Proses pangobatan lumahing Papan PCB

1. Bare copper plate

Keuntungan lan kekurangan iku jelas:

Kaluwihan: biaya murah, permukaan sing alus, stabilitas sing apik (yen ora ana oksidasi).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; Ora bisa digunakake ing panel dobel amarga sisih liyane dioksidasi sawise welding reflow pertama. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

Tembaga murni gampang dioksidasi yen kena hawa lan kudu nutupi pelindung ing ndhuwur. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. So you need a large area of gold plating on the circuit board, that is, I took you to understand the gold process.

Loro, piring emas

Emas minangka emas asli. Malah lapisan tipis nyumbang meh 10% saka biaya papan sirkuit. Ing Shenzhen, ana akeh pedagang khusus kanggo akuisisi papan sirkuit kethokan, kanthi sarana tartamtu kanggo ngumbah emas, minangka penghasilan sing apik. Panganggone emas minangka lapisan, siji kanggo nggampangake pengelasan, lan liyane kanggo nyegah karat. Even if they did

Tongkat memori driji emas sing wis pirang-pirang taun isih cemlorot kaya nalika digawe saka tembaga, aluminium lan wesi, sing saiki karat dadi tumpukan sampah.

The gold plated layer is widely used in the parts of the circuit board pads, gold fingers, connector shrapnel and other positions. Yen sampeyan ngerti manawa papan sirkuit kasebut sejatine perak, ora perlu diarani, langsung nelpon hotline hak konsumen, mesthine pabrikan kasebut dibangun, ora nggunakake bahan kanthi apik, kanthi logam liyane ngapusi pelanggan. Kita nggunakake motherboard papan sirkuit ponsel sing paling jembar biasane piring emas, piring emas cekung, motherboard komputer, papan sirkuit digital lan audio umume dudu piring emas.

The advantages and disadvantages of the gold sinking process are not difficult to come to:

Kaluwihan: ora gampang dioksidasi, bisa disimpen suwe, lumahing alus, cocog kanggo ngelas pin jurang cilik lan komponen kanthi sendi solder cilik. Papan PCB sing disenengi nganggo kunci (kayata papan ponsel). Solder Reflow bisa bola bola-bali tanpa kakehan solder. Bisa digunakake minangka bahan dhasar kanggo kabel COB (Chip On Board).

Kerugian: biaya larang, kekuatan las sing kurang, amarga panggunaan proses plating nikel, gampang nemoni masalah plate ireng. Lapisan nikel teroksidasi suwe-suwe, lan keandalan jangka panjang minangka masalah.

Saiki apa kita ngerti manawa emas iku emas lan salaka iku perak? Mesthi ora. Timah

Three, spray tin circuit board

Piring perak diarani piring tinjet. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Long-term use easy oxidation corrosion, resulting in poor contact. Sejatine digunakake minangka papan sirkuit produk digital cilik, tanpa kajaba iku tinjet board, sebabe murah.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Kerugian: Ora cocog kanggo solder pin gap sing tipis lan komponen cilik, amarga flat plate tinjet sing kurang apik. Ing proses PCB, gampang ngasilake manik solder lan nyebabake sirkuit cendhak kanggo komponen pitch sing apik. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Sadurunge, kita ngomong babagan papan sirkuit abang sing paling murah, landasan tembaga pemisahan termoelektrik lampu tambang

Papat, papan proses OSP

Film bantuan las organik. Amarga iku organik, dudu logam, luwih murah tinimbang nyemprotake timah.

Kaluwihan: Kanthi kabeh kaluwihan welding tembaga telanjang, papan kadaluwarsa uga bisa diisi maneh.

Kerugian: Kerep kanggo asam lan asor. Ing welding las sekunder, wektu sing dibutuhake kanggo ngrampungake las cermin kaping pindho biasane kurang. Yen disimpen luwih saka telung wulan, kudu dipasang maneh. Gunakake nganti 24 jam sawise mbukak paket kasebut. OSP minangka lapisan insulasi, mula titik uji kudu dicithak nganggo tempel solder kanggo mbusak lapisan OSP asli kanggo ngubungi titik jarum kanggo pengujian listrik.

Fungsi tunggal film organik iki yaiku kanggo nggawe foil tembaga njero ora teroksidasi sadurunge dipasang. Film kasebut nguap sanalika digawe panas nalika ngelas. Solder bisa digunakake kanggo ngelas kabel tembaga menyang komponen.

Nanging ora tahan korosi. Papan sirkuit OSP, sing kapapar udakara luwih saka sepuluh dina, ora bisa ngelas komponen.

Akeh motherboard komputer nggunakake teknologi OSP. Amarga papan sirkuit gedhe banget kanggo nanggung plating emas.