Mekhoa ea kalafo ea bokaholimo ea PCB boto

1. Bare copper plate

Melemo le likotsi li totobetse:

Melemo: theko e tlase, bokaholimo bo boreleli, botle bo botle (ha ho se na moea o kenang moea).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; E ke ke ea sebelisoa ka liphanele tse habeli hobane lehlakore la bobeli le na le oxidized kamora ho tjheseletsa hoa pele. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

Koporo e hloekileng e haelloa habonolo ha e pepesetsoa moea ‘me e tlameha ho ba le seaparo se sireletsang se kaholimo. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. Kahoo o hloka sebaka se seholo sa khauta ka boto ea potoloho, ke hore, ke u nkile hore u utloisise ts’ebetso ea khauta.

Tse peli, poleiti ea khauta

Khauta ke khauta ea ‘nete. Esita le seaparo se tšesaane se etsa chelete e ka bang 10% ea litšenyehelo tsa boto ea potoloho. Shenzhen, ho na le bahoebi ba bangata ba sebetsanang le ho fumana liboto tsa mekotla ea mekotla, ka mekhoa e meng ea ho hlatsoa khauta, ke chelete e ntle. Ts’ebeliso ea khauta joalo ka seaparo, e ‘ngoe ke ho tsamaisa litšepe, e’ ngoe ke ho thibela ts’enyeho. Le ha ba entse joalo

Menoana ea khauta ea lilemo tse ‘maloa ea likhopotso e ntse e benya joalo ka ha e ne e entsoe ka koporo, aluminium le tšepe, eo joale e leng mafome e le qubu ea litšila.

Lera le koahetsoeng ka khauta le sebelisoa haholo likarolong tsa mekotla ea boto ea potoloho, menoana ea khauta, sehokelo sa sehokelo le maemo a mang. Haeba u fumana hore boto ea potoloho ke ha e le hantle e le silevera, ha ho hlokahale hore u bitse mohala o otlang ka kotloloho litokelo tsa bareki, ehlile ke moetsi ea hahiloeng ka jeri, ha a ka a sebelisa thepa hantle, ka lisebelisoa tse ling li thetsa bareki. Re sebelisa board ea board ea mama ea mobile e pharalletseng haholo ke poleiti ea khauta, poleiti ea khauta e koahetsoeng, board ea mama ea khomphutha, mamelwang le boto e nyane ea potoloho ea dijithale hangata ha se poleiti ea khauta.

Melemo le likotsi tsa ts’ebetso ea ho teba ha khauta ha ho thata ho tla ho:

Melemo: ha ho bonolo ho e kopanya, e ka bolokoa nako e telele, bokaholimo bo boreleli, bo loketse ho tjheseletsa lithakhisa tse nyane tsa likarolo le likarolo tse nang le manonyeletso a manyane a solder. Boto ea PCB e khethiloeng e nang le senotlolo (mohlala, boto ea mehala ea mohala). Phallo ea phallo e ka phetoa makhetlo a mangata ntle le tahlehelo e ngata ea ho rekisoa. E ka sebelisoa e le sesebelisoa sa mantlha bakeng sa khabinete ea COB (Chip On Board).

Mathata: theko e phahameng, matla a ho tjheseletsa hampe, ka lebaka la ts’ebeliso ea ts’ebetso ea ho roala nickel, ho ba bonolo ho ba le mathata a poleiti e ntšo. Lera la nikele le tšela oksijene ha nako e ntse e tsamaea, ‘me ho ts’epahala ha nako e telele ke bothata.

Joale na rea ​​tseba hore khauta ke khauta le silevera ke silevera? Che, ho hang. Tin.

Tse tharo, boto ea potoloho ea thini

Lipoleiti tsa silevera li bitsoa lipoleiti tsa tinjet. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Tšebeliso ea nako e telele ts’enyeho e bonolo ea oxidation, e lebisang ho ikopantseng le batho ba futsanehileng. Ha e sebelisoa joalo ka boto e nyane ea sehlahisoa sa dijithale, ntle le khetho ke boto ea tinjet, lebaka le theko e tlase.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Bothata: Ha e tšoanelehe bakeng sa litšepe tse tšesaane tsa likheo le likaroloana tse nyane haholo, ka lebaka la ho se otlolohe hoa bokaholimo ba poleiti ea tinjet. Ka ho sebetsana le PCB, ho bonolo ho hlahisa sefaha sa solder mme se baka potoloho e khuts’oane bakeng sa likarolo tse ntle tsa sekontiri. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Pejana, re buile ka boto ea potoloho e khubelu e bobebe e theko e tlase, lebone la morafo la motlakase oa motlakase o arohaneng le karolo ea koporo

Boto ea ts’ebetso ea OSP

Filimi ea lithuso ea tlholeho. Hobane ke ea tlhaho, eseng tšepe, e theko e tlase ho feta ho fafatsa ka thini.

Melemo: Ka melemo eohle ea ho tjheseletsa koporo e se nang letho, liboto tse felletsoeng ke nako le tsona li ka ntlafatsoa.

Mathata: E ka hlaseloa ke asiti le mongobo. Tabeng ea tjheseletsa bobeli reflow, nako e hlokehang ho tlatsa bobeli reflow tjheseletsa hangata futsanehile. Haeba e bolokiloe nako e fetang likhoeli tse tharo, e tlameha ho hlahisoa bocha. Sebelisa ka hare ho lihora tse 24 ka mor’a ho bula sephutheloana. OSP ke lera le sireletsang, kahoo ntlha ea tlhahlobo e tlameha ho hatisoa ka pente ea solder ho tlosa lera la pele la OSP ho ikopanya le ntlha ea nale bakeng sa liteko tsa motlakase.

Mosebetsi o le mong oa filimi ena e hlophisitsoeng ke ho etsa bonnete ba hore foil ea koporo e ka hare ha e na oxidize pele e chesoa. Filimi e fetoha mouoane hang ha e futhumetse nakong ea tšepe. Solder e ka sebelisoa ho cheseletsa lithapo tsa koporo ho likarolo.

Empa ha e mamelle ho bola. Boto ea potoloho ea OSP, e pepesitsoeng moeeng matsatsi a fetang leshome, e ke ke ea cheseletsa likarolo.

Li-boardboard tse ngata tsa likhomphutha li sebelisa theknoloji ea OSP. Hobane boto ea potoloho e kholo haholo hore e ka fihlella seaparo sa khauta.