ʻO nā kaʻina hana i luna o Papa PCB

1. Bare copper plate

ʻIke ʻia nā mea maikaʻi a me nā mea maikaʻi ʻole:

Nā pōmaikaʻi: ke kumu kūʻai haʻahaʻa, kahi ʻoluʻolu, hiki ke hoʻopaʻa maikaʻi ʻia (i ka loaʻa ʻole o ka hoʻohaʻahaʻa).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; ʻAʻole hiki ke hoʻohana ʻia ma nā panela pālua no ka mea ʻoki ʻia ka ʻaoʻao ʻelua ma hope o ka hoʻopili mua ʻana o ka reflow. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

Hoʻomaʻamaʻa maʻalahi ʻia ke keleawe maʻemaʻe inā hōʻike ʻia i ka ea a pono e loaʻa i ka pale pale ma luna. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. No laila pono ʻoe i kahi nui o ka plating gula ma ka papa kaapuni, ʻo ia hoʻi, lawe wau iā ʻoe e hoʻomaopopo i ke kaʻina gula.

ʻElua, pā gula

ʻO ke gula ke gula maoli. ʻOiai kahi uhi uhi lahilahi kokoke i 10% o ke kumukūʻai o kahi papa kaapuni. Ma Shenzhen, nui nā mea kalepa i loea i ka loaʻa ʻana o nā papa kaapuni ʻōpala, ma o kekahi mau ʻano e holoi i ke gula, he loaʻa maikaʻi. ʻO ka hoʻohana ʻana i ke gula ma ke ʻano he uhi, ʻo ia ka mea e kōkua ai i ka hoʻopili, ʻo ka mea ʻē aʻe e pale i ka pala. ʻOiai ua hana lākou

ʻO nā manamana gula o kekahi mau makahiki hoʻomanaʻo o nā koʻokoʻo hoʻomanaʻo e aniani e like me kā lākou i hana ai i ke keleawe, aluminika a me ka hao, kahi i pala i nā puʻu o nā ʻōpala.

Hoʻohana ākea ka pale gula i nā ʻāpana o nā papa kaapuni, nā manamana gula, nā shrapnel hoʻohui a me nā kūlana ʻē aʻe. Inā ʻike ʻoe he kālā maoli ka papa kaapuni, ʻaʻole pono e ʻōlelo, kāhea pololei i ka laina laina kuleana o nā mea kūʻai, ʻo ia nō ka mea hana hale i kūkulu ʻia, ʻaʻole hoʻohana maikaʻi i nā mea, me nā metala e hoʻopunipuni i nā mea kūʻai aku. Hoʻohana mākou i ka motherboard kelepona kaapuni kelepona nui ʻoi aku ka nui o ka papa gula, ka ipu gula sunken, ka motherboard computer, nā leo a me nā papa kaapuni uila liʻiliʻi ʻaʻole ka papa gula.

ʻAʻole paʻakikī nā pōmaikaʻi a me nā maikaʻi ʻole o ke kaʻina komo ʻana o ke gula:

Nā pōmaikaʻi: ʻaʻole maʻalahi e oxidize, hiki ke mālama ʻia no kahi manawa lōʻihi, ʻoluʻolu ka ʻili, kūpono no ka hoʻopili ʻana i nā pin āpau liʻiliʻi a me nā mea me nā hono solder liʻiliʻi. Papa PCB makemake ʻia me ke kī (e laʻa me ka papa kelepona kelepono). Hiki ke hana hou i ka soldering i nā manawa he nui me ka nalowale ʻole o ka solderability. Hiki ke hoʻohana ʻia ma ke ʻano he kumu no COB (Chip On Board) cabling.

Nā mea kūpono ʻole: ke kumu kūʻai kiʻekiʻe, ikaika paʻa maikaʻi ʻole, ma muli o ka hoʻohana ʻana i ke kaʻina hana nickel plating, maʻalahi e loaʻa nā pilikia papa ʻeleʻele. Hoʻopili ka papa nickel i ka manawa, a ʻo ka hilinaʻi lōʻihi kahi pilikia.

I kēia manawa ʻike anei mākou he gula ke gula a he kālā ke kālā? ʻAʻole nō. Tin.

ʻEkolu, kāpī kaapuni kaapuni

Kapa ʻia nā pā kālā he mau papa tinjet. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Hoʻohana wā lōʻihi me ka hoʻowali hoʻowali ʻino, a laila hopena maikaʻi ʻole. Hoʻohana maʻamau ʻia me kahi papa kaapuni huahana uila liʻiliʻi, me ka ʻole o ka papa tinjet, kumu kūʻai ʻia ke kumu.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Nā mea kūpono ʻole: ʻaʻole kūpono no ka hoʻopili ʻana i nā pin āpau lahilahi a me nā ʻāpana liʻiliʻi loa, ma muli o ka papa maikaʻi ʻole o ka papa tinjet. I ka hana ʻana o PCB, maʻalahi ka hana i nā lei solder a hana i ke kaapuni pōkole no nā mea pitch maikaʻi. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Ma mua, ua kamaʻilio mākou e pili ana i ka papa kaapuni ʻulaʻula māmā loa, ka thermoelectric lamp o ka miners e hoʻokaʻawale ana i substrate keleawe

ʻEhā, papa hana OSP

Kiʻi kōkua kuʻihao ʻokanika. No ka mea kūlohelohe ia, ʻaʻole metala, ʻoi aku ka maikaʻi ma mua o ka spray-tin.

Nā mea maikaʻi: Me nā keu pono āpau o ka hoʻoheheʻe ʻana i ke keleawe, hiki ke hoʻopau hou ʻia nā papa pau.

Nā mea maikaʻi ʻole: Hoʻoweliweli ʻia i ka waikawa a me ka momona. I ka hihia o ka hoʻoheheʻe ʻana i ke kula kiʻekiʻe, he ʻilihune ka manawa e pono ai e hoʻopau i ka lua o ka welding reflow. Inā mālama ʻia ma mua o ʻekolu mau mahina, pono e hoʻāla hou. E hoʻohana i loko o 24 mau hola ma hope o ka wehe ʻana i ka pūʻolo. ʻO ka OSP kahi papa insulate, no laila pono e paʻi ʻia ka kiko hōʻike me ka paʻi solder e hoʻoneʻe i ka papa OSP kumu e kāhea aku i kahi kiko o ka nila no ka hoʻāʻo uila.

ʻO ka hana wale nō o kēia kiʻi ʻoniʻoni e hōʻoia i ka ʻole o oxilize o ka pepa keleawe o loko i mua o ka hoʻopili ʻana. Hoʻopau ke kiʻi ʻoniʻoni ke hoʻomehana ʻia i ka wā o ka hao. Hiki ke hoʻohana i ka solder e hoʻoheheʻe i nā kaula keleawe i nā ʻāpana.

Akā ʻaʻole ia e pale i ka popopo. ʻO kahi papa kaapuni OSP, hōʻike ʻia i ka lewa no nā lā he ʻumi a keu, ʻaʻole hiki ke hoʻopaʻa i nā ʻāpana.

Hoʻohana ka nui o nā motherboard makuahine i ka ʻenehana OSP. No ka mea nui loa ka papa kaapuni e uku i ka plating gula.