anti-ESD design of PCB can be realized through layering, proper layout and installation. Tron phròiseas dealbhaidh, faodaidh a ’mhòr-chuid de dh’ atharrachaidhean dealbhaidh a bhith cuibhrichte gu bhith a ’cur no a’ toirt air falbh phàirtean tro ro-innse. Le bhith ag atharrachadh cruth agus sreangadh PCB, faodar casg a chuir air ESD.

Static PCB electricity from the human body, the environment and even inside the electric PCB board copying equipment will cause various damage to the precision semiconductor chip, such as penetrating the thin insulation layer inside the components; Milleadh air geataichean phàirtean MOSFET agus CMOS; CMOS trigger lock in PCB copy; Ceangal PN claonadh cùil geàrr-chuairt; Short-circuit positive PCB copy board biased PN junction; PCB board melting welding wire or aluminum wire in PCB board board part of active device. Gus cuir às do bhriseadh agus milleadh sgaoileadh electrostatach (ESD) gu uidheamachd dealanach, feumar grunn cheumannan teignigeach a ghabhail gus casg a chuir air.

In the design of PCB board, anti-ESD design of PCB can be realized through layering and proper layout of PCB copy board and PCB copy board wiring and installation. Tron phròiseas dealbhaidh, faodaidh a ’mhòr-chuid de dh’ atharrachaidhean dealbhaidh a bhith cuibhrichte gu bhith a ’cur no a’ toirt air falbh phàirtean tro ro-innse. By adjusting PCB layout and wiring, it can prevent PCB ESD. Seo cuid de na ceumannan cumanta.

Cleachd PCBS multilayer far an gabh sin dèanamh. Faodaidh na plèanaichean talmhainn agus cumhachd, a bharrachd air na loidhnichean loidhne loidhne talmhainn le farsaingeachd teann, lùghdachadh a dhèanamh air bacadh modh coitcheann agus ceangal inductive gu 1/10 gu 1/100 de PCB le dà thaobh an coimeas ri PCB le dà thaobh. Feuch ri gach còmhdach comharra a chuir faisg air sreath cumhachd no talmhainn. Airson PCBS àrd-dùmhlachd le co-phàirtean air gach cuid uachdar àrd is ìosal, ceanglaichean glè ghoirid, agus tòrr lìonadh talmhainn, smaoinich air loidhnichean a-staigh a chleachdadh. Airson PCBS le dà thaobh, thathas a ’cleachdadh solar cumhachd agus grids eadar-fhighte gu teann. Tha an sreang cumhachd ri taobh na talmhainn agus bu chòir a cheangal cho mòr ‘s as urrainn eadar na loidhnichean dìreach is còmhnard no sònaichean lìonaidh. The size of one side grid PCB shall be less than or equal to 60mm, if possible, grid size shall be less than 13mm.

How to design anti-ESD of PCB board

Ensure that each circuit PCB copy board is as compact as possible.

Cuir a h-uile inneal-ceangail an dàrna taobh cho mòr ‘sa ghabhas.

If possible, direct the power PCB lines from the center of the card away from areas that are directly exposed to ESD.

On all PCB layers below the connectors leading out of the chassis (PCB copy boards are vulnerable to ESD), place wide chassis or polygon filled floors and connect them together with holes at approximately 13mm intervals.

PCB copy board mounting holes are placed on the edge of the card, and the top and bottom pads of PCB copy board open flux are connected to the ground of the chassis around the mounting holes.

When assembling PCB, do not apply any solder on PCB copy pad of top or bottom layer. Use screws with built-in PCB copy washers to achieve tight contact between PCB and PCB copy/shield of metal chassis or support on ground surface.

Bu chòir an aon “sòn iomallachd” a bhith air a stèidheachadh eadar làr a ’chaise agus an làr cuairteachaidh air gach còmhdach; Ma ghabhas e dèanamh, cùm am beàrn aig 0.64mm.

At the top and bottom of the card near the PCB mounting hole, connect the chassis ground and the circuit ground together with 1.27mm wide wire every 100mm along the chassis ground wire. Adjacent to these connection points, a pad or mounting hole for installation is placed between the chassis floor and the circuit floor PCB board. Faodar na ceanglaichean talmhainn seo a ghearradh le lann gus fuireach fosgailte, no leum le grìogagan magnetach / capacitors tricead àrd.

If the circuit board will not be placed in the metal box or PCB copy shielding device, the top and bottom chassis ground wire of the circuit board can not be coated with solder resistance, so that they can be used as ESD arc discharge electrode.

To set up a ring around the circuit in the following PCB copying mode:

(1) In addition to the edge of the PCB board reader and the chassis, the entire periphery is placed around the ring path.

(2) Dèan cinnteach gu bheil leud nan sreathan uile nas motha na 2.5mm.

(3) Tha na tuill ceangailte ann am fàinne gach 13mm.

(4) Connect the annular ground with the common ground of multi-layer PCB copy circuit together.

(5) For double-sided PCB boards installed in metal cases or shielding devices, the ring ground should be connected to the circuit in common. For unshielded double-sided circuits, the ring ground should be connected to the chassis, the ring ground should not be coated with flux, so that the ring ground can act as an ESD discharge rod, at least a 0.5mm wide gap should be placed somewhere on the ring ground (all layers), so that the PCB board can not form a large loop. Cha bu chòir sreangadh comharran a bhith nas lugha na 0.5mm air falbh bhon talamh cearcaill.