Usoro ọgwụgwọ elu nke PCB mbadamba

1. Bare copper plate

The advantages and disadvantages are obvious:

Uru: ọnụ ala, ala dị larịị, ịgbado ọkụ dị mma (na enweghị oxidation).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; Cannot be used on double panels because the second side is oxidized after the first reflow welding. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

Ọla kọpa dị ọcha na -adị mfe oxidized ma ọ bụrụ na ekpughere ya na ikuku, ọ ga -enwerịrị mkpuchi mkpuchi dị n’elu. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. So you need a large area of gold plating on the circuit board, that is, I took you to understand the gold process.

Abụọ, efere ọla edo

Ọlaedo bụ ezigbo ọlaedo. Ọbụna mkpuchi mkpuchi dị obere na -ewe ihe fọrọ nke nta ka ọ bụrụ 10% nke ọnụ bọọdụ sekit. Na Shenzhen, enwere ọtụtụ ndị ọchụnta ego ọkachamara n’ị nweta bọọdụ sekit, site n’ụzọ ụfọdụ iji sachapụ ọla edo, bụ ezigbo ego. The use of gold as a coating, one is to facilitate welding, the other is to prevent corrosion. Even if they did

Mkpịsị aka ọla edo nke ncheta afọ ole na ole ka na -enwu dị ka ha mere mgbe e ji ọla kọpa, aluminom na ígwè mee ha, nke na -ata nchara ugbu a ka ọ bụrụ mkpo.

The gold plated layer is widely used in the parts of the circuit board pads, gold fingers, connector shrapnel and other positions. Ọ bụrụ n’ịchọpụta na bọọdụ sekit bụ ọla ọcha n’ezie, nke ahụ agaghị ekwu, kpọọ oku ọkụ ọkụ nke ndị ahịa ozugbo, n’ezie bụ onye nrụpụta jerry, ejighị ihe mee ihe nke ọma, na ọla ndị ọzọ na-eduhie ndị ahịa. We use the most extensive mobile phone circuit board motherboard is mostly gold plate, sunken gold plate, computer motherboard, audio and small digital circuit board are generally not gold plate.

The advantages and disadvantages of the gold sinking process are not difficult to come to:

Uru: adịghị mfe iji oxidize, enwere ike ịchekwa ya ogologo oge, elu ya dị larịị, dabara adaba maka ịgbado obere atụdo oghere na ngwa ya na obere njikọta solder. Ogwe PCB masịrị ya na igodo (dịka bọọdụ ekwentị). Reflow soldering nwere ike ugboro ugboro ọtụtụ ugboro na -enweghị ọtụtụ mfu nke solderability. Enwere ike iji ya dị ka ihe ndabere maka kabeeji COB (Chip On Board).

Ọghọm: ọnụ ahịa dị elu, ike ịgbado ọkụ na -adịghị mma, n’ihi iji usoro mkpuchi nickel, ọ dị mfe ịnwe nsogbu efere ojii. Ngwurugwu nickel na-egbu oge, na ntụkwasị obi ogologo oge bụ okwu.

Ugbu a, anyị amata na ọla edo bụ ọla edo na ọla ọcha bụ ọla ọcha? Ọ bụghị n’ezie. Gbamgbam.

Three, spray tin circuit board

A na -akpọ efere ọlaọcha efere efere tinjet. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Long-term use easy oxidation corrosion, resulting in poor contact. Basically used as a small digital product circuit board, without exception is tinjet board, the reason is cheap.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Ọghọm: Ọ baghị uru maka ịgbanye ntụtụ oghere dị gịrịgịrị na obere ihe, n’ihi ịdị larịị nke efere tinjet. Na nhazi PCB, ọ dị mfe imepụta bead ma na -ebute sekit dị mkpirikpi maka ihe ndị dị mma. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Earlier, we talked about the cheapest light red circuit board, the miner’s lamp thermoelectric separation copper substrate

Four, OSP process board

Organic welding aid film. Maka na ọ bụ ihe ọkụkụ, ọ bụghị ọla, ọ dị ọnụ ala karịa ịfụ tin.

Uru: Site na uru niile nke ịgbado ọkụ ọla kọpa, enwere ike mechaa mbadamba ihe.

Ọghọm: Enwere ike ibute acid na iru mmiri. N’ihe banyere ịgbado ọkụ nke abụọ, oge achọrọ iji mezue ịgbado ọkụ nke abụọ na -abụkarị ogbenye. Ọ bụrụ na echekwara ya ihe karịrị ọnwa atọ, a ga -enwetaghachi ya. Jiri n’ime awa 24 mgbe imepe ngwugwu. OSP bụ akwa mkpuchi, yabụ, a ga -ebipụ ebe nnwale ahụ na mpe mpe akwa iji wepu akwa OSP izizi iji kpọtụrụ ebe agịga maka nnwale eletriki.

Nanị ọrụ ihe nkiri ihe nkiri a bụ ịhụ na foil ọla kọpa dị n’ime anaghị agbaze tupu ịgbado ọkụ. Ihe nkiri ahụ na -ekupụ ozugbo ọ na -ekpo ọkụ n’oge ịgbado ọkụ. Enwere ike iji sọlfọ gbanye wires ọla kọpa na ngwa.

Mana ọ naghị eguzogide corrosion. Ogwe sekit nke OSP, nke ekpughere n’ikuku ruo ihe karịrị ụbọchị iri, enweghị ike ịgbado ọkụ.

Ọtụtụ motherboards kọmputa na -eji teknụzụ OSP. N’ihi na bọọdụ sekit buru oke ibu nke na -agaghị ekwe ka ọ bụrụ ihe nkedo ọla edo.