在设计中 PCB板, anti-ESD design of PCB can be realized through layering, proper layout and installation. 在设计过程中，大多数设计更改可以仅限于通过预测添加或删除组件。 通过调整PCB布局和布线，可以很好地防止ESD。

Static PCB electricity from the human body, the environment and even inside the electric PCB board copying equipment will cause various damage to the precision semiconductor chip, such as penetrating the thin insulation layer inside the components; 损坏 MOSFET 和 CMOS 元件的栅极； CMOS trigger lock in PCB copy; 短路反向偏置PN结； Short-circuit positive PCB copy board biased PN junction; PCB board melting welding wire or aluminum wire in PCB board board part of active device. 为了消除静电放电（ESD）对电子设备的干扰和损坏，需要采取多种技术措施加以防范。

In the design of PCB board, anti-ESD design of PCB can be realized through layering and proper layout of PCB copy board and PCB copy board wiring and installation. 在设计过程中，大多数设计更改可以仅限于通过预测添加或删除组件。 By adjusting PCB layout and wiring, it can prevent PCB ESD. 以下是一些常见的预防措施。

尽可能使用多层 PCBS。 与双面 PCB 相比，接地层和电源层以及紧密间隔的信号线-地线可以将共模阻抗和电感耦合降低到双面 PCB 的 1/10 到 1/100。 尽量将每个信号层靠近电源层或接地层。 对于顶部和底部表面都有元件、连接非常短且大量接地的高密度 PCBS，请考虑使用内线。 对于双面 PCBS，使用紧密交织的电源和网格。 电源线靠近地面，应尽可能连接在垂直线和水平线或填充区之间。 The size of one side grid PCB shall be less than or equal to 60mm, if possible, grid size shall be less than 13mm.

How to design anti-ESD of PCB board

Ensure that each circuit PCB copy board is as compact as possible.

尽可能将所有连接器放在一边。

If possible, direct the power PCB lines from the center of the card away from areas that are directly exposed to ESD.

On all PCB layers below the connectors leading out of the chassis (PCB copy boards are vulnerable to ESD), place wide chassis or polygon filled floors and connect them together with holes at approximately 13mm intervals.

PCB copy board mounting holes are placed on the edge of the card, and the top and bottom pads of PCB copy board open flux are connected to the ground of the chassis around the mounting holes.

When assembling PCB, do not apply any solder on PCB copy pad of top or bottom layer. Use screws with built-in PCB copy washers to achieve tight contact between PCB and PCB copy/shield of metal chassis or support on ground surface.

各层机箱底板与电路底板之间应设置相同的“隔离区”； 如果可能，将间距保持在 0.64 毫米。

At the top and bottom of the card near the PCB mounting hole, connect the chassis ground and the circuit ground together with 1.27mm wide wire every 100mm along the chassis ground wire. Adjacent to these connection points, a pad or mounting hole for installation is placed between the chassis floor and the circuit floor PCB board. 这些接地连接可以用刀片切断以保持开放，或者用磁珠/高频电容器跳跃。

If the circuit board will not be placed in the metal box or PCB copy shielding device, the top and bottom chassis ground wire of the circuit board can not be coated with solder resistance, so that they can be used as ESD arc discharge electrode.

To set up a ring around the circuit in the following PCB copying mode:

(1) In addition to the edge of the PCB board reader and the chassis, the entire periphery is placed around the ring path.

(2)确保所有层的宽度大于2.5mm。

(3)孔每13mm连成一个环。

(4) Connect the annular ground with the common ground of multi-layer PCB copy circuit together.

(5) For double-sided PCB boards installed in metal cases or shielding devices, the ring ground should be connected to the circuit in common. For unshielded double-sided circuits, the ring ground should be connected to the chassis, the ring ground should not be coated with flux, so that the ring ground can act as an ESD discharge rod, at least a 0.5mm wide gap should be placed somewhere on the ring ground (all layers), so that the PCB board can not form a large loop. 信号走线距离环形地不应小于0.5mm。