Awọn ilana itọju dada ti PCB ọkọ

1. Bare copper plate

Awọn anfani ati alailanfani jẹ kedere:

Awọn anfani: idiyele kekere, dada didan, alurinmorin ti o dara (ni isansa ti ifoyina).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; Ko le ṣee lo lori awọn paneli meji nitori pe ẹgbẹ keji jẹ oxidized lẹhin alurinmorin reflow akọkọ. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

Ejò mimọ jẹ irọrun oxidized ti o ba farahan si afẹfẹ ati pe o gbọdọ ni ideri aabo ti o wa loke. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. Nitorinaa o nilo agbegbe nla ti sisọ goolu lori igbimọ Circuit, iyẹn ni, Mo mu ọ lati loye ilana goolu naa.

Meji, awo goolu

Goolu jẹ goolu gidi. Paapaa awọn iroyin ti o bo tinrin fun o fẹrẹ to 10% ti idiyele ti igbimọ Circuit kan. Ni Shenzhen, ọpọlọpọ awọn oniṣowo ti o ṣe amọja ni gbigba awọn igbimọ Circuit alokuirin, nipasẹ awọn ọna kan lati wẹ goolu naa, jẹ owo -wiwọle to dara. Lilo goolu bi bo, ọkan ni lati dẹrọ alurinmorin, ekeji ni lati dena ipata. Paapa ti wọn ba ṣe

Awọn ika ọwọ goolu ti awọn iranti iranti ti awọn ọdun pupọ tun jẹ didan bi wọn ti ṣe nigba ti wọn ṣe ti bàbà, aluminiomu ati irin, eyiti o di ipata bayi si awọn opo ti ijekuje.

Layer ti a fi wura ṣe ni lilo pupọ ni awọn apakan ti awọn paadi igbimọ Circuit, awọn ika ọwọ goolu, shrapnel asopọ ati awọn ipo miiran. Ti o ba rii pe igbimọ Circuit jẹ fadaka gangan, iyẹn ko nilo lati sọ, taara pe gboona awọn ẹtọ olumulo, dajudaju jẹ olupese ti a ṣe Jerry, ko lo awọn ohun elo daradara, pẹlu awọn irin miiran tan awọn alabara jẹ. A nlo modaboudu foonu alagbeka ti o gbooro pupọ julọ jẹ awo goolu pupọ, awo goolu ti a rì, modaboudu kọnputa, ohun ati igbimọ Circuit oni nọmba kekere kii ṣe awo goolu nigbagbogbo.

The advantages and disadvantages of the gold sinking process are not difficult to come to:

Awọn anfani: kii ṣe rọrun lati oxidize, le wa ni ipamọ fun igba pipẹ, dada jẹ dan, o dara fun alurinmorin awọn pinni aafo kekere ati awọn paati pẹlu awọn isẹpo solder kekere. Igbimọ PCB ti o fẹ pẹlu bọtini (fun apẹẹrẹ igbimọ foonu alagbeka). Reflow soldering le ti wa ni tun ọpọlọpọ igba lai Elo isonu ti solderability. O le ṣee lo bi ohun elo ipilẹ fun kaakiri COB (Chip On Board).

Awọn aila -nfani: idiyele giga, agbara alurinmorin ti ko dara, nitori lilo ilana fifẹ nickel, rọrun lati ni awọn iṣoro awo dudu. Layer nickel ṣe afẹfẹ lori akoko, ati igbẹkẹle igba pipẹ jẹ ọran kan.

Bayi ni a mọ pe goolu jẹ goolu ati fadaka jẹ fadaka? Be e ko. Tin.

Mẹta, sokiri tin Circuit igbimọ

Awọn awo fadaka ni a pe ni awọn awo tinjet. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Long-term use easy oxidation corrosion, resulting in poor contact. Ni ipilẹṣẹ lo bi igbimọ Circuit ọja oni -nọmba kekere, laisi iyasọtọ jẹ igbimọ tinjet, idi naa jẹ olowo poku.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Awọn alailanfani: Ko dara fun sisọ awọn pinni aafo tinrin ati awọn paati kekere pupọ, nitori fifẹ dada ti ko dara ti awo tinjet. Ni sisẹ PCB, o rọrun lati ṣe agbejade ilẹkẹ alata ati fa Circuit kukuru fun awọn paati ipolowo to dara. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Ni iṣaaju, a sọrọ nipa igbimọ Circuit pupa pupa ti ko gbowolori, fitila thermoelectric Iyapa minisita idẹ

Mẹrin, igbimọ ilana OSP

Fiimu iranlọwọ iranlọwọ alurinmorin. Nitori o jẹ Organic, kii ṣe irin, o din owo ju fifa tin.

Awọn anfani: Pẹlu gbogbo awọn anfani ti alurinmorin Ejò igboro, awọn igbimọ ti o pari tun le tunṣe.

Awọn alailanfani: Alailagbara si acid ati ọriniinitutu. Ni ọran ti alurinmorin reflow keji, akoko ti o nilo lati pari alurinmorin reflow keji jẹ talaka nigbagbogbo. Ti o ba fipamọ fun o ju oṣu mẹta lọ, o gbọdọ tun pada. Lo laarin awọn wakati 24 lẹhin ṣiṣi package naa. OSP jẹ fẹlẹfẹlẹ idabobo, nitorinaa aaye idanwo gbọdọ wa ni titẹ pẹlu lẹẹmọ taja lati yọ ipilẹ OSP atilẹba lati kan si aaye abẹrẹ fun idanwo itanna.

Iṣẹ iyasọtọ ti fiimu Organic yii ni lati rii daju pe bankan -idẹ ti inu ko ṣe oxidize ṣaaju alurinmorin. Fiimu naa yoo yọ kuro ni kete ti o ba gbona nigba alurinmorin. Solder le ṣee lo lati weld awọn okun onirin si awọn paati.

Sugbon o jẹ ko ipata-sooro. Igbimọ Circuit OSP kan, ti o han si afẹfẹ fun diẹ ẹ sii ju ọjọ mẹwa, ko le ṣe paati awọn paati.

Ọpọlọpọ awọn modaboudu kọnputa lo imọ -ẹrọ OSP. Nitori pe igbimọ Circuit ti tobi pupọ lati ni anfani gbigbe wura.