Inkqubo yonyango yomphezulu we Ibhodi PCB

1. Bare copper plate

Izibonelelo kunye nezinto ezingalunganga zicacile:

Izinto eziluncedo: ngexabiso eliphantsi, umphezulu ogudileyo, ukulungeleka okuhle (xa kungekho igcwala).

Disadvantages: easy to be affected by acid and humidity, can not be kept for a long time, need to be used up within 2 hours after unpacking, because copper is easily oxidized when exposed to air; Ayinakusetyenziswa kwiiphaneli eziphindwe kabini kuba icala lesibini linokongezwa emva kwewelding yokuqala yokuvula. If there are test points, solder paste must be printed to prevent oxidation, otherwise subsequent contact with the probe will not be good.

Ubhedu oluchanekileyo ludityaniswa ngokulula ukuba luchanekile emoyeni kwaye kufuneka lube nolu khuselo lungentla. And some people think that gold is copper, which is not true, because that’s the protective layer over the copper. Ke ufuna indawo enkulu yegolide yokutyabeka kwibhodi yesekethe, Oko kukuthi, ndikuthathile ukuze uqonde inkqubo yegolide.

Isibini, ipleyiti yegolide

Igolide yeyona golide yokwenene. Nokuba ii-akhawunti zokutyabeka zincinci malunga ne-10% yexabiso lebhodi yesekethe. E-Shenzhen, baninzi abathengisi abagxile ekufumaneni iibhodi zesekethe ezilahliweyo, ngeendlela ezithile zokuhlamba igolide, ngumvuzo olungileyo. Ukusetyenziswa kwegolide njengesambatho, enye kukulungiselela ukuwelda, enye kukuthintela ukubola. Nokuba benzile

Iminwe yegolide yeminyaka eliqela yememori yeenduku isakhazimla njengoko yenzayo xa yayenziwe ngobhedu, ialuminiyam kunye nentsimbi, ethi ngoku iruse ibe yimfumba yenkunkuma.

Umaleko wegolide oqweqwe ngokubanzi usetyenziswa ngokubanzi kumacandelo ebhodi yesekethe, iminwe yegolide, isinxibelelanisi esinezixhobo kunye nezinye izikhundla. Ukuba ufumanisa ukuba ibhodi yesekethe eneneni isilivere, akufuneki ukuba ithi, ngqo umnxeba kumnxeba osetyenziselwa amalungelo abathengi, ngokuqinisekileyo ngumakhi owakhelwe i-jerry, khange asebenzise kakuhle izinto, kunye nezinye izinyithi zikhohlisa abathengi. Sisebenzisa ibhodi yomama yebhodi yesekethe ebanzi ikakhulu yipleyiti yegolide, ipleyiti yegolide ezitshisiweyo, ibhodi yomama yekhompyuter, iaudiyo kunye nebhodi yesekethe encinci yedijithali ngokubanzi ayisiyo ipleyiti yegolide.

Izibonelelo kunye nezinto ezingalunganga zenkqubo yokuntywila ngegolide ayinzima ukuza kuyo:

Izinto eziluncedo: akukho lula ukuyidibanisa, inokugcinwa ixesha elide, umphezulu ugudile, ulungele ukuwelda izikhonkwane ezincinci kunye nezinto ezinamalungu amancinci. Ibhodi ye-PCB ekhethiweyo enesitshixo (umz. Ibhodi yefowuni ephathekayo). Ukuhamba kwakhona kwe-soldering kunokuphindaphindwa amaxesha amaninzi ngaphandle kokulahleka okukhulu kwe-solderability. Ingasetyenziselwa izinto ezisisiseko ze-COB (i-Chip kwiBhodi) yokufaka iikhabhathi.

Ukungancedi: iindleko eziphezulu, ukungasebenzi kakuhle kwe-welding, ngenxa yokusebenzisa inkqubo ye-nickel plating, kulula ukuba neengxaki zepleyiti emnyama. Umaleko wenickel udibanisa ixesha, kunye nokuthembeka kwexesha elide ngumcimbi.

Ngoku siyazi ukuba igolide igolide kwaye isilivere yisilivere? Akunjalongo noko. Tin.

Ezintathu, ukutshiza ibhodi yesekethe yebhodi

Amacwecwe esilivere abizwa ngokuba ziipleyiti ze-tinjet. Spraying a layer of tin over the copper wire can also aid in welding. But it doesn’t offer the same long-term contact reliability as gold. There is no impact on soldered components, but reliability is not sufficient for pads exposed to air for a long time, such as ground pads, spring pin sockets, etc. Ukusetyenziswa kwexesha elide kulula ukugcwala kwe-oxidation, okukhokelela kunxibelelwano olubi. Isetyenziswa njengebhodi yesekethe encinci yemveliso yedijithali, ngaphandle kwebhodi yetinjet, isizathu asibizi.

Its advantages and disadvantages are summarized as follows:

Advantages: low price, good welding performance.

Ukungancedi: Ayikulungelanga ukuhambisa izikhonkwane zesikhewu esincinci kunye nezinto ezincinci kakhulu, ngenxa yokugqabhuka komphezulu weplati ye-tinjet. Ekusebenziseni kwePCB, kulula ukuvelisa i-solder bead kwaye ibangele isiphaluka esifutshane sezinto ezifanelekileyo. When used in the double-sided SMT process, because the second surface has been a high temperature reflow welding, it is very easy to re-melt tin spraying and produce spherical tin beads or similar water beads dripping under the influence of gravity, resulting in more uneven surface and affecting welding problems.

Kwangoko, sathetha ngebhodi yesekethe ebomvu ebomvu, isibane sommbiwa sokwahlulahlula ubhedu

Isine, inkqubo yebhodi ye-OSP

Ifilimu yoncedo lwewelding. Ngenxa yokuba i-organic, hayi isinyithi, itshiphu kune-tin-spraying.

Izinto eziluncedo: Ngazo zonke izibonelelo ze-welding ze-bare ezingenanto, iibhodi eziphelelwe lixesha nazo zinokuhlaziywa.

Iingxaki: Usengozini yokufumana i-asidi kunye nokufuma. Kwimeko ye-welding yesibini yokugcwalisa kwakhona, ixesha elifunekayo lokugqiba i-welding yesibini ayifuni. Ukuba igcinwe ngaphezulu kweenyanga ezintathu, kufuneka iphinde ivuswe. Sebenzisa iiyure ezingama-24 emva kokuvula iphakheji. I-OSP ngumaleko wokugquma, ke indawo yovavanyo kufuneka iprintwe nge-solder paste ukuze isuse umaleko wokuqala we-OSP ukunxibelelana nenaliti yovavanyo lombane.

Umsebenzi wodwa wale bhanyabhanya yoqobo kukuqinisekisa ukuba ifoyile yobhedu engaphakathi ayenzi oxidize ngaphambi kokuwelda. Ifilimu iyakhuphuka kamsinya nje yakuba ifudunyezwe ngexesha lokudibanisa. I-Solder ingasetyenziselwa ukuhambisa iingcingo zethusi kwizinto ezithile.

Kodwa ayisixhathisi ukubola. Ibhodi yesekethe ye-OSP, evezwe ngumoya ngaphezulu kweentsuku ezilishumi, ayinakho ukuhlanganisa izinto.

Uninzi lwee-motherboards zekhompyuter zisebenzisa itekhnoloji ye-OSP. Kungenxa yokuba ibhodi yesekethe inkulu kakhulu ukuba inganakho ukuxhonywa ngegolide.