Kamar yadda muka sani, da asali Properties na PCB (Buga kewaye allon) ya dogara da aikin da substrate abu. Sabili da haka, don inganta aikin allon kewayawa, aikin aikin kayan aikin dole ne a fara inganta shi. Ya zuwa yanzu, ana haɓaka sabbin kayayyaki daban-daban kuma ana amfani da su don biyan buƙatun sabbin fasahohi da yanayin kasuwa.

A cikin ‘yan shekarun nan, allon da’ira da aka buga sun sami canji. Kasuwar dai ta karkata ne daga kayayyakin masarufi na gargajiya kamar kwamfutocin tebur zuwa hanyoyin sadarwa mara waya irin su sabar da tashoshin wayar hannu. Na’urorin sadarwar tafi-da-gidanka waɗanda wayoyi masu wayo ke wakilta sun haɓaka haɓakar PCB masu girma, nauyi mai nauyi da ayyuka masu yawa. Idan babu wani abu mai ma’ana, kuma buƙatun tsarin sa suna da alaƙa da aikin PCB, fasahar da’ira da aka buga ba za ta taɓa faruwa ba. Sabili da haka, zaɓin kayan abu yana taka muhimmiyar rawa wajen samar da inganci da amincin PCB da samfurin ƙarshe.

Haɗu da buƙatun babban yawa da layi mai kyau

• Abubuwan buƙatu don foil na jan karfe

Duk allunan PCB suna motsawa zuwa mafi girma da kuma mafi kyawun da’irori, musamman HDI PCB (High Density Interconnect PCB). Shekaru goma da suka gabata, an bayyana HDI PCB a matsayin PCB, kuma faɗin layinta (L) da tazarar layi (S) sun kasance 0.1mm ko ƙasa da haka. Koyaya, daidaitattun ƙimar L da S a cikin masana’antar lantarki na iya zama ƙanana kamar 60 μm, kuma a cikin lamuran ci gaba, ƙimar su na iya zama ƙasa da 40 μm.

Yadda ake tantance kayan aikin PCB na ku

Hanyar gargajiya na ƙirƙirar zanen da’ira yana cikin tsarin hoto da etching. Tare da aikace-aikace na bakin ciki foil substrates (tare da kauri a cikin kewayon 9μm zuwa 12μm), mafi ƙasƙanci darajar L da S kai 30μm.

Saboda tsadar bakin ciki na CCL CCL (Copper Clad Laminate) da kuma lahani da yawa a cikin tari, yawancin masana’antun PCB suna amfani da hanyar ɓoye-kopper, kuma an saita kauri na tagulla zuwa 18μm. A gaskiya ma, wannan hanya ba a ba da shawarar ba saboda ya ƙunshi matakai da yawa, kauri yana da wuyar sarrafawa kuma yana haifar da farashi mai girma. A sakamakon haka, bakin ciki na jan karfe ya fi kyau. Bugu da ƙari, lokacin da ƙimar L da S na hukumar ba ta wuce 20μm ba, daidaitaccen tsarin jan ƙarfe ba ya aiki. A ƙarshe, ana ba da shawarar a yi amfani da foil na jan ƙarfe mai bakin ciki, saboda ana iya daidaita kaurin tagulla a cikin kewayon 3μm zuwa 5μm.

Baya ga kaurin foil ɗin tagulla, daidaitattun da’irori na yanzu kuma suna buƙatar farfajiyar foil ɗin tagulla tare da ƙarancin ƙarancin ƙarfi. Don haɓaka ƙarfin haɗin kai tsakanin foil ɗin tagulla da kayan da ake amfani da su da kuma tabbatar da ƙarfin kwasfa na mai gudanarwa, ana yin aiki mai tsauri akan jirgin saman tagulla, kuma gabaɗayan ƙarancin tagulla ya fi 5μm.

Haɗa foil ɗin tagulla mai hump kamar yadda kayan tushe ke da nufin haɓaka ƙarfin kwawon sa. Duk da haka, don sarrafa madaidaicin gubar daga wuce gona da iri a lokacin etching, yana ƙoƙarin haifar da gurɓataccen gurɓataccen abu, wanda zai iya haifar da ɗan gajeren da’ira tsakanin layi ko raguwar ƙarfin rufewa, wanda ke shafar mafi kyawun da’irori. Don haka, ana buƙatar foil ɗin jan ƙarfe tare da ƙarancin ƙarancin (kasa da μm ko ma 3 μm).

Ko da yake roughness na tagulla tsare da aka rage, shi ne har yanzu wajibi ne a rike da kwasfa ƙarfi na madugu, wanda ya haifar da wani musamman surface jiyya a saman na jan karfe tsare da substrate abu, wanda taimaka wajen tabbatar da kwasfa ƙarfi daga cikin kwasfa. madugu.

• Abubuwan buƙatu don insulating dielectric laminates

Ɗaya daga cikin manyan halayen fasaha na HDI PCB yana cikin tsarin gini. RCC da aka saba amfani da ita (gudu mai rufi jan ƙarfe) ko prepreg epoxy gilashin gilashin da lamination na jan karfe da wuya ya haifar da kyakkyawan da’irori. Yanzu yana son yin amfani da SAP da MSPA, wanda ke nufin aikace-aikacen insulating dielectric film laminated electroless jan plating don samar da jan karfe conductive jirage. Domin jirgin tagulla yana da bakin ciki, ana iya samar da da’irori masu kyau.

Ɗaya daga cikin mahimman abubuwan SAP shine laminate kayan dielectric. Domin biyan buƙatun madaidaicin madauri mai girma, dole ne a gabatar da wasu buƙatu don kayan laminate, gami da kaddarorin dielectric, rufi, juriya na zafi da haɗin gwiwa, kazalika da daidaitawar fasaha da ke dacewa da HDI PCB.

A cikin marufi na semiconductor na duniya, ana canza marufi na marufi na IC daga abubuwan yumbura zuwa abubuwan da suka dace. Fakitin fakitin FC yana ƙara ƙarami kuma ƙarami, don haka ƙimar al’ada na L da S shine 15 μm, kuma zai zama ƙarami.

Ayyukan gyare-gyare na multilayer ya kamata ya jaddada ƙananan kaddarorin dielectric, ƙananan haɓakar haɓakawar thermal (CTE) da babban juriya na zafi, wanda ke nufin ƙananan ƙananan farashi waɗanda suka dace da maƙasudin aikin. A zamanin yau, ana haɗe fasahar sarrafa kayan insulation na MSPA tare da foil na jan ƙarfe na bakin ciki da za a yi amfani da shi wajen samar da daidaitattun da’irori. Ana amfani da SAP don kera ƙirar kewayawa tare da ƙimar L da S ƙasa da 10 μm.

Babban yawa da kuma bakin ciki na PCBs sun haifar da HDI PCBs zuwa canzawa daga lamination tare da murhu zuwa muryoyin kowane Layer. Don HDI PCBs masu aiki iri ɗaya, yanki da kauri na PCBs masu haɗin haɗin gwiwa akan kowane Layer an rage su da 25% idan aka kwatanta da waɗanda ke da laminate na asali. Wajibi ne a yi amfani da Layer dielectric mai bakin ciki tare da mafi kyawun kayan lantarki a cikin waɗannan PCBs HDI guda biyu.

Yana buƙatar fitarwa daga babban mita da babban gudu

Fasahar sadarwa ta lantarki tana kama daga waya zuwa mara waya, daga ƙananan mitoci da ƙananan gudu zuwa mitar mitoci da babban gudu. Ayyukan wayoyin komai da ruwanka sun samo asali daga 4G zuwa 5G, suna buƙatar saurin watsawa da saurin watsawa.

Zuwan zamani na lissafin girgije na duniya ya haifar da haɓaka da yawa a cikin zirga-zirgar bayanai, kuma akwai bayyananniyar yanayin ga manyan mitoci da kayan aikin sadarwa masu sauri. Don saduwa da buƙatun watsawa da sauri da sauri, ban da rage tsangwama da amfani da sigina, amincin sigina da masana’anta sun dace da buƙatun ƙira na ƙirar PCB, kayan aiki masu mahimmanci sune mafi mahimmancin mahimmanci.

Babban aikin injiniya shine rage kaddarorin asarar siginar lantarki don haɓaka saurin PCB da magance matsalolin amincin sigina. Dangane da ayyukan masana’antu sama da shekaru goma na PCBCart, a matsayin maɓalli mai mahimmanci da ke shafar zaɓin kayan aikin ƙasa, lokacin da ƙarancin dielectric (Dk) ya yi ƙasa da 4 kuma asarar dielectric (Df) ta ƙasa da 0.010, ana ɗaukarsa azaman matsakaicin Dk/Df laminate Lokacin da Dk ya yi ƙasa da 3.7 kuma Df ya yi ƙasa da 0.005, ana ɗaukar shi ƙaramin Dk/Df laminate. A halin yanzu, ana samun nau’ikan kayan substrate iri-iri a kasuwa.

Ya zuwa yanzu, akwai galibi nau’ikan abubuwa guda uku na abubuwan da aka saba amfani da su na babban mitar da’ira: resins na tushen fluorine, resin PPO ko PPE da resins na epoxy da aka gyara. Fluorine jerin dielectric substrates, kamar PTFE, suna da mafi ƙarancin kaddarorin dielectric kuma yawanci ana amfani da su don samfuran da mitar 5 GHz ko mafi girma. Epoxy resin FR-4 ko PPO da aka gyara ya dace da samfurori tare da kewayon mitar 1GHz zuwa 10GHz.

Kwatanta kayan maɗaukakin mitoci uku, resin epoxy yana da mafi ƙarancin farashi, kodayake guduro na fluorine yana da mafi girman farashi. Dangane da madaidaicin dielectric, asarar dielectric, sha ruwa, da halayen mita, resins na tushen fluorine yana yin mafi kyau, yayin da resin epoxy yayi muni. Lokacin da mitar da samfurin ke amfani da shi ya fi 10GHz, guduro mai tushen fluorine kawai zai yi aiki. Rashin lahani na PTFE sun haɗa da tsada mai tsada, rashin ƙarfi mara kyau, da babban haɓakar haɓakar thermal.

Don PTFE, ana iya amfani da abubuwa masu yawa na inorganic (kamar silica) azaman kayan filler ko zanen gilashi don haɓaka rigidity na kayan da ke ƙasa da rage ƙimar haɓakar thermal. Bugu da ƙari, saboda rashin aiki na ƙwayoyin PTFE, yana da wuya ga kwayoyin PTFE su haɗa su tare da foil na tagulla, don haka dole ne a gane wani wuri na musamman wanda ya dace da foil na tagulla. Hanyar magani ita ce yin etching sinadarai a saman polytetrafluoroethylene don ƙara girman yanayin ko don ƙara fim ɗin m don ƙara ƙarfin mannewa. Tare da aikace-aikacen wannan hanyar, ana iya shafar kaddarorin dielectric, kuma dole ne a ƙara haɓaka da’irar madaidaicin tushen fluorine.

Guduro mai rufewa na musamman wanda ya ƙunshi ingantaccen resin epoxy ko PPE da TMA, MDI da BMI, da zanen gilashi. Hakazalika da FR-4 CCL, yana da kyakkyawan juriya na zafi da kaddarorin dielectric, ƙarfin injina, da masana’antar PCB, duk waɗanda ke sa ya fi shahara fiye da tushen tushen PTFE.

Bugu da ƙari, abubuwan da ake buƙata na kayan aiki na kayan rufewa kamar resins, ƙarancin jan ƙarfe a matsayin jagora kuma muhimmin abu ne da ke shafar asarar watsa siginar, wanda shine sakamakon sakamakon fata. Ainihin, tasirin fata shine cewa induction na lantarki da aka haifar akan watsa siginar sigina mai girma kuma jagorar inductive ya zama mai da hankali sosai a tsakiyar yanki na jagorar, kuma siginar tuki ko siginar yana mai da hankali kan saman gubar. Ƙunƙarar saman madubin yana taka muhimmiyar rawa wajen haifar da asarar siginar watsawa, kuma ƙananan ƙarancin yana haifar da asara kaɗan.

A daidai wannan mita, girman girman saman jan karfe zai haifar da asarar sigina. Sabili da haka, dole ne a sarrafa ƙarancin jan ƙarfe na saman a cikin masana’anta na ainihi, kuma ya kamata ya zama ƙasa kamar yadda zai yiwu ba tare da shafar mannewa ba. Dole ne a mai da hankali sosai ga sigina a cikin kewayon mitar 10 GHz ko sama. Ana buƙatar ƙaƙƙarfan foil ɗin tagulla ya zama ƙasa da 1μm, kuma yana da kyau a yi amfani da foil ɗin jan karfe mai ultra-surface tare da roughness na 0.04μm. Dole ne a haɗe daɗaɗɗen fuskar bangon tagulla tare da ingantaccen maganin iskar shaka da tsarin guduro mai haɗawa. Nan gaba kadan, ana iya samun foil ɗin tagulla ba tare da resin mai rufaffiyar bayanin martaba ba, wanda ke da ƙarfin kwasfa don hana asarar dielectric daga lalacewa.

Yana buƙatar babban juriya na thermal da babban tarwatsewa

Tare da ci gaba na ci gaba na miniaturization da babban aiki, kayan aikin lantarki suna ƙoƙarin samar da ƙarin zafi, don haka buƙatun kula da thermal na kayan aikin lantarki suna karuwa sosai. Ɗaya daga cikin hanyoyin magance wannan matsala ta ta’allaka ne a cikin bincike da haɓaka PCBs masu zafi. Mahimmin yanayin don PCB don yin aiki mai kyau dangane da juriya na zafi da tarwatsewa shine juriya na zafi da iyawar ɓarna na substrate. Haɓakawa na yanzu a cikin ƙimar zafin zafin jiki na PCB yana cikin haɓakar guduro da ƙari na ciko, amma yana aiki ne kawai a cikin ƙayyadadden nau’i. Hanyar da ta dace ita ce amfani da IMS ko karfe core PCB, waɗanda ke aiki azaman abubuwan dumama. Idan aka kwatanta da radiators na gargajiya da magoya baya, wannan hanya tana da fa’idodin ƙananan girman da ƙananan farashi.

Aluminum abu ne mai ban sha’awa mai ban sha’awa tare da fa’idodin albarkatu masu yawa, ƙarancin farashi da kyakkyawan yanayin zafi. Kuma tsanani. Bugu da kari, yana da mutuƙar mutunta muhalli ta yadda galibin ƙarfen ƙarfe ko ƙofofin ƙarfe ke amfani da shi. Saboda fa’idodin tattalin arziƙi, ingantaccen haɗin wutar lantarki, haɓakar zafi da ƙarfi mai ƙarfi, kyauta mara siyar da gubar, allunan da’ira na tushen aluminum an yi amfani da su a samfuran mabukaci, motoci, kayan soja da samfuran sararin samaniya. Babu shakka mabuɗin juriya na zafi da aikin ɓarna na ƙarfen ƙarfe yana cikin mannewa tsakanin farantin karfe da jirgin kewayawa.

Yadda za a tantance abin da ke cikin PCB ɗin ku?

A cikin zamani na lantarki na zamani, ƙarancin ƙarancin na’urorin lantarki ya haifar da bullar PCBs masu tsauri da masu sassauƙa / m PCBs. Don haka wane nau’in kayan abu ne ya dace da su?

Ƙara wuraren aikace-aikace na PCBs masu ƙarfi da PCB masu sassauƙa / m sun kawo sababbin buƙatu dangane da yawa da aiki. Misali, ana iya rarraba fina-finai na polyimide zuwa sassa daban-daban, gami da m, fari, baki da rawaya, tare da juriya mai zafi da ƙarancin haɓakar haɓakar thermal don aikace-aikace a yanayi daban-daban. Hakazalika, kasuwar fim ɗin polyester mai tsada mai tsada za ta karɓi kasuwa saboda girmanta, kwanciyar hankali, ingancin fuskar fim, haɗin gwiwar hoto da juriya na muhalli, don saduwa da canjin bukatun masu amfani.

Hakazalika da m HDI PCB, m PCB dole ne saduwa da bukatun na high-gudun da high-mita watsa sigina, da kuma hankali dole ne a biya zuwa dielectric akai-akai da dielectric asarar m substrate abu. Za’a iya haɗa da’ira mai sassauƙa da polytetrafluoroethylene da ɗigon polyimide na gaba. Za a iya ƙara ƙurar da ba ta da tsari da kuma fiber carbon zuwa ga resin polyimide don haifar da sassauƙa mai sassauƙan thermal conductive substrate mai Layer uku. Abun filler inorganic na iya zama aluminum nitride, aluminum oxide ko hexagonal boron nitride. Irin wannan nau’in kayan abu yana da ƙarfin wutar lantarki na 1.51W/mK, yana iya tsayayya da ƙarfin lantarki na 2.5kV da curvature na digiri 180.