Maitiro ekurapa epamusoro e Pcb bhodhi

1. Bare copper plate

Zvakanakira nekuipira zviri pachena:

Zvakanakira: yakaderera mutengo, yakatsetseka pamusoro, yakanaka weldability (mukushayikwa kweiyo oxidation).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; Haigone kushandiswa pamapaneru akapetwa nekuti chikamu chechipiri chakasanganiswa mushure mekutanga kutungidza kutenderera. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

Mhangura yakachena inosanganiswa nyore nyore kana ikaburitswa nemhepo uye inofanirwa kuve neanodzivirira ari pamusoro. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. Saka iwe unoda nzvimbo yakakura yegoridhe yakanamirwa pabhodhi redunhu, ndiko kuti, ndakutora kuti unzwisise maitiro egoridhe.

Mbiri, ndiro yegoridhe

Ndarama ndiyo goridhe chaiyo. Kunyangwe yakatetepa yekupfeka account inosvika gumi muzana% yemutengo wedunhu bhodhi. MuShenzhen, kune vakawanda vatengesi vane hunyanzvi mukutsvaga kwemarara wedunhu mabhodhi, kuburikidza nedzimwe nzira dzekushambidza ndarama, imari yakanaka. Iko kushandiswa kwegoridhe sekuputira, imwe ndeye kufambisa kutenderera, imwe ndeye kudzivirira ngura. Kunyangwe dai vakadaro

Iyo minwe yegoridhe yemakore akati wandei ekukosha kwendangariro inoramba ichingopenya sezvayakaita payakagadzirwa yendarira, aluminium nesimbi, iyo yava ngura kuita mirwi yemarara.

Iyo yegoridhe yakafukidzwa denderedzwa inoshandiswa zvakanyanya muzvikamu zvematunhu bhodhi mapedhi, zvigunwe zvegoridhe, chinongedzo shrapnel uye dzimwe nzvimbo. Kana iwe ukaona kuti redunhu bhodhi iri chaizvo sirivheri, izvo hazvidi kuti utaure, zvakananga kudana mutengi kodzero kero, zvirokwazvo ndiyo inogadzira jeri-yakavakwa, haina kushandisa zvakanaka zvinhu, nezvimwe simbi zvinonyengera vatengi. Isu tinoshandisa yakanyanya kuwanda nhare mbozha wedunhu bhodhi mamaboard inonyanya ndiro yegoridhe, yakanyura ndiro yegoridhe, komputa mamaboard, odhiyo uye diki yedhijitari redunhu bhodhi kazhinji haisi yendarama ndiro.

Izvo zvakanakira nekuipira kwekunyura kwegoridhe hazvina kunetsa kuuya kune:

Zvakanakira: hazvisi nyore kuisa oxidize, zvinogona kuchengetwa kwenguva yakareba, pamusoro pacho panotsvedzerera, inokodzera kukwikwidza madiki pini mapini uye zvikamu zvine zvidiki zveasolding majoini. Yakasarudzika pcb board ine kiyi (semuenzaniso nhare mbozha). Reflow soldering inogona kudzokororwa kakawanda pasina kurasikirwa kukuru kwekutengesa. Inogona kushandiswa sechinhu chepasi cheCOB (Chip Pane Bhodhi) cabling.

Kukanganisa: kudhura, kusasimba kwekusimbisa simbi, nekuda kwekushandiswa kweiyo nickel yakanamirwa nzira, zviri nyore kuve nematema ndiro matambudziko. Iyo nickel dura inosanganisa nekufamba kwenguva, uye kuvimbika kwenguva refu inyaya.

Zvino isu tinoziva here kuti goridhe ndarama uye sirivheri isirivha? Zvirokwazvo kwete. Tin.

Tatu, pfapfaidza gaba redunhu bhodhi

Mahwendefa esirivheri anonzi tinjet mahwendefa. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Long-term use easy oxidation corrosion, resulting in poor contact. Chaizvoizvo inoshandiswa sediki dhijitari chigadzirwa wedunhu bhodhi, pasina yakasarudzika tinjet bhodhi, chikonzero chacho chakachipa.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Kukanganisa: Hazvina kukodzera kutetepa zvakapfava pini pini uye zvidiki zvidimbu, nekuda kwehurombo pamusoro pekutsiga kwetiza ndiro. In pcb kugadzira, zviri nyore kubereka solder bead uye kukonzera pfupi redunhu yakanaka namo zvinoriumba. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Pakutanga, isu takataura nezve yakachipa penya mwenje wedunhu redunhu, murimi wemugodhi thermoelectric kupatsanura mhangura substrate

Chechina, OSP maitiro ebhodhi

Organic Welding yekubatsira firimu. Nekuti iri organic, kwete simbi, inodhura pane tini-yekumwaya.

Zvakanakira: Nezvakanakira zvese zvekushongedza kwemhangura isina chinhu, mabhodhi akapera anogona kunatsiridzwa.

Kukanganisa: Inobatwa neasidhi uye mwando. Kana iri yechipiri kudzoreredza mutserendende, iyo nguva inodikanwa yekupedzisa yechipiri reflow yekutenderera inowanzo kuve yakashata. Kana ikachengetwa kweinopfuura mwedzi mitatu, inofanirwa kumutswa. Shandisa kumusoro mukati maawa makumi maviri nemana mushure mekuvhura pasuru yacho. Iyo OSP inodzivirira dura, saka poindi yekuyedza inofanirwa kuprindwa nesoda pasita kuti ibvise yekutanga OSP riya kuti ubate natsono poresheni yemagetsi.

Iwo wega basa reiyo organic firimu ndeyekuona kuti yemukati yemhangura foil haina oxidize isati yatemwa. Iyo firimu inosimuka semhepo painongopisa panguva yekuwelda. Solder inogona kushandiswa kusungira waya dzemhangura kuzvinhu.

Asi haisi kuramba ngura. Bhodhi redunhu reOSP, rakafumurwa nemhepo kweanopfuura mazuva gumi, harigone kuwelda zvinhu.

Mazhinji emakomputa emabhodhi anoshandisa OSP tekinoroji. Nekuti iro bhodhi redunhu rakakura kwazvo kuti risakwanise kuwana goridhe.