Ekuklanyeni kwe PCB ibhodi, Umklamo we-anti-ESD we-PCB ungabonakala ngokubeka, ukwakheka okufanele nokufakwa. Ngesikhathi senqubo yokuklama, izinguquko eziningi zedizayini zingakhawulelwa ekungezeni noma ekususeni izinto ngokubikezela. Ngokulungisa ukwakheka kwe-PCB nezintambo, i-ESD ingavinjelwa kahle.

Ugesi we-PCB oqinile ovela emzimbeni womuntu, imvelo ngisho nangaphakathi kwebhodi likagesi lokukopisha imishini kuzodala ukulimala okuhlukahlukene ku-chip ye-semiconductor chip, njengokungena ungqimba oluncane lokufakwa ngaphakathi ezintweni; Ukulimala kwamasango wezinto ze-MOSFET ne-CMOS; I-CMOS trigger yokukhiya kwikhophi le-PCB; I-junction ye-PN yesikhashana esifushane; Ibhodi lekhophi elihle le-PCB elifushane elifana ne-PN; I-PCB ibhodi yokuncibilikisa insimbi noma ucingo lwe-aluminium ebhodini lebhodi le-PCB ingxenye yedivayisi esebenzayo. Ukuze kuqedwe ukuphazamiseka nokonakala kokukhishwa kwe-electrostatic (ESD) ezintweni zikagesi, kuyadingeka ukuthatha izinyathelo ezahlukahlukene zobuchwepheshe ukuvimbela.

Ekuklanyweni kwebhodi le-PCB, ukwakheka kwe-anti-ESD kwe-PCB kungabonakala ngokuhlelwa nokuhlelwa kahle kwebhodi lekhophi le-PCB kanye ne-PCB yebhodi yokufaka izintambo nokufakwa. Ngesikhathi senqubo yokuklama, izinguquko eziningi zedizayini zingakhawulelwa ekungezeni noma ekususeni izinto ngokubikezela. Ngokulungisa ukwakheka kwe-PCB nezintambo, kungavimbela i-PCB ESD. Nazi ezinye izindlela zokuzivikela ezivamile.

Sebenzisa ama-PCBS amaningi lapho kungenzeka khona. Izindiza zomhlaba namandla, kanye nolayini abahlukaniswe ngocingo womugqa womhlabathi, kunganciphisa ukuvinjelwa kwemodi ejwayelekile nokuhlangana okunamandla ku-1/10 kuye ku-1/100 we-PCB emaceleni omabili uma kuqhathaniswa ne-PCB emaceleni amabili. Zama ukubeka ungqimba wesiginali ngamunye eduze kongqimba lwamandla noma lomhlabathi. Kuma-PCBS amakhulu kakhulu anezinto kuzo zombili izindawo eziphezulu nezingezansi, ukuxhumana okufushane kakhulu, nokugcwaliswa okuningi komhlaba, cabanga ukusebenzisa imigqa yangaphakathi. Kuma-PCBS anezinhlangothi ezimbili, kusetshenziswa ugesi ohlanganiswe ngokuqinile kanye namagridi. Intambo yamandla iseduze nomhlabathi futhi kufanele ixhunywe ngangokunokwenzeka phakathi kwemigqa emi mpo futhi ivundlile noma iziza zokugcwalisa. Usayizi owodwa ohlangothini igridi PCB kufanele ibe ngaphansi noma ilingane 60mm, uma kungenzeka, ubukhulu grid kuyoba ngaphansi kuka 13mm.

Ungayakha kanjani i-anti-ESD yebhodi le-PCB

Qiniseka ukuthi ibhodi ngalinye lekhophi le-PCB lihambelana ngangokunokwenzeka.

Beka zonke izixhumi eceleni ngangokunokwenzeka.

Uma kunokwenzeka, khombisa imigqa yamandla we-PCB ukusuka maphakathi nekhadi kude nezindawo ezivezwe ngqo ku-ESD.

Kuzo zonke izingqimba ze-PCB ezingezansi kwezixhumi eziphuma ku-chassis (amabhodi ekhophi e-PCB asengozini ku-ESD), beka i-chassis ebanzi noma ifolishi eligcwele phansi bese uwaxhuma kanye nezimbobo cishe ngezikhathi ezi-13mm.

Izimbobo zokukopisha zebhodi le-PCB zibekwa onqenqemeni lwekhadi, kanti amaphedi aphezulu nangaphansi we-PCB ekopisha ibhodi evulekile axhunywe emhlabathini weshaassisi ezungeze izimbobo ezihlanganayo.

Lapho uhlanganisa i-PCB, ungasebenzisi noma iyiphi i-solder ku-PCB copy pad yengqimba ephezulu noma engezansi. Sebenzisa izikulufo ngama-washer wekhophi we-PCB owakhelwe ngaphakathi ukufeza ukuxhumana okuqinile phakathi kwe-PCB nekhophi le-PCB / isihlangu sensimbi yensimbi noma ukwesekwa ebusweni bomhlaba.

“Indawo yokuhlukaniswa” efanayo kufanele isethwe phakathi kwetheyisi chassis nefulethi lesifunda kusendlalelo ngasinye; Uma kungenzeka, gcina isikhala ku-0.64mm.

Phezulu nangaphansi kwekhadi eliseduze nomgodi wokufaka we-PCB, xhuma umhlaba we-chassis kanye nomhlabathi wesifunda kanye no-1.27mm ububanzi bocingo njalo nge-100mm ngocingo lwaphansi lwe-chassis. Eduze kwalezi zindawo zokuxhuma, kubekwa iphedi noma umgodi wokufaka phakathi kwephansi lesisu kanye nebhodi le-PCB lesifunda. Lezi zixhumanisi zomhlaba zingasikwa ngensimbi ukuze ihlale ivulekile, noma igxume ngobuhlalu kazibuthe / ama-capacitors aphezulu.

Uma ibhodi lesifunda lingenakufakwa ebhokisini lensimbi noma kwidivaysi yekhophi ye-PCB evikela, ucingo lwensimbi ephezulu noluphansi lwebhodi lesifunda alunakufakwa ukumelana ne-solder, ukuze lisetshenziswe njenge-electrode ye-ESD arc.

Ukusetha indandatho ezungeze isekethe kumodi elandelayo yokukopisha ye-PCB:

(1) Ngaphezu komphetho we-board board ye-PCB kanye ne-chassis, yonke indawo ezungeze indawo ibekwe ngasendleleni yendandatho.

(2) Qinisekisa ukuthi ububanzi bazo zonke izingqimba bukhulu kune-2.5mm.

(3) Izimbobo zixhunywe eringini njalo nge-13mm.

(4) Xhuma umhlabathi we-annular nomhlabathi ofanayo we-multi-layer PCB ikhophi wesifunda ndawonye.

(5) Ngamabhodi we-PCB anezinhlangothi ezimbili afakwe ezimeni zensimbi noma kumadivayisi wokuvikela, umhlaba wendandatho kufanele uxhumeke kusifunda ngokufanayo. Kumasekethe anezinhlangothi ezimbili angenazicingo, umugqa wendandatho kufanele uxhunywe ku-chassis, umugqa wendandatho akufanele ufakwe ukugeleza, ukuze umhlaba wendandatho ube yinduku yokukhipha i-ESD, okungenani kufanele kubekwe igebe elingu-0.5mm ububanzi ndawana thize emhlabathini wendandatho (zonke izingqimba), ukuze ibhodi le-PCB lingakwazi ukwakha iluphu enkulu. Ukuxhunywa kwesiginali akufanele kube ngaphansi kuka-0.5mm kude nomhlabathi wendandatho.