Kuyilo lwe Ibhodi PCBUyilo oluchasene ne-ESD lwe-PCB lunokufezekiswa ngokubeka kakuhle, ubeko olufanelekileyo kunye nofakelo. Ngexesha lenkqubo yoyilo, uninzi lotshintsho kuyilo lunokulinganiselwa ekongezeni okanye ekususeni izinto ngokubikezela. Ngokuhlengahlengisa ubeko lwePCB kunye nokufaka iintambo, i-ESD inokuthintelwa kakuhle.

Uxinzelelo lwamandla ombane oluvela emzimbeni womntu, okusingqongileyo kwaye nangaphakathi kwibhodi yombane yezixhobo zokukopa iibhodi zombane ziya kubangela ukonakala okwahlukileyo kwi-chip semiconductor chip, njengokungena ngaphakathi komaleko omncinci ngaphakathi kwezinto; Ukonakala kwamasango eMOSFET kunye nezinto zeCMOS; I-CMOS ibangela ukutshixa kwikopi ye-PCB; Umjikelo wesekethe ojika-jika kwi-PN; Mfutshane-wesekethe ibhodi yekopi elungileyo ye-PN isiphambuka; Ibhodi ye-PCB inyibilikisa ucingo lwe-welding okanye i-aluminium ucingo kwibhodi yebhodi ye-PCB eyinxalenye yesixhobo esisebenzayo. Ukuphelisa ukuphazamiseka kunye nokonakaliswa kokukhutshelwa ngombane (i-ESD) kwizixhobo ze-elektroniki, kuyafuneka ukuba uthathe amanyathelo ngeendlela zokuthintela.

Kuyilo lwebhodi ye-PCB, uyilo oluchasene ne-ESD lwe-PCB lunokufezekiswa ngokubeka kunye nokuma ngokufanelekileyo kwebhodi yekopi ye-PCB kunye ne-PCB yokukhuphela iibhodi zebhodi kunye nokufakwa. Ngexesha lenkqubo yoyilo, uninzi lotshintsho kuyilo lunokulinganiselwa ekongezeni okanye ekususeni izinto ngokubikezela. Ngokuhlengahlengisa ubeko lwe-PCB kunye neentambo, inokuthintela i-PCB ESD. Nazi ezinye iindlela zokuthintela.

Sebenzisa ii-PCBS ezininzi xa kunokwenzeka. Umhlaba kunye neenqwelomoya zamandla, kunye nolayini obungqindililiweyo womgca womhlaba, unokunciphisa ukunganyangeki kwendlela eqhelekileyo kunye nokudityaniswa kwe-1/10 ukuya ku-1/100 ye-PCB enamacala amabini xa kuthelekiswa ne-PCB enamacala amabini. Zama ukubeka umaleko ngamnye wesiginali kufutshane namandla okanye umaleko womhlaba. Kwii-PCBS ezixineneyo ezinamacandelo kwindawo ephezulu kunye nezantsi, unxibelelwano olufutshane kakhulu, kunye nokuzaliswa komhlaba okuninzi, cinga ngokusebenzisa imigca yangaphakathi. Kwii-PCBS ezinamacala amabini, kusetyenziswa umbane odityanisiweyo kunye neigridi. Intambo yamandla ikufutshane nomhlaba kwaye kufuneka idityaniswe kangangoko phakathi kwemigca ethe nkqo kunye ethe tye okanye imimandla yokugcwalisa. Ubungakanani becala elinye le-PCB yecala liya kuba ngaphantsi okanye lilingane ne-60mm, ukuba kunokwenzeka, ubungakanani begridi buya kuba ngaphantsi kwe-13mm.

Uyila njani i-anti-ESD yebhodi ye-PCB

Qinisekisa ukuba ibhodi nganye yesekethe ye-PCB ikwicompact njengoko kunokwenzeka.

Beka zonke izihlanganisi ecaleni kangangoko kunokwenzeka.

Ukuba kunokwenzeka, thumela ngqo imigca yamandla e-PCB ukusuka embindini wekhadi kude neendawo ezichazwe ngqo kwi-ESD.

Kuzo zonke izaleko zePCB ezingezantsi kwezihlanganisi ezikhokelela kwisisu semoto (iibhodi zekopi zePCB zisengozini kwi-ESD), beka i-chassis ebanzi okanye ipoligoni egcwele imigangatho kwaye uyixhume kunye nemingxunya malunga ne-13mm.

Imingxunya yokufaka ikopi yebhodi ye-PCB ibekwe elunxwemeni lwekhadi, kwaye iiphedi eziphezulu nezasezantsi zebhodi yebhodi ye-PCB evulekileyo idityaniswe emhlabeni we-chassis ejikeleze imingxunya enyukayo.

Xa uhlanganisa i-PCB, musa ukufaka nayiphi na into e-solder kwi-PCB pad pad ephezulu okanye esezantsi. Sebenzisa izikhonkwane ezakhelwe-ngaphakathi kwi-PCB ikopi ye-washer ukufezekisa unxibelelwano oluqinileyo phakathi kwe-PCB kunye nekopi ye-PCB / ikhaka le-chassis yesinyithi okanye inkxaso kwinkalo yomhlaba.

Kwindawo enye “yokuzahlula” kufuneka ibekwe phakathi komgangatho we-chassis kunye nomgangatho wesekethe kumaleko ngamnye; Ukuba kunokwenzeka, gcina isithuba kwi-0.64mm.

Phezulu nasezantsi kwekhadi kufutshane nomngxunya wokunyusa i-PCB, qhagamshela umhlaba we-chassis kunye nomhlaba wesekethe kunye ne-1.27mm yocingo olubanzi yonke i-100mm ecaleni kwentsimbi yomhlaba ye-chassis. Ecaleni kwezi ndawo zonxibelelwano, iphedi okanye umngxunya wokufaka ufakelo lubekwe phakathi komgangatho we-chassis kunye nebhodi yesekethe ye-PCB. Olu nxibelelwano lomhlaba lunokunqunyulwa ngebhley ukuba luhlale luvulekile, okanye utsibe ngamaso emagnethi / ii-capacitors ezihamba rhoqo.

Ukuba ibhodi yesekethe ayizukufakwa kwibhokisi yesinyithi okanye isixhobo sokukhusela i-PCB, ucingo oluphezulu kunye nolusezantsi lwebhodi yesekethe alunakudityaniswa nokumelana ne-solder, ukuze zisetyenziswe njenge-ESD arc discharge electrode.

Ukuseta iringi ejikeleze isekethe kule ndlela yePCP yokukopa:

(1) Ukongeza kumda webhodi yebhodi ye-PCB kunye ne-chassis, yonke imida ibekwe kwindawo ejikelezayo.

(2) Qinisekisa ukuba ububanzi bazo zonke izaleko bungaphezulu kwe-2.5mm.

(3) Imingxunya idityaniswe kwisangqa rhoqo nge-13mm.

(4) Qhagamshela umhlaba thunzi kunye nomhlaba eqhelekileyo multi-maleko PCB ikopi wesekethe kunye.

(5) Kwiibhodi ze-PCB ezinamacala amabini ezifakwe kwiimeko zetsimbi okanye izixhobo zokukhusela, umhlaba weringi kufuneka uqhagamshelwe kwisekethe ngokufanayo. Kwimijikelezo engacwangciswanga emacaleni amabini, umhlaba weringi kufuneka uqhagamshelwe kwisisu semoto, umhlaba wesangqa awufanele ugqitywe ngumsinga, ukuze umhlaba weringi ukwazi ukusebenza njengesixhobo sokukhupha i-ESD, kufuneka kubekwe umsantsa ububanzi obuyi-0.5mm kwindawo ethile emhlabeni yeringi (zonke iileya), ukuze ibhodi ye-PCB ingabinakho ukwenza iluphu enkulu. Ukufakelwa kweentambo zombane akufuneki kubengaphantsi kwe-0.5mm kude kumhlaba weringi.