Izinqubo zokwelashwa ebusweni ze PCB ibhodi

1. Bare copper plate

Ubuhle nobubi busobala:

Izinzuzo: izindleko eziphansi, indawo ebushelelezi, i-weldability enhle (ngokungabikho kwe-oxidation).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; Ayikwazi ukusetshenziswa kumapaneli aphindwe kabili ngoba uhlangothi lwesibili lufakwe i-oxidized ngemuva kwe-welding yokuqala yokufaka kabusha. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

Ithusi elimsulwa line-oxidized kalula uma livezwe emoyeni futhi kufanele libe nokumboza okungenhla okuvikelayo. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. Ngakho-ke udinga indawo enkulu yokufakwa kwegolide ebhodini lesifunda, okungukuthi, ngikuthathele ukuthi uqonde inqubo yegolide.

Amabili, ipuleti legolide

Igolide yilona golide langempela. Ngisho nokumbozwa okuncane kulandisa cishe i-10% yezindleko zebhodi lesifunda. E-Shenzhen, kunabathengisi abaningi abagxile ekutholakaleni kwamabhodi wesekethe ezilahliwe, ngezindlela ezithile zokugeza igolide, kuyinzuzo enhle. Ukusetshenziswa kwegolide njengokumboza, enye ukwenza kube lula ukushisela, enye ukuvimbela ukubola. Noma ngabe bakwenzile

Iminwe yegolide yeminyaka eminingana yememori inamathela isacwebezela njengoba yenza ngenkathi yenziwa ngethusi, i-aluminium kanye nensimbi, manje esigqwala izinqwaba zemfucumfucu.

Isendlalelo esenziwe ngegolide sisetshenziswa kabanzi ezingxenyeni zamapayipi webhodi lesifunda, iminwe yegolide, isixhumi se-shrapnel nezinye izikhundla. Uma uthola ukuthi ibhodi lesifunda empeleni liyisiliva, akudingeki ukuthi usho, ngqo ushayele ucingo lwamalungelo abathengi, ngokuqinisekile umkhiqizi owakhelwe i-jerry, akazange azisebenzise kahle izinto, nezinye izinsimbi zikhohlisa amakhasimende. Sisebenzisa ibhodi le-mama lebhodi lomakhalekhukhwini elibanzi kakhulu ikakhulukazi ipuleti legolide, ipuleti legolide elishonile, i-motherboard yekhompyutha, umsindo namabhodi wesifunda amancane edijithali ngokuvamile akuyona ipuleti legolide.

Ubuhle nobubi benqubo yokucwila kwegolide akunzima ukuza ku:

Izinzuzo: akulula ukufaka i-oxidize, kungagcinwa isikhathi eside, indawo ibushelelezi, ilungele ukushisela izikhonkwane ezincane ze-gap nezakhi ezinamalunga amancane we-solder. Ibhodi ye-PCB ekhethwe ngokhiye (isib. Ibhodi leselula). Ukugcwalisa kabusha kwe-Reflow kungaphindwa kaningi ngaphandle kokulahleka okuningi kokuthengiswa. Ingasetshenziswa njengezinto eziyisisekelo ze-COB (Chip On Board) cabling.

Okubi: izindleko eziphezulu, amandla we-welding ampofu, ngenxa yokusetshenziswa kwenqubo yokugcwala i-nickel, kulula ukuba nezinkinga zamapuleti amnyama. Isendlalelo se-nickel sidala isikhathi ngokuhamba kwesikhathi, futhi ukuthembeka kwesikhathi eside kuyinkinga.

Manje siyazi yini ukuthi igolide liyigolide nesiliva liyisiliva? Vele akunjalo. Tin.

Okwesithathu, ibhodi lesifunda lesifuthizi

Amapuleti esiliva abizwa ngokuthi amapuleti e-tinjet. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Long-term use easy oxidation corrosion, resulting in poor contact. Isetshenziswa ngokuyisisekelo njengebhodi lesifunda lomkhiqizo omncane wedijithali, ngaphandle kwebhodi le-tinjet, isizathu sishibhile.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Okubi: Akufanelekile ukukhonkotha izikhonkwane ezincane zegebe nezakhi ezincane kakhulu, ngenxa yobuso obumpofu beplate le-tinjet. Ekucutshungweni kwe-PCB, kulula ukukhiqiza ubuhlalu be-solder futhi kubangele isifunda esifushane sezingxenye ezinhle ze-pitch. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Phambilini, sikhulume ngebhodi lesifunda elibomvu elishibhile, isibani somvukuzi esihlukanisa umoya ithusi

Okwesine, ibhodi yenqubo ye-OSP

Ifilimu losizo lwe-Organic welding. Ngoba i-organic, hhayi insimbi, ishibhile kunokufafaza i-tin.

Izinzuzo: Ngazo zonke izinzuzo zokushisela ngethusi okungenalutho, amabhodi aphelelwe yisikhathi nawo angavuselelwa.

Okungalungile: Kutholakala i-asidi nomswakama. Endabeni ye-welding yesibili yokufaka kabusha, isikhathi esidingekayo ukuqedela i-welding yesibili evulekile ngokuvamile ayihle. Uma igcinwe izinyanga ezingaphezu kwezintathu, kufanele ivuselelwe. Sebenzisa kuze kuphele amahora angama-24 ngemuva kokuvula iphakheji. I-OSP iyisendlalelo esivikela, ngakho-ke iphoyinti lokuhlola kufanele liphrintwe ngokunamathisela kwe-solder ukuze kususwe ungqimba wokuqala we-OSP ukuxhumana nephoyinti lokuhlolwa kukagesi.

Umsebenzi wodwa wale filimu ephilayo ukuqinisekisa ukuthi ucwecwe lwangaphakathi lwethusi alunaki ngaphambi kokushisela. Ifilimu iyahwamuka ngokushesha nje lapho ifudunyezwa ngesikhathi sokushisela. I-Solder ingasetshenziselwa ukushisela izintambo zethusi ezingxenyeni.

Kepha ayimelani nokugqwala. Ibhodi lesifunda le-OSP, elivezwe emoyeni izinsuku ezingaphezu kweziyishumi, alikwazi ukuhlanganisa izinto.

Amabhodi we-computer amaningi asebenzisa ubuchwepheshe be-OSP. Ngoba ibhodi lesifunda likhulu kakhulu ukuthi linganikela ngokufakwa kwegolide.