O le togafitiga luga togafitiga o Laupapa PCB

1. Bare copper plate

O mea lelei ma le lelei e mautinoa lava:

Lelei: maualalo tau, lamolemole luga, lelei weldability (i le leai o oxidation).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; E le mafai ona faʻaaogaina luga o panels faʻalua ona o le itu lona lua ua oxidized ina ua maeʻa le muamua uila faʻaopoopo. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

E faigofie ona faʻamamaina le ‘apamemea mamā peʻa faʻaalia i le ea ma e tatau ona i ai le ufiufi e puipuia luga. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. Ma oe manaʻomia se tele vaega o auro plating luga o le matagaluega laupapa, o lona uiga, na ou aveina oe e malamalama i le auro gaioiga.

Lua, ipu auro

Auro o le auro moni. E oʻo lava i se manifinifi e ufiufi tala mo le toeititi 10% o le tau o le matagaluega laupapa. I Shenzhen, o loʻo i ai le tele o faʻatau faʻapitoa i le mauaina o pepa faʻasolo laupapa, e ala i nisi auala e fufulu ese ai le auro, o se lelei maua. O le faʻaaogaina o le auro o se ufiufi, o le tasi e faʻafaigofieina faʻau, o le isi e puipuia ai le pala. Tusa lava pe na latou faia

O tamatamailima auro o ni nai tausaga taua le manatuaina o fasilaau o loo iila pea pei ona latou faia i taimi na faia ai i le kopa, alumini ma uʻamea, lea ua elea nei i faaputuga lapisi.

O le auro plated vaega e lautele faʻaaogaina i vaega o le matagaluega laupapa pads, auro tamatamailima, fesoʻotaʻiga shrapnel ma isi tulaga. Afai e te iloa o le matagaluega laupapa o le siliva, e le manaʻomia ona faʻapea, valaʻau saʻo i le tagata faʻatau aia tatau, e mautinoa lava o le gaosi oloa jerry-fausia, na le faʻaaoga lelei mea, faʻatasi ai ma isi metala faʻasese tagata faʻatau. Matou te faʻaaogaina le sili ona lautele telefoni feavea laupapa laupapa laupapa tele o auro ipu, sunken ipu auro, komepiuta motherboard, leo ma tamai numera matagaluega komiti e masani lava e le ipu auro.

O le lelei ma le le lelei o le auro goto faagasologa e le faigata ona oʻo mai i:

Lelei: e le faigofie ona faʻamamaina le oxidize, e mafai ona teuina mo se taimi umi, o le laualuga e lamolemole, talafeagai mo le faʻamauina o tamaʻi va o pine ma vaega ma tamaʻi soʻoga soʻoga. Laupapa PCB e fiafia tele i ai ki (faʻataʻitaʻiga laupapa telefoni feaveaʻi). Reflow soldering mafai ona toe faia i le tele o taimi e aunoa ma le tele leiloa o solderability. E mafai ona faʻaaogaina o mea faʻavae mo le kapisi COB (Chip On Board).

Le lelei: taugata, leaga le faʻamalosia o le malosi, ona o le faʻaaogaina o le nickel plating process, faigofie ai ona i ai ni faʻafitauli uliuli ipu. O le nickel layer e faʻamamaina i le taimi, ma o le tumau-faʻatuatuaina o se mataupu.

O lenei ua tatou iloa o le auro o le auro ma le siliva o le siliva? E leai. Apa.

Tolu, spray spray circuit board

O papatusi siliva e taʻua o ipu o le tinjet. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Faʻaoga i se taimi uumi faigofie auala elei oxidation, ma mafua ai le le lelei fesoʻotaʻiga. Faʻaoga masani o se laʻititi numera oloa matagaluega laupapa, aunoa ma se tuusaunoaina o le tinjet laupapa, o le mafuaʻaga e taugofie.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Le lelei: E le talafeagai mo le faʻapipiʻiina o ni paʻu manifinifi ma ni tamaʻi vaega, ona o le le lelei luga o le laualuga o le ipu apa. I le faʻagaioiga PCB, e faigofie ona gaosia le paina ma faʻapipiʻi ai le auala puʻupuʻu mo vaega lelei o le pitch. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Muamua atu, sa matou talanoa e uiga i le sili atu ona taugofie moli mumu laupapa, o le maina a le moli eletise thermoelectric vavaeʻese apamemea substrate

Fa, OSP laupapa gaioiga

Ata tifaga fesoasoani maopoopo Aua e masani, ae le o le uʻamea, e taugofie nai lo le apa-spraying.

Lelei: Faatasi ai ma le lelei uma o le nanaina apamemea le fanauina, ua uma laupapa mafai foi ona toe faaleleia.

Le lelei: Faʻafaigata ona maua i le suka ma le susu. I le tulaga o le faʻaopoopoina faʻaipoipo faʻalua, o le taimi manaʻomia e faʻamaeʻaina ai le faʻamalama faʻaopoopo lona lua e masani ona leaga. Afai e teuina mo le sili atu i le tolu masina, e tatau ona toe faʻatuina. Faʻaaoga i totonu o le 24 itula pe a maeʻa le tatalaina o le afifi. O le OSP o se vaega e faʻapipiʻiina, o lea e tatau ai ona lolomi le faʻataʻitaʻiga ma le faʻapipiʻi faʻapipiʻi e aveʻese ai le vaega muamua o le OSP e faʻafesoʻotaʻi ai le nila i le faʻataʻitaʻiga o le eletise.

O le tasi gaioiga o lenei organic ata tifaga o le faʻamautinoaina o le totonugala ‘apamemea i totonu e le faʻamamaina muamua faʻamauina. O le ata faʻasolo i le taimi lava e vevela ai i le taimi o uelo. Faʻapipiʻi mafai ona faʻaaogaina e uelo ai uaea apamemea i vaega.

Ae e le pala-tetee. O le OSP matagaluega laupapa, faʻaalia i le ea mo le sili atu ma le sefulu aso, le mafai ona uʻamea vaega.

Tele motherboard komepiuta faʻaaogaina tekinolosi OSP. Aua o le matagaluega laupapa e tele e gafatia plating auro.