Na imewe nke PCB mbadamba, anti-ESD design of PCB can be realized through layering, proper layout and installation. N’oge usoro nhazi, ọtụtụ mgbanwe imewe nwere ike bụrụ naanị ịgbakwunye ma ọ bụ wepu ihe site na amụma. Site n’ịhazigharị okirikiri nhọrọ ukwuu PCB na wiring, ESD nwere ike igbochi nke ọma.

Static PCB electricity from the human body, the environment and even inside the electric PCB board copying equipment will cause various damage to the precision semiconductor chip, such as penetrating the thin insulation layer inside the components; Mmebi n’ọnụ ụzọ ámá nke ihe MOSFET na CMOS; CMOS trigger lock in PCB copy; Ntughari mkpagharị mkpirikpi PN nkwụsị; Short-circuit positive PCB copy board biased PN junction; PCB board melting welding wire or aluminum wire in PCB board board part of active device. Iji kpochapụ nnyonye anya na mmebi nke mwepụ electrostatic (ESD) na akụrụngwa elektrọnik, ọ dị mkpa ịme usoro teknụzụ dị iche iche iji gbochie.

In the design of PCB board, anti-ESD design of PCB can be realized through layering and proper layout of PCB copy board and PCB copy board wiring and installation. N’oge usoro nhazi, ọtụtụ mgbanwe imewe nwere ike bụrụ naanị ịgbakwunye ma ọ bụ wepu ihe site na amụma. By adjusting PCB layout and wiring, it can prevent PCB ESD. Nke a bụ ụfọdụ akpachapụ anya.

Jiri PCBS multilayer mgbe ọ bụla enwere ike. Ụgbọ elu ala na ike, yana ahịrị ahịrị akara akara nwere oghere, nwere ike belata impedance nkịtị na njikọta ihe na 1/10 ruo 1/100 nke PCB nwere ihu abụọ ma e jiri ya tụnyere PCB nwere ihu abụọ. Gbalịa idobe oyi akwa mgbaama ọ bụla nso na ike ma ọ bụ oyi akwa ala. Maka PCBS nke nwere oke nwere ihe dị na elu na ala, njikọ dị mkpụmkpụ, na ọtụtụ njuputa ala, tụlee iji ahịrị dị n’ime. Maka PCBS nwere ihu abụọ, a na-eji ọkụ na-agbachi agbachi agbachi. Ụdọ ọkụ dị n’akụkụ ala ma ekwesịrị ijikọ ya dịka o kwere mee n’etiti ahịrị kwụ ọtọ na kwụ ọtọ ma ọ bụ mpaghara juputara. The size of one side grid PCB shall be less than or equal to 60mm, if possible, grid size shall be less than 13mm.

How to design anti-ESD of PCB board

Ensure that each circuit PCB copy board is as compact as possible.

Hapụ njikọ niile n’akụkụ enwere ike.

If possible, direct the power PCB lines from the center of the card away from areas that are directly exposed to ESD.

On all PCB layers below the connectors leading out of the chassis (PCB copy boards are vulnerable to ESD), place wide chassis or polygon filled floors and connect them together with holes at approximately 13mm intervals.

PCB copy board mounting holes are placed on the edge of the card, and the top and bottom pads of PCB copy board open flux are connected to the ground of the chassis around the mounting holes.

When assembling PCB, do not apply any solder on PCB copy pad of top or bottom layer. Use screws with built-in PCB copy washers to achieve tight contact between PCB and PCB copy/shield of metal chassis or support on ground surface.

Ekwesịrị ịtọ otu “mpaghara iche” n’etiti etiti chassis na ala sekit na akwa ọ bụla; Ọ bụrụ na ọ ga -ekwe mee, debe oghere na 0.64mm.

At the top and bottom of the card near the PCB mounting hole, connect the chassis ground and the circuit ground together with 1.27mm wide wire every 100mm along the chassis ground wire. Adjacent to these connection points, a pad or mounting hole for installation is placed between the chassis floor and the circuit floor PCB board. Enwere ike igbutu njikọ ala ndị a site na agụba ka ọ ghere oghe, ma ọ bụ jiri ndọta ndọta/ndị na -eme ka ikuku dị elu na -awụlikwa elu.

If the circuit board will not be placed in the metal box or PCB copy shielding device, the top and bottom chassis ground wire of the circuit board can not be coated with solder resistance, so that they can be used as ESD arc discharge electrode.

To set up a ring around the circuit in the following PCB copying mode:

(1) In addition to the edge of the PCB board reader and the chassis, the entire periphery is placed around the ring path.

(2) Gbaa mbọ hụ na obosara nke akwa niile karịrị 2.5mm.

(3) A na -ejikọ oghere ndị ahụ na mgbanaka kwa 13mm.

(4) Connect the annular ground with the common ground of multi-layer PCB copy circuit together.

(5) For double-sided PCB boards installed in metal cases or shielding devices, the ring ground should be connected to the circuit in common. For unshielded double-sided circuits, the ring ground should be connected to the chassis, the ring ground should not be coated with flux, so that the ring ground can act as an ESD discharge rod, at least a 0.5mm wide gap should be placed somewhere on the ring ground (all layers), so that the PCB board can not form a large loop. Wiring mgbaama ekwesịghị ịbụ ihe na -erughị 0.5mm n’ebe mgbanaka.