A cikin zane na Kwamitin PCB, anti-ESD design of PCB can be realized through layering, proper layout and installation. Lokacin aiwatar da ƙira, yawancin canje -canjen ƙira na iya iyakance don ƙarawa ko cire abubuwan ta hanyar tsinkaya. Ta hanyar daidaita tsarin PCB da wayoyi, ana iya hana ESD da kyau.

Static PCB electricity from the human body, the environment and even inside the electric PCB board copying equipment will cause various damage to the precision semiconductor chip, such as penetrating the thin insulation layer inside the components; Lalacewar ƙofofin MOSFET da abubuwan CMOS; CMOS trigger lock in PCB copy; Short-circuit baya nuna bambanci PN junction; Short-circuit positive PCB copy board biased PN junction; PCB board melting welding wire or aluminum wire in PCB board board part of active device. Don kawar da tsangwama da lalacewar fitowar electrostatic (ESD) ga kayan lantarki, ya zama dole a ɗauki matakan fasaha iri -iri don hanawa.

In the design of PCB board, anti-ESD design of PCB can be realized through layering and proper layout of PCB copy board and PCB copy board wiring and installation. Lokacin aiwatar da ƙira, yawancin canje -canjen ƙira na iya iyakance don ƙarawa ko cire abubuwan ta hanyar tsinkaya. By adjusting PCB layout and wiring, it can prevent PCB ESD. Anan akwai taka tsantsan.

Yi amfani da PCBS na multilayer a duk lokacin da zai yiwu. Jirgin ƙasa da wutar lantarki, gami da layin siginar siginar ƙasa mai ƙarfi, na iya rage rashin daidaiton yanayin gama-gari da haɗa haɗin kai zuwa 1/10 zuwa 1/100 na PCB mai gefe biyu idan aka kwatanta da PCB mai gefe biyu. Gwada sanya kowane siginar siginar kusa da wuta ko ƙasa. Don PCBS mai yawa tare da abubuwan haɗin abubuwa a saman saman da ƙasa, haɗin guntu, da yawan cika ƙasa, yi la’akari da amfani da layin ciki. Don PCBS mai gefe biyu, ana amfani da kayan wutar lantarki da ke haɗe da juna. Igiyar wutar tana kusa da ƙasa kuma yakamata a haɗa ta gwargwadon iko tsakanin layin tsaye da na kwance ko wuraren cika. The size of one side grid PCB shall be less than or equal to 60mm, if possible, grid size shall be less than 13mm.

How to design anti-ESD of PCB board

Ensure that each circuit PCB copy board is as compact as possible.

Ajiye duk masu haɗawa a gefe gwargwadon iko.

If possible, direct the power PCB lines from the center of the card away from areas that are directly exposed to ESD.

On all PCB layers below the connectors leading out of the chassis (PCB copy boards are vulnerable to ESD), place wide chassis or polygon filled floors and connect them together with holes at approximately 13mm intervals.

PCB copy board mounting holes are placed on the edge of the card, and the top and bottom pads of PCB copy board open flux are connected to the ground of the chassis around the mounting holes.

When assembling PCB, do not apply any solder on PCB copy pad of top or bottom layer. Use screws with built-in PCB copy washers to achieve tight contact between PCB and PCB copy/shield of metal chassis or support on ground surface.

Haka kuma ya kamata a kafa “yankin keɓewa” tsakanin fakitin chassis da bene kewaye akan kowane layi; Idan za ta yiwu, kiyaye tazara a 0.64mm.

At the top and bottom of the card near the PCB mounting hole, connect the chassis ground and the circuit ground together with 1.27mm wide wire every 100mm along the chassis ground wire. Adjacent to these connection points, a pad or mounting hole for installation is placed between the chassis floor and the circuit floor PCB board. Ana iya yanke waɗannan haɗin ƙasa tare da ruwa don kasancewa a buɗe, ko tsalle tare da beads magnetic/high frequency capacitors.

If the circuit board will not be placed in the metal box or PCB copy shielding device, the top and bottom chassis ground wire of the circuit board can not be coated with solder resistance, so that they can be used as ESD arc discharge electrode.

To set up a ring around the circuit in the following PCB copying mode:

(1) In addition to the edge of the PCB board reader and the chassis, the entire periphery is placed around the ring path.

(2) Tabbatar cewa fadin duk yadudduka ya fi 2.5mm.

(3) An haɗa ramukan a cikin zobe kowane 13mm.

(4) Connect the annular ground with the common ground of multi-layer PCB copy circuit together.

(5) For double-sided PCB boards installed in metal cases or shielding devices, the ring ground should be connected to the circuit in common. For unshielded double-sided circuits, the ring ground should be connected to the chassis, the ring ground should not be coated with flux, so that the ring ground can act as an ESD discharge rod, at least a 0.5mm wide gap should be placed somewhere on the ring ground (all layers), so that the PCB board can not form a large loop. Wurin sigina bai kamata ya zama ƙasa da 0.5mm nesa da ƙasa ba.