Hababka daaweynta dusha sare ee Guddiga PCB

1. Bare copper plate

Faa’iidooyinka iyo khasaaraha ayaa iska cad:

Faa’iidooyinka: qiimo jaban, dusha siman, alxanka wanaagsan (maqnaanshaha oksaydhka).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; Laguma isticmaali karo darfaha labajibbaaran sababta oo ah dhinaca labaad waa oksaydhka kadib alxanka dib -u -cusboonaysiinta koowaad. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

Naxaas saafi ah si sahal ah ayaa loo qayilaa haddii ay hawada soo gasho waana inay lahaataa dahaarka difaaca ee kore. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. So you need a large area of gold plating on the circuit board, that is, I took you to understand the gold process.

Laba, saxan dahab ah

Dahabku waa dahabka dhabta ah. Xitaa dahaarka khafiifka ah ayaa xisaabinaya ku dhawaad ​​10% qiimaha guddiga wareegga. Shenzhen, waxaa jira ganacsato badan oo ku takhasusay helitaanka guddiyada wareegga duugga ah, iyada oo loo marayo habab gaar ah oo lagu dhaqo dahabka, waa dakhli wanaagsan. Isticmaalka dahabka sida dahaarka, mid waa fududeynta alxanka, tan kale waa ka hortagga daxalka. Even if they did

Faraha dahabka ah ee xusuusta qiimahoodu dhawrka sano ahaa ayaa weli dhaldhalaalaya sidii markii ay ka samaysnaayeen naxaas, aluminium iyo bir, kuwaas oo immika miridhkoodu ku badan yahay qashinka.

The gold plated layer is widely used in the parts of the circuit board pads, gold fingers, connector shrapnel and other positions. Haddii aad ogaato in guddiga wareegga uu dhab ahaantii yahay lacag, taasi uma baahna in la yiraahdo, si toos ah u wac khadadka xuquuqda macaamilka, hubaal waa soo-saaraha jerry-dhisay, ma uusan si wanaagsan u adeegsan qalabka, iyadoo biraha kale ay khiyaaneeyaan macaamiisha. Waxaan isticmaalnaa motherboard -ka wareega wareega taleefanka gacanta ee ugu ballaadhan inta badan waa saxan dahab ah, saxan dahab ah oo qarqamay, motherboard -ka kombiyuutarka, maqal iyo guddi wareeg oo dijital ah guud ahaan maahan saxan dahab ah.

The advantages and disadvantages of the gold sinking process are not difficult to come to:

Faa’iidooyinka: ma fududa in la oksideeyo, waa la kaydin karaa muddo dheer, dusha ayaa siman, oo ku habboon alxanka biinanka farqiga yar iyo qaybaha leh xirmooyin yar yar. Looxa PCB ee la doorbiday oo leh fure (tusaale, sabuuradda taleefanka gacanta). Alxanka dib -u -celinta ayaa la soo celin karaa marar badan iyada oo aan la lumin wax -ku -oolnimada. Waxaa loo adeegsan karaa sidii agabkii saldhigga u ahaa fiilooyinka COB (Chip On Board).

Faa’iido darrooyinka: qiimaha sare, xoogga alxanka oo liita, sababta oo ah adeegsiga hannaanka dahaadhka nikkel, waa sahlan tahay in la helo dhibaatooyinka saxanka madow. Lakabka nikkel-ka ayaa oksaynaya waqti ka dib, iyo isku halaynta muddada-dheer waa arrin.

Hadda ma ognahay in dahabku yahay dahab, lacagtuna waa lacag? Dabcan maya. Tin.

Three, spray tin circuit board

Taarikada lacagta ah waxaa lagu magacaabaa taarikada tinjet. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Long-term use easy oxidation corrosion, resulting in poor contact. Asal ahaan loo isticmaalo guddi wareegga alaabada dhijitaalka ah oo yar, iyada oo aan laga reebin waa guddiga tinjet, sababtu waa raqiis.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Qasaarooyinka: Kuma habboona in lagu xiro biinanka farqiga khafiifka ah iyo qaybo aad u yar, sababtuna waa sagxad dusha sare ee saxanka tinjet -ka. Ka shaqaynta PCB -ga, way fududahay in la soo saaro kuul alwaax ah oo sababi kara wareegga gaaban ee qaybaha garoonka wanaagsan. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Horaantii, waxaan ka hadalnay guddigii wareegga cas ee ugu raqiisanaa, nalalka macdanta ee kala saaridda heerkulka korantada korantada

Afar, guddiga geeddi -socodka OSP

Filimka gargaarka alxanka ee dabiiciga ah. Sababtoo ah waa dabiici, ma aha biraha, way ka jaban tahay daasad-buufin.

Faa’iidooyinka: Iyada oo leh dhammaan faa’iidooyinka alxanka naxaasta qaawan, looxyada dhacay ayaa sidoo kale la hagaajin karaa.

Qasaaraha: U nugul aashitada iyo huurka. Marka laga hadlayo alxanka reflow labaad, waqtiga loo baahan yahay si loo dhammaystiro alxanka reflow labaad caadi ahaan waa liita. Haddii la kaydiyo in ka badan saddex bilood, waa in dib loo cusboonaysiiyaa. Isticmaal 24 saac gudahood kadib markaad furto xirmada. OSP -gu waa lakab ka -gudub ah, sidaa darteed barta imtixaanka waa in lagu daabacaa dhejiska alxanka si meesha looga saaro lakabka OSP ee asalka ah si loola xiriiro barta irbadda ee baaritaanka korontada.

Shaqada keli ah ee filimkan dabiiciga ahi waa in la hubiyo in bireedka naxaasta ahi aanu oksaydh noqon ka hor alxanka. Filimku wuxuu uumi baxaa isla marka la kululeeyo inta alxanka la joogo. Alxanka waxaa loo isticmaali karaa in lagu xiro fiilooyinka naxaasta qaybaha.

Laakiin ma aha mid u adkaysata daxalka. Guddiga wareegga ee OSP, oo hawada ku jira in ka badan toban maalmood, ma alxan karo qaybaha.

Motherboards badan oo kombiyuutar ayaa adeegsada farsamada OSP. Sababtoo ah guddiga wareegga ayaa aad u weyn oo aan awoodin dahaadhka dahabka.