Joalokaha bohle re tseba, thepa ea motheo ea PCB (boto ea potoloho e hatisitsoeng) e itšetlehile ka ts’ebetso ea thepa ea eona ea substrate. Ka hona, e le ho ntlafatsa ts’ebetso ea boto ea potoloho, ts’ebetso ea thepa ea substrate e tlameha ho ntlafatsoa pele. Ho fihlela joale, lisebelisoa tse fapaneng tse ncha li ntse li ntlafatsoa le ho sebelisoa ho fihlela litlhoko tsa mahlale a macha le mekhoa ea mebaraka.

Lilemong tsa morao tjena, liboto tsa potoloho tse hatisitsoeng li bile le phetoho. Mmaraka o tlohile haholo lihlahisoa tsa khale tsa hardware tse joalo ka likhomphutha tsa desktop ho ea ho likhokahano tse se nang mohala joalo ka li-server le liteishene tsa mehala. Lisebelisoa tsa puisano tsa mehala tse emeloang ke lifono tse bohlale li khothalelitse nts’etsopele ea li-PCB tse matla haholo, tse bobebe le tse sebetsang ka bongata. Haeba ho se na thepa ea substrate, ‘me litlhoko tsa eona tsa ts’ebetso li amana haufi-ufi le ts’ebetso ea PCB, theknoloji ea potoloho e hatisitsoeng e ke ke ea phethahala. Ka hona, khetho ea thepa ea substrate e phetha karolo ea bohlokoa ho fana ka boleng le botšepehi ba PCB le sehlahisoa sa ho qetela.

Kopana le litlhoko tsa boima bo phahameng le mela e metle

•Litlhoko tsa foil ea koporo

Liboto tsohle tsa PCB li ntse li lebile ho li-circuits tse phahameng haholo le tse ntle haholo, haholo HDI PCB (High Density Interconnect PCB). Lilemong tse leshome tse fetileng, HDI PCB e ne e hlalosoa e le PCB, ‘me bophara ba mela (L) le sebaka sa mela (S) e ne e le 0.1mm kapa ka tlase ho moo. Leha ho le joalo, litekanyetso tsa hajoale tsa L le S indastering ea lisebelisoa tsa elektroniki li ka ba nyane joalo ka 60 μm, mme maemong a tsoetseng pele, boleng ba bona bo ka ba tlase ho 40 μm.

Mokhoa oa ho tseba lisebelisoa tsa hau tsa substrate tsa PCB

Mokhoa o tloaelehileng oa sebopeho sa setšoantšo sa potoloho ke ts’ebetsong ea ho etsa litšoantšo le etching. Ka tšebeliso ea li-substrates tse tšesaane tsa koporo (tse nang le botenya ho tloha ho 9μm ho ea ho 12μm), boleng bo tlaase ka ho fetisisa ba L le S bo fihla ho 30μm.

Ka lebaka la litšenyehelo tse phahameng tsa foil e tšesaane ea koporo CCL (Copper Clad Laminate) le liphoso tse ngata ka har’a stack, bahlahisi ba bangata ba PCB ba atisa ho sebelisa mokhoa oa etching-copper foil, ‘me botenya ba koporo bo behiloe ho 18μm. Ha e le hantle, mokhoa ona ha o khothalletsoe hobane o na le mekhoa e mengata haholo, botenya bo thata ho laola ‘me bo lebisa litšenyehelong tse phahameng. Ka lebaka leo, foil e tšesaane ea koporo e molemo. Ntle le moo, ha boleng ba boto ea L le S bo le ka tlase ho 20μm, foil e tloaelehileng ea koporo ha e sebetse. Qetellong, ho khothalletsoa ho sebelisa foil ea koporo e tšesaane haholo, hobane botenya ba eona ba koporo bo ka fetoloa ho tloha 3μm ho isa ho 5μm.

Ho phaella ho botenya ba foil ea koporo, lipotoloho tsa hona joale tse nepahetseng li boetse li hloka sefahleho sa koporo se nang le boima bo tlaase. E le ho ntlafatsa bokhoni ba ho kopanya pakeng tsa foil ea koporo le thepa ea substrate le ho netefatsa hore matla a peel a mokhanni, ho sebetsa ka thata ho etsoa ka sefofane sa foil sa koporo, ‘me ho hlaka ka kakaretso ha foil ea koporo ho feta 5μm.

Ho kenya foil ea koporo ea hump kaha thepa ea motheo e ikemiselitse ho ntlafatsa matla a eona a peel. Leha ho le joalo, e le ho laola ho nepahala ha pele ho tloha ho feta-etching nakong ea potoloho ea potoloho, e atisa ho baka litšila tsa hump, tse ka bakang potoloho e khutšoanyane pakeng tsa mela kapa ho fokotseha ha matla a ho kenya letsoho, e leng haholo-holo e amang lipotoloho tse ntle. Ka hona, foil ea koporo e nang le mahlahahlaha a tlaase (tlase ho 3 μm kapa esita le 1.5 μm) ea hlokahala.

Le hoja bokhabane ba foil ea koporo bo fokotsehile, ho ntse ho hlokahala ho boloka matla a peel a mokhanni, e leng se bakang phekolo e khethehileng holim’a lesela la koporo le thepa ea substrate, e thusang ho netefatsa matla a peeling. mokhanni.

• Litlhoko tsa ho kenya li-laminate tsa dielectric tsa insulating

E ‘ngoe ea litšobotsi tsa mantlha tsa tekheniki ea HDI PCB e lutse ts’ebetsong ea kaho. RCC e sebelisoang hangata (resin coated copper) kapa prepreg epoxy glass cloth le koporo foil lamination ha se hangata e lebisang lipotolohong tse ntle. Hona joale e sekametse ho sebelisa SAP le MSPA, e bolelang ts’ebeliso ea filimi ea insulating dielectric laminated electroless copper plating ho hlahisa lifofane tse tsamaisang koporo. Kaha sefofane sa koporo se tšesaane, lipotoloho tse ntle li ka hlahisoa.

E ‘ngoe ea lintlha tsa bohlokoa tsa SAP ke ho laminate lisebelisoa tsa dielectric. E le hore ho finyelloe litlhoko tsa lipotoloho tse nepahetseng tse phahameng, litlhoko tse ling li tlameha ho behoa pele bakeng sa lisebelisoa tsa laminate, tse kenyelletsang thepa ea dielectric, ho kenya letsoho, ho hanyetsa mocheso le ho kopanya, hammoho le ho ikamahanya le maemo ho lumellana le HDI PCB.

Ka har’a sephutheloana sa semiconductor ea lefats’e, li-substrates tsa IC tsa ho paka li fetoloa ho tloha ho li-ceramic substrates ho ea ho li-organic substrates. Bophahamo ba likarolo tsa sephutheloana sa FC bo ntse bo fokotseha, kahoo boleng ba hajoale ba L le S ke 15 μm, ‘me bo tla ba nyane.

Ts’ebetso ea li-substrates tse nang le mefuta e mengata e lokela ho hatisa thepa e tlaase ea dielectric, katoloso e tlaase ea coefficient thermal (CTE) le ho hanyetsa mocheso o phahameng, e bolelang li-substrates tse theko e tlaase tse finyellang lipakane tsa ts’ebetso. Matsatsing ana, theknoloji ea ho kenya dielectric stacking ea MSPA e kopantsoe le foil e tšesaane ea koporo e tla sebelisoa tlhahisong e kholo ea li-circuits tse nepahetseng. SAP e sebelisetsoa ho etsa lipaterone tsa potoloho ka boleng ba L le S ka tlase ho 10 μm.

Boima bo phahameng le bosesaane ba li-PCB bo entse hore HDI PCBs e fetohe ho tloha ho lamination ka li-cores ho ea ho li-cores tsa lera lefe kapa lefe. Bakeng sa li-PCB tsa HDI tse nang le ts’ebetso e ts’oanang, sebaka le botenya ba li-PCB tse hokahaneng holim’a lera leha e le lefe li fokotsehile ka 25% ha li bapisoa le tse nang le li-laminate tsa mantlha. Hoa hlokahala ho kenya lera le tšesaane la dielectric le thepa e ntle ea motlakase ho li-PCB tsena tse peli tsa HDI.

E hloka ho romelloa ho tsoa ho maqhubu a holimo le lebelo le holimo

Theknoloji ea puisano ea elektronike e tloha ho tse nang le mehala ho ea ho waelese, ho tloha ho maqhubu a tlaase le lebelo le tlaase ho ea ho maqhubu a phahameng le lebelo le phahameng. Ts’ebetso ea li-smartphone e fetohile ho tloha ho 4G ho ea ho 5G, e hlokang lebelo la phetisetso e potlakileng le palo e kholo ea phetisetso.

Ho fihla ha nako ea lefats’e ea lisebelisoa tsa leru ho entse hore ho be le keketseho e ngata ea sephethephethe sa data, ‘me ho na le mokhoa o hlakileng oa lisebelisoa tsa puisano tse phahameng le tse potlakileng. E le ho finyella litlhoko tsa phetisetso e phahameng ea maqhubu le lebelo le phahameng, ntle le ho fokotsa ho kena-kenana le ho sebelisoa ha matšoao, botšepehi ba pontšo le tlhahiso ea lihlahisoa li lumellana le litlhoko tsa moralo oa moralo oa PCB, lisebelisoa tse phahameng tsa ts’ebetso ke ntho ea bohlokoa ka ho fetisisa.

Mosebetsi o ka sehloohong oa moenjiniere ke ho fokotsa thepa ea tahlehelo ea matšoao a motlakase ho eketsa lebelo la PCB le ho rarolla mathata a botšepehi ba matšoao. E ipapisitse le lilemo tse fetang leshome tsa lits’ebeletso tsa tlhahiso ea PCBCart, e le ntlha ea bohlokoa e amang khetho ea thepa ea substrate, ha dielectric constant (Dk) e le tlase ho 4 mme tahlehelo ea dielectric (Df) e ka tlase ho 0.010, e nkuoa e le sebaka sa marang-rang. intermediate Dk/Df laminate Ha Dk e le tlase ho 3.7 le Df e ka tlaase ho 0.005, e nkoa e le Dk/Df laminate e tlaase. Hona joale, mefuta e fapaneng ea lisebelisoa tsa substrate e fumaneha ‘marakeng.

Ho fihlela joale, ho na le mefuta e meraro ea lisebelisoa tse sebelisoang hangata tse sebelisoang haholo: li-resin tse thehiloeng ho fluorine, PPO kapa PPE resin le epoxy resin e fetotsoeng. Fluorine series dielectric substrates, tse kang PTFE, li na le thepa e tlaase ka ho fetisisa ea dielectric ‘me hangata li sebelisetsoa lihlahisoa tse nang le maqhubu a 5 GHz kapa ho feta. Epoxy resin e fetotsoeng FR-4 kapa PPO substrate e loketse lihlahisoa tse nang le maqhubu a 1GHz ho isa ho 10GHz.

Ha ho bapisoa lisebelisoa tse tharo tse phahameng tsa maqhubu, epoxy resin e na le theko e tlaase, le hoja resin ea fluorine e na le theko e phahameng ka ho fetisisa. Mabapi le ho lula ha dielectric, tahlehelo ea dielectric, ho monya metsi, le litšoaneleho tsa khafetsa, li-resin tse thehiloeng ho fluorine li sebetsa hantle haholo, ha li-epoxy resin li sebetsa hampe le ho feta. Ha maqhubu a sebelisoang ke sehlahisoa a phahame ho feta 10GHz, ke resin e thehiloeng ho fluorine feela e tla sebetsa. Mefokolo ea PTFE e kenyelletsa litšenyehelo tse phahameng, ho tiea ho fokolang, le coefficient e phahameng ea katoloso ea mocheso.

Bakeng sa PTFE, lintho tse ngata tsa inorganic (joalo ka silica) li ka sebelisoa e le lisebelisoa tsa ho tlatsa kapa lesela la khalase ho matlafatsa ho tiea ha thepa ea substrate le ho fokotsa coefficient ea katoloso ea mocheso. Ho phaella moo, ka lebaka la ho se sebetse ha limolek’hule tsa PTFE, ho thata hore limolek’hule tsa PTFE li tlamahane le foil ea koporo, kahoo phekolo e khethehileng ea holim’a metsi e lumellanang le foil ea koporo e tlameha ho phethahala. Mokhoa oa ho phekola ke ho etsa lik’hemik’hale tsa lik’hemik’hale holim’a polytetrafluoroethylene ho eketsa bokaholimo kapa ho eketsa filimi e khomarelang ho eketsa bokhoni ba ho khomarela. Ka tšebeliso ea mokhoa ona, thepa ea dielectric e ka ‘na ea ameha,’ me potoloho eohle ea fluorine-based high-frequency circuit e tlameha ho ntlafatsoa ka ho eketsehileng.

Resin e ikhethileng ea insulating e entsoeng ka epoxy resin e fetotsoeng kapa PPE le TMA, MDI le BMI, hammoho le lesela la khalase. E ts’oanang le FR-4 CCL, e boetse e na le lisebelisoa tse ntle tsa mocheso le dielectric properties, matla a mochine, le PCB manufacturability, tseo kaofela li etsang hore e ratoe ho feta li-substrates tse thehiloeng ho PTFE.

Ntle le litlhoko tsa ts’ebetso ea lisebelisoa tse sireletsang tse kang li-resin, bokaholimo ba koporo e le mokhanni le eona ke ntho ea bohlokoa e amang tahlehelo ea phetisetso ea matšoao, e leng phello ea phello ea letlalo. Ha e le hantle, phello ea letlalo ke hore induction ea electromagnetic e hlahisoang phetisong ea lets’oao le phahameng haholo mme lead inductive e tsepame haholo bohareng ba sebaka se kaholimo sa lead, mme hona joale kapa lets’oao la ho khanna le shebile bokahodimo ba loto. Bokhachane bo kaholimo ba conductor bo phetha karolo ea bohlokoa ho susumetsa tahlehelo ea lets’oao la phetiso, ‘me bokhopo bo tlase bo lebisa tahlehelong e nyane haholo.

Ka nako e ts’oanang, sekhahla se phahameng sa koporo se tla baka tahlehelo e kholo ea matšoao. Ka hona, ho thatafala ha koporo ea holim’a metsi ho tlameha ho laoloa ha ho etsoa tlhahiso ea sebele, ‘me e lokela ho ba tlase ka hohle kamoo ho ka khonehang ntle le ho ama ho khomarela. Tlhokomelo e kholo e tlameha ho lefshoa ho matšoao a maqhubu a 10 GHz kapa ho feta. Bokhopo ba foil ea koporo bo hlokeha hore bo be ka tlase ho 1μm, ‘me ho molemo ho sebelisa foil ea koporo ea ultra-surface e nang le boima ba 0.04μm. Bokaholimo ba foil ea koporo bo tlameha ho kopanngoa le kalafo e loketseng ea oxidation le sistimi ea bonding ea resin. Haufinyane, ho ka ‘na ha e-ba le foil ea koporo e se nang resin e koahetsoeng ka profile, e nang le matla a phahameng a peel ho thibela tahlehelo ea dielectric hore e se ke ea ameha.

E hloka khanyetso e phahameng ea mocheso le ho senyeha ho hoholo

Ka mokhoa oa nts’etsopele ea miniaturization le ts’ebetso e phahameng, lisebelisoa tsa elektronike li atisa ho hlahisa mocheso o mongata, kahoo litlhoko tsa tsamaiso ea mocheso oa lisebelisoa tsa elektronike li ntse li eketseha le ho feta. E ‘ngoe ea litharollo tsa bothata bona ke lipatlisiso le nts’etsopele ea li-PCB tse tsamaisang mocheso. Boemo ba mantlha ba hore PCB e sebetse hantle mabapi le ho hanyetsa mocheso le ho qhalana ke ho hanyetsa mocheso le matla a ho senya a substrate. Ntlafatso ea hajoale ea conductivity ea mocheso ea PCB e itšetlehile ka ntlafatso ea resin le tlatsetso ea ho tlatsa, empa e sebetsa feela ka sehlopha se lekanyelitsoeng. Mokhoa o tloaelehileng ke ho sebelisa IMS kapa tšepe core PCB, e sebetsang e le lisebelisoa tsa ho futhumatsa. Ha ho bapisoa le li-radiator le li-fan tsa setso, mokhoa ona o na le melemo ea boholo bo nyane le theko e tlase.

Aluminium ke thepa e khahlehang haholo e nang le melemo ea lisebelisoa tse ngata, theko e tlase le conductivity e ntle ea mocheso. Le matla. Ho phaella moo, e na le botsoalle ba tikoloho hoo e sebelisoang ke likarolo tse ngata tsa tšepe kapa li-cores tsa tšepe. Ka lebaka la melemo ea moruo, khokahanyo ea motlakase e ka tšeptjoang, conductivity ea mocheso le matla a phahameng, li-solder-free le lead-free, liboto tsa potoloho tse thehiloeng ka aluminium li sebelisitsoe lihlahisoa tsa bareki, likoloi, thepa ea sesole le lihlahisoa tsa sefofane. Ha ho pelaelo hore senotlolo sa ho hanyetsa mocheso le ts’ebetso ea ho senyeha ha karolo ea tšepe ea tšepe e teng ka ho khomarela pakeng tsa poleiti ea tšepe le sefofane sa potoloho.

Joang ho tseba hore na substrate ea PCB ea hau ke efe?

Mehleng ea sejoale-joale ea elektronike, ho fokotseha le bosesaane ba lisebelisoa tsa elektroniki ho lebisitse ho hlaheng ha li-PCB tse thata le li-PCB tse tenyetsehang/tse thata. Joale ke mofuta ofe oa thepa ea substrate e loketseng bakeng sa bona?

Keketseho ea libaka tsa ts’ebeliso ea li-PCB tse thata le li-PCB tse tenyetsehang / tse thata li tlisitse litlhoko tse ncha mabapi le bongata le ts’ebetso. Ka mohlala, lifilimi tsa polyimide li ka aroloa ka lihlopha tse fapa-fapaneng, tse kenyelletsang pepeneneng, tse tšoeu, tse ntšo le tse mosehla, tse nang le ho hanyetsa mocheso o phahameng le coefficient e tlase ea ho atolosoa ha mocheso bakeng sa kopo maemong a fapaneng. Ka mokhoa o ts’oanang, substrate ea filimi ea polyester e theko e tlaase e tla amoheloa ke ‘maraka ka lebaka la ho tsitsa ha eona ho phahameng, botsitso ba sebopeho, boleng ba holim’a filimi, ho kopanya photoelectric le ho hanyetsa tikoloho, ho finyella litlhoko tse fetohang tsa basebelisi.

Joalo ka HDI PCB e thata, PCB e tenyetsehang e tlameha ho fihlela litlhoko tsa phetisetso ea mats’oao a lebelo le phahameng le maqhubu a phahameng, ‘me ho tlameha ho lefshoa ho lahleheloa ke dielectric kamehla le tahlehelo ea dielectric ea thepa e feto-fetohang ea substrate. Potoloho e feto-fetohang e ka etsoa ka polytetrafluoroethylene le substrate e tsoetseng pele ea polyimide. Lerōle la inorganic le fiber ea carbon li ka eketsoa ho resin ea polyimide ho etsa hore ho be le karolo e meraro e feto-fetohang ea thermally conductive substrate. Thepa ea inorganic filler e kanna ea ba aluminium nitride, aluminium oxide kapa hexagonal boron nitride. Mofuta ona oa thepa ea substrate o na le mocheso oa mocheso oa 1.51W / mK, o ka hanela matla a 2.5kV le sekhahla sa likhato tse 180.