Njengoko sonke siyazi, iimpawu ezisisiseko ze PCB (ibhodi yesekethe eprintiweyo) ixhomekeke ekusebenzeni kwezinto zayo ze-substrate. Ngoko ke, ukwenzela ukuba kuphuculwe ukusebenza kwebhodi yesekethe, ukusebenza kwezinto ze-substrate kufuneka kuqala kulungiswe. Ukuza kuthi ga ngoku, izixhobo ezitsha ezahlukeneyo ziyaphuhliswa kwaye zisetyenziselwa ukuhlangabezana neemfuno zetekhnoloji entsha kunye neendlela zentengiso.

Kwiminyaka yakutshanje, iibhodi zesekethe eziprintiweyo ziye zatshintsha. Imakethi itshintshile kakhulu kwiimveliso zehardware zemveli ezifana neekhompyuter zedesktop ukuya kunxibelelwano olungenazingcingo olufana neeseva kunye neeterminal eziphathwayo. Izixhobo zonxibelelwano eziphathwayo ezimelwe zii-smart phones ziye zakhuthaza uphuhliso lwe-PCBs ezinoxinano oluphezulu, ubunzima obulula kunye ne-multi-functional. Ukuba akukho zixhobo ze-substrate, kunye neemfuno zayo zenkqubo zihambelana ngokusondeleyo nokusebenza kwe-PCB, iteknoloji yesekethe eprintiweyo ayinakuze ifezekiswe. Ngoko ke, ukukhethwa kwezinto ze-substrate kudlala indima ebalulekileyo ekuboneleleni umgangatho kunye nokuthembeka kwe-PCB kunye nemveliso yokugqibela.

Ukuhlangabezana neemfuno zokuxinana okuphezulu kunye nemigca emihle

•Iimfuneko zefoyile yobhedu

Zonke iibhodi ze-PCB zisiya kuxinaniso oluphezulu kunye neesekethe ezicolekileyo, ngakumbi i-HDI PCB (i-High Density Interconnect PCB). Kwiminyaka elishumi edlulileyo, i-HDI PCB yayichazwa njenge-PCB, kwaye ububanzi bayo bomgca (L) kunye nesithuba somgca (S) sasiyi-0.1mm okanye ngaphantsi. Nangona kunjalo, amaxabiso akhoyo ngoku we-L kunye no-S kwishishini le-elektroniki anokuba mncinci njenge-60 μm, kwaye kwiimeko ezihambele phambili, amaxabiso abo anokuba ngaphantsi kwe-40 μm.

Uyifumanisa njani imathiriyeli ye-PCB substrate yakho

Indlela yendabuko yokubunjwa komzobo wesiphaluka kumfanekiso kunye nenkqubo yokubhala. Ngokusetyenziswa kwe-substrates ye-foil yobhedu encinci (enobunzima kuluhlu lwe-9μm ukuya kwi-12μm), ixabiso eliphantsi kakhulu le-L kunye ne-S lifikelela kwi-30μm.

Ngenxa yeendleko eziphezulu zefoyile yobhedu ebhityileyo ye-CCL (i-Copper Clad Laminate) kunye neziphene ezininzi kwi-stack, abaninzi abavelisi be-PCB bavame ukusebenzisa indlela ye-etching-copper foil, kwaye ubukhulu be-foil yobhedu bubekwe kwi-18μm. Enyanisweni, le ndlela ayikhuthazwa kuba iqulethe iinkqubo ezininzi, ubunzima bunzima ukulawula kwaye bukhokelela kwiindleko eziphezulu. Ngenxa yoko, i-foil yobhedu encinci ingcono. Ukongeza, xa ixabiso lebhodi L kunye ne-S lingaphantsi kwe-20μm, i-foil yobhedu eqhelekileyo ayisebenzi. Ekugqibeleni, kucetyiswa ukuba usebenzise i-ultra-thin copper foil, kuba ubukhulu bayo bethusi bunokulungelelaniswa kuluhlu lwe-3μm ukuya kwi-5μm.

Ukongeza kubunzima befoyile yobhedu, iisekethe ezichanekileyo zangoku zifuna umphezulu wefoyile yethusi enoburhabaxa obuphantsi. Ukuze kuphuculwe ikhono lokudibanisa phakathi kwe-foil yobhedu kunye ne-substrate yezinto kunye nokuqinisekisa amandla e-peel yomqhubi, ukucubungula ngokukrakra kwenziwa kwi-plane ye-copper foil, kunye nobukhulu obuqhelekileyo be-foil yobhedu bukhulu kune-5μm.

Ukufakela i-hump copper foil njengoko izinto ezisisiseko zijolise ekuphuculeni amandla ayo e-peel. Nangona kunjalo, ukuze kulawulwe ukuchaneka okukhokelayo kude nokugqithisa kakhulu ngexesha le-circuit etching, ithambekele ekubangeleni ukungcola kwe-hump, okunokubangela isiphaluka esifutshane phakathi kwemigca okanye ukuncipha komthamo wokugquma, ochaphazela ngokukodwa imijikelezo emihle. Ngoko ke, i-foil yobhedu ene-roughness ephantsi (ngaphantsi kwe-3 μm okanye i-1.5 μm) iyafuneka.

Nangona uburhabaxa befoyile yobhedu buncitshisiwe, kuseyimfuneko ukuba kugcinwe amandla e-peel e-conductor, nto leyo ebangela ukuba kubekho unyango olukhethekileyo kumphezulu wefoyile yobhedu kunye ne-substrate, enceda ekuqinisekiseni amandla e-peel. umqhubi.

• Iimfuno zokugquma iilaminethi zedielectric

Enye yeempawu eziphambili zobugcisa ze-HDI PCB ilele kwinkqubo yokwakha. I-RCC esetyenziswa ngokuqhelekileyo (i-resin eqatywe ubhedu) okanye ilaphu leglasi e-prepreg epoxy kunye ne-copper foil lamination ayifane ikhokelele kwiisekethe ezintle. Ngoku ithambekele ekusebenziseni i-SAP kunye ne-MSPA, oku kuthetha ukusetyenziswa kwefilimu ye-dielectric yokugquma i-laminated electroless copper plating ukuvelisa iinqwelomoya zobhedu. Ngenxa yokuba inqwelomoya yobhedu incinci, iisekethe ezintle zinokuveliswa.

Enye yezona zinto zibalulekileyo ze-SAP kukuhlamba izinto ze-dielectric. Ukuze kuhlangatyezwane neemfuno zeesekethe zokuchaneka koxinaniso oluphezulu, ezinye iimfuno kufuneka zibekwe phambili kwizixhobo ze-laminate, kubandakanywa iipropati ze-dielectric, ukugquma, ukumelana nobushushu kunye nokudibanisa, kunye nokuguquguquka kobugcisa obuhambelana ne-HDI PCB.

Kwipakethe ye-semiconductor yehlabathi, ii-substrates zokupakisha ze-IC ziguqulwa ukusuka kwi-ceramic substrates ukuya kwi-organic substrates. I-pitch ye-substrates yephakheji ye-FC iya iba yincinci kwaye incinci, ngoko ixabiso eliqhelekileyo langoku le-L kunye ne-S yi-15 μm, kwaye iya kuba ncinane.

Ukusebenza kwee-substrates ze-multi-layer kufuneka kugxininise iipropati eziphantsi ze-dielectric, i-coefficient ephantsi yokwandiswa kwe-thermal (CTE) kunye nokumelana nokushisa okuphezulu, okubhekiselele kwii-substrates eziphantsi kweendleko ezihlangabezana neethagethi zokusebenza. Kule mihla, itekhnoloji ye-MSPA yokupakisha itekhnoloji yokupakisha idielectric idityaniswe nefoyile yobhedu ebhityileyo eza kusetyenziswa kwimveliso yobuninzi beesekethe ezichanekileyo. I-SAP isetyenziselwa ukwenza iipateni zesekethe ngazo zombini ixabiso le-L kunye ne-S ngaphantsi kwe-10 μm.

Ukuxinana okuphezulu kunye nokubhitya kwe-PCBs kubangele ii-HDI PCBs ukuba zitshintshe ukusuka kwi-lamination kunye ne-cores ukuya kwi-cores yalo naluphi na umaleko. Kwii-PCB ze-HDI ezinomsebenzi ofanayo, indawo kunye nobukhulu bee-PCB ezidityanisiweyo kuwo nawuphi na umaleko zincitshiswa ngama-25% xa kuthelekiswa nezo zinee-laminates ezingundoqo. Kuyimfuneko ukusebenzisa umaleko obhityileyo we-dielectric oneempawu ezingcono zombane kwezi PCB zimbini ze-HDI.

Ifuna ukuthunyelwa ngaphandle ukusuka kwifrikhwensi ephezulu kunye nesantya esiphezulu

Itekhnoloji yonxibelelwano lwe-elektroniki iqala ukusuka kwingcingo ukuya kwi-wireless, ukusuka kwi-frequency ephantsi kunye nesantya esisezantsi ukuya kwisantya esiphezulu kunye nesantya esiphezulu. Ukusebenza kwee-smartphones kuye kwavela kwi-4G ukuya kwi-5G, efuna isantya sokuhambisa ngokukhawuleza kunye nomthamo omkhulu wokuhambisa.

Ukufika kwexesha le-computing yefu lehlabathi liye lakhokelela ekunyukeni okuphindaphindiweyo kwi-traffic data, kwaye kukho umzila ocacileyo wezixhobo zokunxibelelana eziphezulu kunye nesantya esiphezulu. Ukuze kuhlangatyezwane neemfuno ze-high-frequency kunye ne-high-speed transmission, ngaphezu kokunciphisa ukuphazamiseka kwesignali kunye nokusetyenziswa, ukunyaniseka komqondiso kunye nokuveliswa kuyahambelana neemfuno zoyilo loyilo lwe-PCB, izinto zokusebenza eziphezulu ziyinto ebaluleke kakhulu.

Umsebenzi ophambili wobunjineli kukunciphisa iipropathi zokulahleka komqondiso wombane ukwandisa isantya sePCB nokusombulula iingxaki zesiginali yemfezeko. Ngokusekwe kwi-PCBCart iminyaka engaphezu kweshumi yeenkonzo zokuvelisa, njengeyona nto iphambili echaphazela ukhetho lwemathiriyeli ye-substrate, xa i-dielectric constant (Dk) ingaphantsi kwe-4 kunye nelahleko ye-dielectric (Df) ingaphantsi kwe-0.010, ithathwa njenge-dielectric constant (Dk) i-intermediate Dk/Df laminate Xa Dk iphantsi kune-3.7 kwaye i-Df iphantsi kune-0.005, ithathwa njenge-Df / Df laminate ephantsi. Okwangoku, izinto ezahlukeneyo ze-substrate ziyafumaneka kwimarike.

Ukuza kuthi ga ngoku, zininzi iintlobo ezintathu zezinto ezisetyenziswa ngokuqhelekileyo kwibhodi yesekethe ye-substrate: i-fluorine-based resins, i-PPO okanye i-PPE resins kunye ne-epoxy resins. I-fluorine series dielectric substrates, ezifana ne-PTFE, zineepropati zedielectric ezisezantsi kwaye zidla ngokusetyenziselwa iimveliso ezinobuxhakaxhaka be-5 GHz okanye ngaphezulu. I-epoxy resin eguquliweyo i-FR-4 okanye i-PPO substrate ifanelekile kwiimveliso ezinoluhlu lwe-frequency ye-1GHz ukuya kwi-10GHz.

Ukuthelekisa izinto ezintathu ze-substrate ephezulu, i-epoxy resin inexabiso eliphantsi, nangona i-fluorine resin inexabiso eliphezulu. Ngokubhekiselele kwi-dielectric constant, ilahleko ye-dielectric, ukufunxwa kwamanzi, kunye neempawu ze-frequency, i-fluorine-based resins yenza kakuhle, ngelixa ii-epoxy resins zenza kakubi. Xa i-frequency esetyenziswa yimveliso ingaphezulu kwe-10GHz, yintlaka esekwe ngefluorine kuphela eya kusebenza. Izinto ezingeloncedo ze-PTFE ziquka iindleko eziphezulu, ubungqongqo obuhlwempuzekileyo, kunye ne-coefficient yokwandisa i-thermal.

Kwi-PTFE, izinto ezininzi ezingaphiliyo (ezifana ne-silica) zinokusetyenziswa njengezinto zokuzalisa okanye ilaphu leglasi ukunyusa ukuqina kwe-substrate kunye nokunciphisa i-coefficient yokwandiswa kwe-thermal. Ukongeza, ngenxa yokungangeni kweemolekyuli ze-PTFE, kunzima ukuba iimolekyuli ze-PTFE zidibanise ne-foil yobhedu, ngoko ke unyango olukhethekileyo lomphezulu oluhambelana nephepha lobhedu kufuneka luphunyezwe. Indlela yonyango kukwenza i-chemical etching phezu kwe-polytetrafluoroethylene ukwandisa uburhabaxa bomphezulu okanye ukongeza ifilimu enamathelayo ukunyusa ukukwazi ukunamathela. Ngokusetyenziswa kwale ndlela, iipropati ze-dielectric zinokuchaphazeleka, kwaye yonke i-fluorine-based high-frequency circuit kufuneka iphuhliswe ngakumbi.

I-resin ekhuselayo ekhethekileyo eyenziwe nge-epoxy resin elungisiweyo okanye i-PPE kunye ne-TMA, i-MDI kunye ne-BMI, kunye nelaphu leglasi. Ngokufana ne-FR-4 CCL, ikwanayo nokumelana nobushushu obugqwesileyo kunye neempawu ze-dielectric, amandla omatshini, kunye nokwenziwa kwe-PCB, konke oku kuyenza idume ngakumbi kune-PTFE-based substrates.

Ukongeza kwiimfuno zokusebenza kwezinto ezikhuselayo ezifana ne-resin, uburhabaxa bobhedu njengomqhubi nayo yinto ebalulekileyo echaphazela ukulahleka kokuhanjiswa kwesignali, okusisiphumo sempembelelo yesikhumba. Ngokusisiseko, isiphumo solusu sesokuba i-electromagnetic induction yenziwe kwi-high-frequency signal transmission kunye ne-inductive lead igxile kakhulu kumbindi wecandelo elinqamlezayo lokukhokela, kwaye umsinga wokuqhuba okanye umqondiso ugxile kwi umphezulu welothe. Uburhabaxa bomphezulu be-conductor budlala indima ephambili ekuphembeleleni ilahleko yesiginali yothumelo, kwaye uburhabaxa obuphantsi bukhokelela kwilahleko encinci kakhulu.

Ngexesha elifanayo, uburhabaxa obuphezulu bobhedu buya kubangela ukulahleka komqondiso ophezulu. Ngoko ke, ukuqina kobhedu komhlaba kufuneka kulawulwe kwimveliso yangempela, kwaye kufuneka ibe phantsi kangangoko ngaphandle kokuchaphazela ukunamathela. Ingqalelo enkulu kufuneka ihlawulwe kwiimpawu kuluhlu lwamaza e-10 GHz okanye ngaphezulu. Uburhabaxa befoyile yobhedu bufuneka ukuba bube ngaphantsi kwe-1μm, kwaye kungcono ukusebenzisa i-ultra-surface copper foil kunye ne-roughness ye-0.04μm. Ubunzima bomphezulu we-foil yobhedu kufuneka zidibaniswe kunye nonyango olufanelekileyo lwe-oxidation kunye ne-bonding resin system. Kwixesha elizayo elingekude, kunokubakho i-foil yobhedu engenazo iprofayili efakwe i-resin, enegunya eliphezulu le-peel ukukhusela ilahleko ye-dielectric ukuba ingachaphazeleki.

Ifuna ukuxhathisa okuphezulu kwe-thermal kunye nokuchithwa okuphezulu

Ngomkhwa wophuhliso lwe-miniaturization kunye nokusebenza okuphezulu, izixhobo zombane zivame ukuvelisa ubushushu obuninzi, ngoko ke iimfuno zolawulo lwe-thermal yezixhobo ze-elektroniki ziya ziba nzima ngakumbi. Esinye sezisombululo kule ngxaki sikuphando kunye nophuhliso lwe-PCBs ze-thermal conductive. Imeko esisiseko yokuba i-PCB isebenze kakuhle malunga nokumelana nobushushu kunye nokuchithwa kukuxhathisa ubushushu kunye nokukwazi ukuchithwa kwe-substrate. Uphuculo lwangoku kwi-thermal conductivity ye-PCB ilele ekuphuculweni kwe-resin kunye nokuzalisa ukongezwa, kodwa isebenza kuphela kudidi olulinganiselweyo. Indlela eqhelekileyo kukusebenzisa i-IMS okanye i-metal core PCB, esebenza njengezinto zokufudumeza. Xa kuthelekiswa neeradiyetha zendabuko kunye nabalandeli, le ndlela ineenzuzo zobukhulu obuncinci kunye neendleko eziphantsi.

I-aluminium yinto ekhangayo kakhulu kunye neenzuzo zemithombo eninzi, ixabiso eliphantsi kunye ne-thermal conductivity. Nokuqina. Ukongezelela, ihambelana nokusingqongileyo kangangokuba isetyenziswe ngamacandelo amaninzi esinyithi okanye i-metal cores. Ngenxa yeenzuzo zoqoqosho, uxhulumaniso lombane oluthembekileyo, i-thermal conductivity kunye namandla aphezulu, i-solder-free kunye ne-lead-free, iibhodi zeesekethe ezisekelwe kwi-aluminium zisetyenziswe kwiimveliso zabathengi, iimoto, izixhobo zomkhosi kunye neemveliso ze-aerospace. Akungabazeki ukuba isitshixo sokumelana nobushushu kunye nokusebenza kokuchithwa kwe-substrate yensimbi ilele ekunamatheleni phakathi kwepleyiti yesinyithi kunye nendiza yesiphaluka.

Indlela yokumisela imathiriyeli engaphantsi kwiPCB yakho?

Kwixesha langoku le-elektroniki, ukwenziwa kweminiaturization kunye nokubhitya kwezixhobo zombane kukhokelele ekuveleni kweePCB eziqinileyo kunye neePCB ezibhetyebhetye/ezomeleleyo. Ngoko ke, luhlobo luni lwe-substrate olufanelekileyo kubo?

Ukwandiswa kweendawo zokusetyenziswa kwee-PCB eziqinileyo kunye nee-PCB eziguquguqukayo / eziqinileyo ziye zazisa iimfuno ezintsha ngokubhekiselele kubuninzi kunye nokusebenza. Ngokomzekelo, iifilimu ze-polyimide zinokuhlelwa kwiindidi ezahlukahlukeneyo, kubandakanywa okucacileyo, okumhlophe, okumnyama kunye nophuzi, kunye nokumelana nokushisa okuphezulu kunye ne-coefficient ephantsi yokwandiswa kwe-thermal kwisicelo kwiimeko ezahlukeneyo. Ngokufanayo, i-substrate yefilimu ye-polyester enexabiso eliphantsi iya kwamkelwa yimarike ngenxa yokuqina kwayo okuphezulu, ukuzinza kwe-dimensional, umgangatho wefilimu, ukudibanisa i-photoelectric kunye nokumelana nokusingqongileyo, ukuhlangabezana neemfuno eziguqukayo zabasebenzisi.

Ngokufana ne-HDI PCB eqinile, i-PCB eguquguqukayo kufuneka ihlangabezane neemfuno zokudluliselwa kwesignali yesantya esiphezulu kunye ne-high-frequency, kwaye ingqalelo kufuneka ihlawulwe kwi-dielectric rhoqo kunye nelahleko ye-dielectric yezinto eziguquguqukayo ze-substrate. Isekethe eguquguqukayo inokuqulunqwa nge-polytetrafluoroethylene kunye ne-polyimide substrate ephezulu. Uthuli lwe-inorganic kunye ne-carbon fiber inokongezwa kwi-polyimide resin ukuze kubangele i-three-layer flexible conductive substrate. Imathiriyeli ye-inorganic filler inokuba yi-aluminiyam nitride, i-aluminiyam oxide okanye i-hexagonal boron nitride. Olu hlobo lwe-substrate lune-conductivity ye-thermal ye-1.51W / mK, inokumelana nombane we-2.5kV kunye ne-curvature ye-180 degrees.