E like me kā mākou e ʻike ai, nā waiwai kumu o PCB (papa kaapuni paʻi) hilinaʻi ma ka hana o kāna mea pani. No laila, i mea e hoʻomaikaʻi ai i ka hana o ka papa kaapuni, pono e hoʻokō mua ʻia ka hana o ka mea substrate. I kēia manawa, hoʻomohala ʻia nā mea hou a hoʻohana ʻia e hoʻokō i nā koi o nā ʻenehana hou a me nā ʻano mākeke.

I nā makahiki i hala iho nei, ua hoʻololi ʻia nā papa kaapuni paʻi. Ua neʻe nui ka mākeke mai nā huahana lako kuʻuna e like me nā kamepiula desktop i nā kamaʻilio uea ʻole e like me nā kikowaena a me nā terminal mobile. Ua paipai ʻia nā polokalamu kelepona kelepona i hōʻike ʻia e nā kelepona akamai i ka hoʻomohala ʻana i nā PCB kiʻekiʻe, māmā-kaumaha a me nā hana nui. Inā ʻaʻohe mea substrate, a pili pono kāna kaʻina hana i ka hana o ka PCB, ʻaʻole loa e ʻike ʻia ka ʻenehana kaapuni paʻi. No laila, he mea koʻikoʻi ke koho ʻana i nā mea substrate i ka hāʻawi ʻana i ka maikaʻi a me ka hilinaʻi o ka PCB a me ka huahana hope.

E hoʻokō i nā pono o ke kiʻekiʻe kiʻekiʻe a me nā laina maikaʻi

• Nā koi no ke keleawe keleawe

Ke neʻe nei nā papa PCB āpau i nā kaapuni kiʻekiʻe a ʻoi aku ka maikaʻi, ʻoi aku ka HDI PCB (High Density Interconnect PCB). He ʻumi makahiki aku nei, ua wehewehe ʻia ʻo HDI PCB e like me PCB, a ʻo kona laulā laina (L) a me ka laina laina (S) he 0.1mm a i ʻole. Eia nō naʻe, hiki ke liʻiliʻi nā waiwai maʻamau o L a me S i ka ʻoihana uila e like me ka 60 μm, a i nā hihia kiʻekiʻe, hiki i kā lākou waiwai ke haʻahaʻa e like me 40 μm.

Pehea e hoʻoholo ai i kāu mea pāpaʻi PCB

ʻO ke ʻano kuʻuna o ka hoʻokumu ʻana i ke kiʻi kaapuni ma ke kaʻina hana kiʻi a me ka etching. Me ka hoʻohana ʻana i nā substrates keleawe keleawe lahilahi (me ka mānoanoa ma ka laulā o 9μm a 12μm), ʻo ka haʻahaʻa haʻahaʻa o L a me S hiki i 30μm.

Ma muli o ke kumukūʻai kiʻekiʻe o ke keleawe keleawe CCL (Copper Clad Laminate) a me nā hemahema he nui i ka waihona, nui nā mea hana PCB e hoʻohana i ke ʻano etching-copper foil, a ua hoʻonohonoho ʻia ka mānoanoa keleawe i 18μm. ʻO kaʻoiaʻiʻo, ʻaʻole ʻōlelo ʻia kēia ʻano hana no ka mea he nui nā kaʻina hana, paʻakikī ka mānoanoa e kāohi a alakaʻi i nā kumukūʻai kiʻekiʻe. ʻO ka hopena, ʻoi aku ka maikaʻi o ka foil keleawe lahilahi. Eia kekahi, i ka emi ʻana o nā koina L a me S o ka papa ma mua o 20μm, ʻaʻole hana ka pahu keleawe maʻamau. ʻO ka mea hope loa, ua ʻōlelo ʻia e hoʻohana i ka foil keleawe ultra-thin, no ka mea hiki ke hoʻololi ʻia kona mānoanoa keleawe ma ka laulā o 3μm a 5μm.

Ma waho aʻe o ka mānoanoa o ka pahu keleawe, pono nā kaapuni i kēia manawa i kahi ʻili keleawe me ka haʻahaʻa haʻahaʻa. I mea e hoʻomaikaʻi ai i ka hiki ke hoʻopaʻa ʻia ma waena o ka foil keleawe a me ka mea substrate a hōʻoia i ka ikaika o ka peel o ka conductor, hana ʻia ka hana ʻino ma luna o ka mokulele keleawe, a ʻoi aku ka nui o ka roughness o ka foil keleawe ma mua o 5μm.

ʻO ka hoʻokomo ʻana i ka pahu keleawe hump ma ke ʻano he kumu kumu e hoʻomaikaʻi ai i kona ikaika ʻili. Eia nō naʻe, i mea e hoʻomalu ai i ka pololei o ke alakaʻi mai ka over-etching i ka wā kaʻapuni etching, ʻo ia ka mea e hoʻoulu ai i nā mea haumia hump, hiki ke kumu i ka pōkole pōkole ma waena o nā laina a i ʻole ka emi ʻana o ka mana insulation, e pili pono ana i nā kaapuni maikaʻi. No laila, koi ʻia ka foil keleawe me ka haʻahaʻa haʻahaʻa (emi iho ma mua o 3 μm a i ʻole 1.5 μm).

ʻOiai ua hoʻemi ʻia ka ʻōpala o ka pahu keleawe, pono ia e hoʻomau i ka ikaika o ka peel o ka conductor, kahi e hoʻomaʻamaʻa ai i ka ʻili kūikawā ma ka ʻili o ka ʻili keleawe a me ka mea substrate, e kōkua ana e hōʻoia i ka ikaika o ka peel. alakaʻi alakaʻi.

• Nā koi no ka insulating dielectric laminates

ʻO kekahi o nā hiʻohiʻona ʻenehana nui o HDI PCB aia i ke kaʻina hana. ʻO ka RCC maʻamau (resin coated copper) a i ʻole ka lole aniani epoxy prepreg a me ka copper foil lamination ʻaʻole hiki ke alakaʻi i nā kaapuni maikaʻi. I kēia manawa, makemake ʻia e hoʻohana i ka SAP a me MSPA, ʻo ia hoʻi ka noi ʻana o ka insulating dielectric film laminated electroless copper plating e hana i nā mokulele conductive keleawe. Ma muli o ka lahilahi o ka mokulele keleawe, hiki ke hana ʻia nā kaapuni maikaʻi.

ʻO kekahi o nā mea koʻikoʻi o SAP ka laminate i nā mea dielectric. I mea e hoʻokō ai i nā koi o nā kaʻa kaʻa kiʻekiʻe kiʻekiʻe, pono e waiho ʻia kekahi mau koi no nā mea laminate, me nā waiwai dielectric, insulation, wela a me ka hoʻopaʻa ʻana, a me ka ʻenehana adaptability kūpono me HDI PCB.

I loko o ka pōʻai semiconductor honua, ua hoʻololi ʻia nā substrates packaging IC mai nā substrate seramika i nā substrates organik. Ke liʻiliʻi a liʻiliʻi ka pitch o nā substrates pūʻolo FC, no laila ʻo ka waiwai maʻamau o L a me S i kēia manawa he 15 μm, a ʻoi aku ka liʻiliʻi.

ʻO ka hana ʻana o nā substrates multi-layer pono e hoʻokūpaʻa i nā waiwai dielectric haʻahaʻa, haʻahaʻa coefficient thermal expansion (CTE) a me ke kūpaʻa wela kiʻekiʻe, e pili ana i nā substrates haʻahaʻa e kū ana i nā pahuhopu hana. I kēia mau lā, ua hui pū ʻia ka ʻenehana hoʻopaʻa dielectric insulation MSPA me ka foil keleawe lahilahi e hoʻohana ʻia i ka hana nui o nā kaapuni pololei. Hoʻohana ʻia ʻo SAP no ka hana ʻana i nā hiʻohiʻona kaapuni me nā koina L a me S ma lalo o 10 μm.

ʻO ke kiʻekiʻe kiʻekiʻe a me ka lahilahi o nā PCB ua hoʻololi i nā HDI PCB mai ka lamination me nā cores i nā cores o kekahi papa. No nā PCB HDI me ka hana like, ʻo ka ʻāpana a me ka mānoanoa o nā PCB i hoʻopili ʻia ma kēlā me kēia papa e hoʻemi ʻia e 25% i hoʻohālikelike ʻia me nā laminates kumu. Pono e hoʻopili i kahi papa dielectric ʻoi aku ka maikaʻi o nā waiwai uila i kēia mau HDI PCB ʻelua.

Pono e hoʻokuʻu aku mai ke alapine kiʻekiʻe a me ka wikiwiki kiʻekiʻe

ʻO ka ʻenehana kamaʻilio uila mai ka uea a hiki i ka uea, mai ke alapine haʻahaʻa a me ka wikiwiki haʻahaʻa a hiki i ke alapine kiʻekiʻe a me ka wikiwiki kiʻekiʻe. Ua ulu ka hana o nā smartphones mai 4G a i 5G, e koi ana i ka wikiwiki o ka hoʻouna ʻana a me ka nui o ka hoʻouna ʻana.

ʻO ka hōʻea ʻana mai o ke au o ka ʻike ao honua ua alakaʻi i ka piʻi nui ʻana o ka hele ʻana o ka ʻikepili, a aia kahi ʻano maʻalahi no nā lako kamaʻilio kiʻekiʻe a me ka wikiwiki. I mea e hoʻokō ai i nā koi o ka hoʻoili kiʻekiʻe a me ka wikiwiki kiʻekiʻe, me ka hoʻohaʻahaʻa ʻana i ka hōʻailona hōʻailona a me ka hoʻohana ʻana, ua kūpono ka hōʻailona hōʻailona a me ka hana ʻana me nā koi hoʻolālā o ka hoʻolālā PCB, nā mea hana kiʻekiʻe ka mea nui loa.

ʻO ka hana nui a ka ʻenekinia ʻo ka hōʻemi ʻana i nā waiwai o ka nalowale o ka hōʻailona uila e hoʻonui i ka wikiwiki PCB a hoʻonā i nā pilikia kūpaʻa hōʻailona. Ma muli o ka ʻoi aku o ka ʻumi makahiki o ka hana hana ʻana o ka PCBCart, ma ke ʻano he kumu nui e pili ana i ke koho ʻana i nā mea substrate, ke emi iho ka dielectric (Dk) ma mua o 4 a ʻo ka dielectric loss (Df) ka haʻahaʻa ma mua o 0.010, ua manaʻo ʻia he waena Dk/Df laminate Ke emi iho ka Dk ma mua o 3.7 a me ka Df ma lalo o 0.005, ua manaʻo ʻia he laminate haʻahaʻa Dk/Df. I kēia manawa, loaʻa nā ʻano mea substrate ma ka mākeke.

I kēia manawa, ʻekolu mau ʻano mea maʻamau i hoʻohana ʻia i nā mea substrate papa kaapuni kiʻekiʻe: nā resins-fluorine, nā resins PPO a i ʻole PPE a me nā resins epoxy i hoʻololi ʻia. ʻO nā substrate dielectric fluorine series, e like me PTFE, loaʻa nā waiwai dielectric haʻahaʻa a hoʻohana mau ʻia no nā huahana me ke alapine o 5 GHz a i ʻole. ʻO ka epoxy resin FR-4 a i ʻole PPO substrate i hoʻololi ʻia e kūpono i nā huahana me kahi alapine o 1GHz a 10GHz.

Ke hoʻohālikelike nei i nā mea substrate kiʻekiʻe kiʻekiʻe ʻekolu, ʻo ka epoxy resin ke kumu kūʻai haʻahaʻa loa, ʻoiai ʻo ka fluorine resin ke kumu kiʻekiʻe loa. Ma ke ʻano o ka dielectric mau, ka poho dielectric, ka hoʻoheheʻe wai, a me nā hiʻohiʻona pinepine, ʻoi aku ka maikaʻi o nā resins-fluorine, ʻoiai ʻoi aku ka maikaʻi o nā resins epoxy. Ke kiʻekiʻe ke alapine i hoʻohana ʻia e ka huahana ma mua o 10GHz, ʻo ka resin-based fluorine wale nō e hana. ʻO nā hemahema o ka PTFE e pili ana i ke kumukūʻai kiʻekiʻe, ka rigidity maikaʻi ʻole, a me ka nui o ka hoʻonui wela wela.

No ka PTFE, hiki ke hoʻohana ʻia nā mea waiwai nui (e like me ka silica) i mea hoʻopihapiha a i ʻole ka lole aniani e hoʻonui ai i ka rigidity o ka mea substrate a hoʻemi i ka coefficient o ka hoʻonui wela. Eia kekahi, ma muli o ka inertness o nā molekala PTFE, he mea paʻakikī i nā molekala PTFE e hoʻopaʻa me ka foil keleawe, no laila pono e hoʻokō ʻia kahi lapaʻau kūikawā kūikawā me ka foil keleawe. ʻO ke ʻano o ka mālama ʻana, ʻo ia ka hana ʻana i ke kinikini etching ma ka ʻili o ka polytetrafluoroethylene e hoʻonui i ka ʻili o ka ʻili a i ʻole e hoʻohui i kahi kiʻiʻoniʻoni e hoʻonui ai i ka hiki ke hoʻopili. Me ka hoʻohana ʻana i kēia ʻano hana, hiki ke hoʻopili ʻia nā waiwai dielectric, a pono e hoʻomohala ʻia ka holoʻokoʻa holoʻokoʻa fluorine-based high-frequency circuit.

ʻO ka resin insulating kūikawā i haku ʻia me ka resin epoxy i hoʻololi ʻia a i ʻole PPE a me TMA, MDI a me BMI, me ka lole aniani. E like me FR-4 CCL, loaʻa nō hoʻi iā ia ke kūpaʻa wela maikaʻi loa a me nā waiwai dielectric, ikaika mechanical, a me PCB manufacturability, ʻoi aku ka kaulana o ia mau mea ma mua o nā substrate-based PTFE.

Ma waho aʻe o nā koi hana o nā mea insulating e like me resins, ʻo ka ʻili o ke keleawe ma ke ʻano he conductor kekahi mea nui e pili ana i ka nalowale o ka hoʻouna ʻana i ka hōʻailona, ​​​​ʻo ia ka hopena o ka hopena o ka ʻili. ʻO ke kumu, ʻo ka hopena o ka ʻili ʻo ka induction electromagnetic i hana ʻia ma ka hoʻouna ʻana i ka hōʻailona kiʻekiʻe a me ke alakaʻi inductive e lilo i mea koʻikoʻi i ke kikowaena o ka ʻāpana cross-sectional o ke alakaʻi, a ʻo ka hoʻokele a i ʻole ka hōʻailona e kau ʻia ma ka ili o ke kepau. ʻO ka roughness ili o ka conductor ke kuleana nui i ka hoʻololi ʻana i ka nalowale o ka hōʻailona hoʻouna, a ʻo ka haʻahaʻa haʻahaʻa e alakaʻi i kahi poho liʻiliʻi loa.

Ma ke alapine like, ʻo ka roughness ili kiʻekiʻe o ke keleawe ke kumu o ka nalowale o ka hōʻailona kiʻekiʻe. No laila, pono e ho’omalu ‘ia ka ‘awa’awa o ke keleawe i loko o ka hana maoli, a he ha’aha’a loa ia me ka pili ‘ole i ka pili. Pono e nānā nui i nā hōʻailona ma ke alapine o 10 GHz a i ʻole. Pono e emi iho ka roughness o ka foil keleawe ma mua o 1μm, a ʻoi aku ka maikaʻi o ka hoʻohana ʻana i ka ultra-surface copper foil me ka roughness o 0.04μm. Pono e hui pū ʻia ka ʻili o ka ʻili keleawe me kahi lāʻau oxidation kūpono a me ka ʻōnaehana resin paʻa. I ka wā e hiki mai ana, hiki ke loaʻa kahi pahu keleawe me ka resin uhi ʻole ʻia, ʻoi aku ka ikaika o ka peel e pale ai i ka nalowale o ka dielectric.

Pono ke kū’ē wela kiʻekiʻe a me ka dissipation kiʻekiʻe

Me ka hoʻomohala ʻana o ka miniaturization a me ka hana kiʻekiʻe, ʻoi aku ka nui o nā mea uila e hoʻonui i ka wela, no laila ke koi nui nei nā koi hoʻokele wela o nā mea uila. ʻO kekahi o nā hoʻonā i kēia pilikia aia i ka noiʻi a me ka hoʻomohala ʻana i nā PCB thermally conductive. ʻO ke kūlana maʻamau no ka PCB e hana maikaʻi ma ke ʻano o ka pale ʻana i ka wela a me ka dissipation ʻo ia ke kūpaʻa wela a me ka hiki ke hoʻopau ʻia o ka substrate. ʻO ka hoʻomaikaʻi ʻana i kēia manawa i ka conductivity thermal o PCB aia i ka hoʻomaikaʻi ʻana i ka resin a me ka hoʻopiha ʻana i ka hoʻohui, akā hana wale ia i kahi ʻāpana palena. ʻO ke ʻano maʻamau ka hoʻohana ʻana i ka IMS a i ʻole ka PCB metala, e hana ana ma ke ʻano he mea wela. Ke hoʻohālikelike ʻia me nā radiators kahiko a me nā mea pā, ʻo kēia ʻano ka maikaʻi o ka liʻiliʻi liʻiliʻi a me ke kumu kūʻai haʻahaʻa.

ʻO ka alumini kahi mea nani loa me nā mea maikaʻi o nā kumu waiwai nui, ke kumu kūʻai haʻahaʻa a me ka conductivity thermal maikaʻi. A me ka ikaika. Eia kekahi, ʻoluʻolu loa ia e hoʻohana ʻia e ka hapa nui o nā substrates metala a i ʻole nā ​​​​cores metala. Ma muli o nā pōmaikaʻi o ka hoʻokele waiwai, pili pono uila, conductivity thermal a me ka ikaika kiʻekiʻe, solder-free a me ke alakaʻi ʻole, alumini-based circuit boards i hoʻohana ʻia i nā huahana mea kūʻai aku, nā kaʻa, nā lako kaua a me nā huahana aerospace. ʻAʻohe mea kānalua ʻo ke kī i ka pale ʻana i ka wela a me ka hoʻopau ʻana i ka hana o ka substrate metala aia ma ka adhesion ma waena o ka pā metala a me ka mokulele kaapuni.

Pehea e hoʻoholo ai i ka mea substrate o kāu PCB?

I ka wā uila hou, ʻo ka liʻiliʻi a me ka lahilahi o nā mea uila ua alakaʻi i ka puka ʻana o nā PCB paʻa a me nā PCB paʻa. No laila he aha ke ʻano o nā mea substrate i kūpono iā lākou?

ʻO ka hoʻonui ʻia ʻana o nā wahi noi o nā PCB paʻa a me nā PCB hikiwawe / paʻa i lawe mai i nā koi hou e pili ana i ka nui a me ka hana. No ka laʻana, hiki ke hoʻokaʻawale ʻia nā kiʻiʻoniʻoni polyimide i nā ʻano like ʻole, e like me ke aniani, keʻokeʻo, ʻeleʻele a me ka melemele, me ke kūpaʻa wela kiʻekiʻe a me ka coefficient haʻahaʻa o ka hoʻonui wela no ka noi ʻana i nā kūlana like ʻole. Pēlā nō, e ʻae ʻia ka substrate kiʻi polyester kumu kūʻai e ka mākeke ma muli o kona elasticity kiʻekiʻe, dimensional stability, film surface quality, photoelectric coupling and environmental resistance, e hoʻokō i nā pono loli o nā mea hoʻohana.

E like me ka HDI PCB paʻa, pono ka PCB maʻalahi e hoʻokō i nā koi o ka hoʻouna ʻana i ka hōʻailona kiʻekiʻe a me ke alapine kiʻekiʻe, a pono e uku ʻia i ka dielectric mau a me ka nalowale dielectric o ka mea substrate maʻalahi. Hiki ke haku ʻia ke kaapuni maʻalahi me ka polytetrafluoroethylene a me ka substrate polyimide kiʻekiʻe. Hiki ke hoʻohui ʻia ka lepo inorganic a me ke kalapona kalapona i ka resin polyimide e hopena i kahi substrate thermally conductive hiki ke hoʻololi i ʻekolu. ʻO ka mea hoʻopihapiha hoʻopihapiha paha he alumini nitride, alumini oxide a hexagonal boron nitride. ʻO kēia ʻano mea substrate he conductivity thermal o 1.51W/mK, hiki ke pale i ka volta o 2.5kV a me ka curvature o 180 degere.