A surface jiyya matakai na Kwamitin PCB

1. Bare copper plate

Ab advantagesbuwan amfãni da rashin amfani a bayyane suke:

Abvantbuwan amfãni: low cost, m surface, mai kyau waldi (idan babu hadawan abu da iskar shaka).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; Ba za a iya amfani da shi akan bangarori biyu ba saboda ana kashe oxide na biyu bayan walƙiya ta farko. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

Tsarkin jan ƙarfe yana da sauƙin oxidized idan an fallasa shi cikin iska kuma dole ne ya sami murfin kariya na sama. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. Don haka kuna buƙatar babban yanki na zinare na zinare akan allon da’irar, wato na ɗauke ku don fahimtar tsarin gwal.

Biyu, farantin zinariya

Zinariya ita ce ainihin zinariya. Ko da murfin murfin bakin ciki yana kusan kusan 10% na farashin allon kewaye. A Shenzhen, akwai ‘yan kasuwa da yawa da suka kware kan siyan allunan kewaye, ta wasu hanyoyin wanke gwal, samun kudin shiga ne mai kyau. Amfani da zinare a matsayin rufi, ɗayan shine don sauƙaƙe walda, ɗayan shine don hana lalata. Ko da sun yi

Yatsun zinariya na ƙimar ƙwaƙwalwar ajiyar shekaru da yawa har yanzu suna ƙyalƙyali kamar yadda suke yi lokacin da aka yi su da jan ƙarfe, aluminium da baƙin ƙarfe, waɗanda a yanzu suka yi tsatsa zuwa tarin tarkace.

An yi amfani da farantin zinaren zinari a cikin sassan fakitin allon kewaye, yatsun zinare, shrapnel mai haɗawa da sauran matsayi. Idan kun ga cewa hukumar da’irar azurfa ce, wannan bai kamata a ce ba, kai tsaye kira layin haƙƙin mabukaci, tabbas shine masana’anta da aka gina jerry, bai yi amfani da kayan aiki da kyau ba, tare da sauran karafa suna yaudarar abokan ciniki. Muna amfani da madaidaicin allon wayar tafi da gidanka mafi yawa farantin zinare, farantin zinaren da aka nutse, motherboard na kwamfuta, sauti da ƙaramin allon kewaye na dijital gaba ɗaya ba farantin zinare bane.

Fa’idodi da rashin amfanin tsarin nutsewar zinare ba shi da wahalar zuwa:

Abvantbuwan amfãni: ba mai sauƙin oxidize ba, ana iya adana shi na dogon lokaci, farfajiyar tana da santsi, ta dace don walda ƙananan ramukan gibi da aka gyara tare da ƙananan haɗin gwiwa. Kwamitin PCB da aka fi so tare da maɓalli (misali allon wayar hannu). Reflow soldering za a iya maimaita sau da yawa ba tare da yawa asarar solderability. Ana iya amfani dashi azaman kayan tushe don kebul na COB (Chip On Board).

Disadvantages: tsada mai tsada, ƙarfin walda mara kyau, saboda amfani da tsarin yin nickel, mai sauƙin samun matsalolin farantin baki. Layer na nickel yana yin oxidation akan lokaci, kuma dogaro na dogon lokaci batu ne.

Yanzu mun san cewa zinare zinari ne kuma azurfa azurfa ne? Ko shakka babu. Tin.

Uku, fesa tin kewaye allon

Ana kiran faranti na azurfa faranti na tinjet. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Long-term use easy oxidation corrosion, resulting in poor contact. Ainihin ana amfani dashi azaman ƙaramar hukumar kewaya samfurin dijital, ba tare da banbanci shine allon tinjet, dalilin yana da arha.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Disadvantages: Ba dace da soldering bakin ciki rata fil da kuma kananan aka gyara, saboda matalauta surface flatness na tinjet farantin. A cikin sarrafa PCB, yana da sauƙi don samar da dutsen dutsen mai siyarwa kuma yana haifar da gajeriyar madaidaiciya don abubuwan da aka gyara. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Tun da farko, mun yi magana game da mafi arha haske ja da’irar allon, mai hakar ma’adinai thermoelectric rabuwa jan ƙarfe substrate

Hudu, hukumar aiwatar da OSP

Fim ɗin taimakon walda na halitta. Domin yana da kwayoyin halitta, ba ƙarfe ba, yana da arha fiye da fesa tin.

Abvantbuwan amfãni: Tare da duk fa’idodin waldi na jan ƙarfe, ba za a iya sake tace allon ba.

Hasara: Mai saukin kamuwa da acid da zafi. Game da walda na reflow na biyu, lokacin da ake buƙata don kammala walda na reflow na biyu yawanci talauci ne. Idan an adana fiye da watanni uku, dole ne a sake farfado da shi. Yi amfani cikin sa’o’i 24 bayan buɗe kunshin. OSP Layer ne mai ruɓewa, don haka dole ne a buga wurin gwajin tare da manna mai siyarwa don cire asalin OSP ɗin don tuntuɓi wurin allura don gwajin lantarki.

Babban aikin wannan fim ɗin shine don tabbatar da cewa murfin jan ƙarfe na ciki baya yin oxidation kafin walda. Fim ɗin yana ƙafewa da zaran ya yi zafi lokacin walda. Ana iya amfani da solder don haɗa wayoyin jan ƙarfe zuwa abubuwan da aka gyara.

Amma ba mai juriya ba ne. Kwamitin kewaye na OSP, wanda aka fallasa ga iska sama da kwanaki goma, ba zai iya haɗa abubuwan haɗin ba.

Yawancin motherboards na kwamfuta suna amfani da fasahar OSP. Saboda hukumar da’irar tana da girma sosai don ba za a iya sanya fa’idar zinare ba.