Sezvatinoziva tese, izvo zvakakosha zve PCB (yakadhindwa redunhu bhodhi) zvinoenderana nekuita kweiyo substrate zvinhu. Nokudaro, kuitira kuti uvandudze kushanda kwebhodhi redunhu, kushanda kwezvinhu zve substrate kunofanira kutanga kugadziriswa. Parizvino, zvinhu zvitsva zvakasiyana-siyana zviri kugadzirwa uye kushandiswa kuti zvizadzise zvinodiwa tekinoroji nyowani uye maitiro emusika.

Mumakore achangopfuura, mabhodhi edunhu akadhindwa akaita shanduko. Musika wacho wakanyanya kutama kubva kune zvechinyakare zvigadzirwa zvehardware zvakaita semakomputa edesktop kuenda kune waya kutaurirana semaseva uye nharembozha. Midziyo yekufambisa nhare inomiririrwa nenharembozha yakasimudzira kuvandudzwa kwepamusoro-density, kureruka-huremu uye akawanda-anoshanda maPCB. Kana pasina substrate zvinhu, uye maitiro ayo anodiwa anoenderana zvakanyanya nekuita kwePCB, yakadhindwa yedunhu tekinoroji haizomboitika. Naizvozvo, kusarudzwa kwe substrate zvinhu kunoita basa rakakosha mukupa kunaka uye kuvimbika kwePCB uye chigadzirwa chekupedzisira.

Sangana nezvinodiwa zvehupamhi hwepamusoro uye mitsetse yakanaka

• Zvinodiwa pafoiri yemhangura

Ese mabhodhi ePCB ari kufamba akananga kune yakakwira density uye akatsetseka maseketi, kunyanya HDI PCB (High Density Interconnect PCB). Makore gumi apfuura, HDI PCB yaitsanangurwa sePCB, uye upamhi hwayo hwemutsara (L) uye mutsara wemitsara (S) yaive 0.1mm kana pasi. Nekudaro, iwo azvino chiyero chiyero cheL uye S muindasitiri yemagetsi inogona kunge idiki se60 μm, uye muzviitiko zvepamberi, hunhu hwavo hunogona kunge hwakaderera se40 μm.

Maitiro ekuona yako PCB substrate zvinhu

Nzira yechinyakare yekuumbwa kwedhiyagiramu yedunhu iri mune yekufungidzira uye etching maitiro. Nekushandiswa kwematepi emhangura yefoil substrates (ine ukobvu muhupamhi hwe9μm kusvika 12μm), iyo yakaderera kukosha kweL uye S inosvika 30μm.

Nekuda kwemutengo wakakwira wefoiri yemhangura yakaonda CCL (Copper Clad Laminate) uye hurema hwakawanda mustack, vazhinji vanogadzira PCB vanowanzo shandisa etching-copper foil nzira, uye ukobvu hwemhangura hwemhangura hunoiswa ku18μm. Muchokwadi, iyi nzira haikurudzirwe nekuti ine maitiro akawandisa, ukobvu hwakaoma kudzora uye hunotungamirira kumitengo yakakwira. Somugumisiro, foil yakaonda yemhangura iri nani. Uye zvakare, kana bhodhi’s L uye S kukosha kuri pasi pe20μm, yakajairwa foil yemhangura haishande. Pakupedzisira, zvinokurudzirwa kushandisa ultra-yakaonda mhangura foil, nokuti mhangura yaro mhangura inogona kugadziriswa muhuwandu hwe3μm kusvika 5μm.

Pamusoro pehupamhi hwefoiri yemhangura, ikozvino mapeji echokwadi anodawo nzvimbo yemhangura yemhangura ine yakaderera roughness. Kuti uvandudze kugona kwekubatanidza pakati pemhangura foil uye substrate zvinhu uye kuve nechokwadi kuti peel simba re conductor, rough processing inoitwa pamhepo yemhangura foil, uye kushata kwemhangura yemhangura yakakura kupfuura 5μm.

Kumisikidza hump mhangura foil sezvo hwaro hwezvinhu hunovavarira kuvandudza kusimba kwayo peel. Zvisinei, kuitira kuti udzore hutungamiri huripo kubva pakunyanya-etching panguva yekucheka kwedunhu, zvinowanzokonzera kusvibiswa kwehump, izvo zvinogona kukonzera kupfupika kwepakati pakati pemitsara kana kuderera kwesimba rekudzivirira, izvo zvinonyanya kukanganisa matunhu akanaka. Naizvozvo, foil yemhangura ine yakaderera roughness (pasi pe3 μm kana kunyange 1.5 μm) inodiwa.

Kunyangwe kushata kwefoiri yemhangura kwakadzikira, kuchiri kudikanwa kuchengetedza simba reganda remutyairi, izvo zvinokonzeresa kurapwa kwepamusoro pamusoro pefoil yemhangura uye substrate zvinhu, izvo zvinobatsira kuve nechokwadi chekusimba kwepeel. conductor.

• Zvinodiwa zvekuisa insulating dielectric laminates

Imwe yeakanyanya tekinoroji maitiro eHDI PCB iri mune yekuvaka maitiro. Iyo inowanzo shandiswa RCC (resin yakavharwa mhangura) kana prepreg epoxy girazi jira uye mhangura foil lamination kashoma kutungamira kune yakanaka maseketi. Ikozvino yave kuda kushandisa SAP uye MSPA, zvinoreva kushandiswa kweinodzivirira dielectric firimu laminated electroless copper plating kugadzira ndege dzemhangura dzinofambisa. Nekuda kwekuti ndege yemhangura yakatetepa, masekete akanaka anogona kugadzirwa.

Imwe yeakakosha mapoinzi eSAP ndeye laminate dielectric zvinhu. Kuti zvizadzise zvinodiwa nepamusoro-density precision maseketi, zvimwe zvinodiwa zvinofanirwa kuiswa mberi kune laminate zvinhu, zvinosanganisira dielectric properties, insulation, kupisa kupisa uye bonding, pamwe nehunyanzvi kuchinjika kunoenderana neHDI PCB.

Mupasi rose semiconductor packaging, IC yekurongedza substrates inoshandurwa kubva kuceramic substrates kuita organic substrates. Iyo mitsetse yeFC package iri kuita idiki uye idiki, saka ikozvino yakajairika kukosha kweL uye S i15 μm, uye ichave idiki.

Kuitwa kwema-multi-layer substrates kunofanira kusimbisa yakaderera dielectric properties, yakaderera coefficient thermal expansion (CTE) uye yakakwirira kupisa kupisa, iyo inoreva kuderera-kudhura substrates inosangana nezvinangwa zvekushanda. Mazuva ano, MSPA insulation dielectric stacking tekinoroji inosanganiswa nefoiri yemhangura yakatetepa kuti ishandiswe mukugadzirwa kwakawanda kwemaseketi chaiwo. SAP inoshandiswa kugadzira mapatani edunhu ane ese L uye S kukosha ari pasi pegumi μm.

Iyo yakanyanya kuwanda uye kutetepa kwePCBs kwakonzera HDI PCBs kuti ishanduke kubva kulamination nemacores kuenda kumacores echero layer. Kune maHDI PCB ane basa rimwechete, nzvimbo uye ukobvu hwePCBs akabatana pane chero layer zvinoderedzwa ne25% zvichienzaniswa neaya ane core laminates. Izvo zvinodikanwa kuti uise yakatetepa dielectric layer ine zvirinani magetsi emagetsi mune maviri HDI PCBs.

Inoda kutumira kunze kubva kune yakakwira frequency uye yakanyanya kumhanya

Tekinoroji yekukurukurirana tekinoroji inotangira kubva kune waya kuenda kune isina waya, kubva yakaderera frequency uye yakaderera kumhanya kusvika yakakwirira frequency uye yakakwirira kumhanya. Kuita kwema smartphones kwakashanduka kubva ku4G kuenda ku5G, zvinoda kukurumidza kutapurirana kumhanya uye mavhoriyamu makuru ekutapurirana.

Kuuya kwepasi rose cloud computing era kwakakonzera kuwanda kwehuwandu hwehuwandu hwemashoko, uye kune maitiro akajeka e-high-frequency uye high-speed communication equipment. Kuti zvizadzise zvinotarisirwa nepamusoro-frequency uye high-speed transmission, kunze kwekuderedza kupindira kwechiratidzo uye kushandiswa, kutendeseka kwechiratidzo nekugadzirwa kunopindirana nezvinodiwa zvekugadzirwa kwePCB dhizaini, zvinhu zvepamusoro-soro ndiyo inonyanya kukosha.

Basa guru reinjiniya kudzikisa zvimiro zvekurasikirwa kwechiratidzo chemagetsi kuwedzera PCB kumhanya uye kugadzirisa matambudziko echiratidzo. Zvichienderana nePCBCart makore anopfuura gumi ekugadzira masevhisi, sechinhu chakakosha chinokanganisa kusarudzwa kwezvinhu zvepasi, kana dielectric constant (Dk) yakaderera pane 4 uye dielectric kurasikirwa (Df) yakaderera pane 0.010, inoonekwa se pakati Dk/Df laminate Kana Dk yakaderera pane 3.7 uye Df yakaderera pane 0.005, inonzi yakaderera Dk/Df laminate. Parizvino, zvakasiyana-siyana zve substrate zvinhu zviripo pamusika.

Kusvika pari zvino, kune marudzi matatu anowanzo shandiswa yakakwira-frequency circuit board substrate zvinhu: fluorine-based resins, PPO kana PPE resins uye modified epoxy resins. Fluorine yakatevedzana dielectric substrates, sePTFE, ine yakaderera dielectric zvivakwa uye inowanzo shandiswa kune zvigadzirwa zvine frequency ye5 GHz kana kupfuura. Iyo yakagadziridzwa epoxy resin FR-4 kana PPO substrate inokodzera zvigadzirwa zvine frequency renji ye1GHz kusvika 10GHz.

Tichienzanisa matatu epamusoro-frequency substrate zvinhu, epoxy resin ine mutengo wakaderera, kunyangwe fluorine resin ine mutengo wepamusoro. Panyaya ye dielectric nguva dzose, dielectric kurasikirwa, kunyura kwemvura, uye frequency maitiro, fluorine-based resins anoita zvakanyanya, nepo epoxy resins anoita zvakanyanya. Kana iyo frequency inoshandiswa nechigadzirwa ichikwira kupfuura 10GHz, chete fluorine-based resin ndiyo inoshanda. Izvo zvisingabatsiri zvePTFE zvinosanganisira kudhura kwakanyanya, kusasimba kusimba, uye yakakwirira yekuwedzera kwemafuta coefficient.

Kune PTFE, yakawanda inorganic zvinhu (senge silica) inogona kushandiswa seyekuzadza zvinhu kana girazi jira kuwedzera kuomarara kweiyo substrate zvinhu uye kuderedza coefficient yekuwedzera kwekupisa. Mukuwedzera, nekuda kwekusagadzikana kwemamolekemu ePTFE, zvakaoma kuti mamolekemu ePTFE abatane nefoiri yemhangura, saka kurapa kwakakosha kwepamusoro kunoenderana nefoiri yemhangura kunofanira kuitika. Nzira yekurapa ndeyekuita makemikari etching pamusoro pe polytetrafluoroethylene kuti iwedzere kuoma kwepamusoro kana kuwedzera firimu rinonamatira kuti riwedzere kukwanisa kwekunamatira. Nekushandiswa kweiyi nzira, iyo dielectric properties inogona kukanganiswa, uye iyo yose fluorine-based high-frequency circuit inofanira kuvandudzwa.

Yakasarudzika insulating resin inoumbwa yakagadziridzwa epoxy resin kana PPE uye TMA, MDI uye BMI, pamwe negirazi jira. Zvakafanana neFR-4 CCL, inewo yakanakisa kupisa kupisa uye dielectric properties, mechanical simba, uye PCB manufacturability, zvose izvo zvinoita kuti zvive zvakakurumbira kupfuura PTFE-based substrates.

Pamusoro pezvinoda kuitwa zvema insulating zvinhu senge resin, kushata kwemhangura senge conductor chinhu chakakosha chinokanganisa kurasikirwa kwekutapurirana kwechiratidzo, inova mhedzisiro yeganda. Chaizvoizvo, mhedzisiro yeganda ndeyekuti iyo electromagnetic induction inogadzirwa pane yakakwira-frequency chiratidzo chekufambisa uye inductive lead inova yakanyanya kusimba pakati peiyo muchinjiko-chikamu nzvimbo yekutungamira, uye kutyaira ikozvino kana chiratidzo chakanangana ne pamusoro pemutobvu. Iyo yekumusoro roughness ye conductor inoita basa rakakosha mukupesvedzera kurasikirwa kwechiratidzo chekutumira, uye kuderera kwakaderera kunotungamirira kurasikirwa kudiki.

Panguva imwecheteyo, iyo yakakwirira yepamusoro yemhangura inokonzeresa kurasikirwa kwechiratidzo. Nokudaro, kushata kwemhangura yepamusoro kunofanira kudzorwa mukugadzirwa kwechokwadi, uye inofanira kunge yakaderera sezvinobvira pasina kukanganisa kunamatira. Kutarisisa kukuru kunofanirwa kubhadharwa kune zvikwangwani mu frequency renji ye10 GHz kana kupfuura. Iko kushata kwefoiri yemhangura kunodiwa kuve isingasviki 1μm, uye zviri nani kushandisa ultra-surface copper foil ine roughness ye0.04μm. Kushata kwepamusoro kwefoiri yemhangura kunofanirwa kusanganiswa neyakakodzera oxidation kurapwa uye bonding resin system. Munguva pfupi iri kutevera, panogona kunge paine foil yemhangura isina mbiri-yakavharwa resin, iyo ine yakakwira peel simba kudzivirira kurasikirwa kwedielectric kubva pakukanganiswa.

Inoda kukwirira kwekushisa kwekushisa uye kupera kwepamusoro

Nekuvandudzwa kwemaitiro ekuita miniaturization uye kushanda kwepamusoro, zvigadzirwa zvemagetsi zvinowanzo gadzira kupisa kwakawanda, saka izvo zvinodikanwa zvekutonga zvemagetsi zvemagetsi zviri kuramba zvichiwedzera kudiwa. Imwe yemhinduro kudambudziko iri iri mukutsvagisa nekuvandudzwa kwePCBs dzinopisa. Mamiriro ezvinhu ekutanga ePCB kuti aite zvakanaka maererano nekudzivirira kupisa uye kuparara ndiko kupikisa kupisa uye kukwanisa kubvisa kwe substrate. Ikozvino kuvandudzwa mukupisa kwePCB kuri mukuvandudzwa kweresin uye kuwedzera kwekuzadza, asi inongoshanda muchikamu chidiki. Iyo yakajairika nzira ndeye kushandisa IMS kana simbi yepakati PCB, iyo inoshanda sezvinhu zvekudziya. Kuenzaniswa nemaradiator echinyakare uye mafeni, iyi nzira ine zvakanakira saizi diki uye mutengo wakaderera.

Aluminium chinhu chinoyevedza chine zvakanakira zviwanikwa zvakawanda, mutengo wakaderera uye yakanaka yekupisa conductivity. Uye kusimba. Uye zvakare, ishamwari yezvakatipoteredza zvekuti inoshandiswa nevakawanda simbi substrates kana simbi cores. Nekuda kwezvakanaka zvehupfumi, yakavimbika yekubatanidza magetsi, kupisa kwemafuta uye simba rakawanda, solder-isina uye lead-isina, aluminium-based circuit board yakashandiswa muzvigadzirwa zvevatengi, mota, zvekushandisa zvehondo uye zvigadzirwa zvemuchadenga. Hapana mubvunzo kuti kiyi yekupikisa kupisa uye kupera kwekuita kwesimbi substrate iri mukunamatira pakati pendiro yesimbi uye ndege yedunhu.

Nzira yekuziva sei substrate zvinhu zvePCB yako?

Muzera remazuva ano remagetsi, kuonda uye kutetepa kwemidziyo yemagetsi kwakonzera kubuda kwemaPCB akaomarara uye anochinjika/akaoma maPCB. Saka ndeipi mhando ye substrate material yakakodzera kwavari?

Yakawedzera nzvimbo dzekushandisa dzePCB dzakaomarara uye anochinjika/akaomarara maPCB akaunza zvitsva zvinodiwa maererano nehuwandu uye kuita. Semuenzaniso, mafirimu epolyimide anogona kuiswa muzvikamu zvakasiyana-siyana, kusanganisira pachena, chena, dema uye yero, ine kupisa kwakanyanya kupikisa uye yakaderera coefficient yekuwedzera kwekupisa kwekushandiswa mumamiriro akasiyana. Saizvozvo, iyo inodhura-inoshanda polyester firimu substrate ichagamuchirwa nemusika nekuda kweiyo yakakwira elasticity, dimensional kugadzikana, firimu repamusoro mhando, photoelectric coupling uye kuramba kwezvakatipoteredza, kusangana nekuchinja kwezvinodiwa nevashandisi.

Zvakafanana neyakaomarara HDI PCB, inochinjika PCB inofanirwa kusangana nezvinodiwa zvekumhanya-mhanya uye yakakwirira-frequency chiratidzo chekufambisa, uye kutarisisa kunofanirwa kubhadharwa kune dielectric inogara uye dielectric kurasikirwa kweinochinjika substrate zvinhu. Iyo inoshanduka yedunhu inogona kuumbwa ne polytetrafluoroethylene uye yepamusoro polyimide substrate. Inorganic guruva uye kabhoni fiber inogona kuwedzerwa kune polyimide resin kuti iite matatu-layer inochinjika thermally conductive substrate. Iyo inorganic filler zvinhu inogona kunge iri aluminium nitride, aluminium oxide kana hexagonal boron nitride. Mhando iyi ye substrate material ine thermal conductivity ye1.51W/mK, inogona kuramba voltage ye2.5kV uye curvature ye180 degrees.