PCB packaging est ipsa membra electronica, chipa et aliae parametri (ut magnitudinem partium, longitudinis et latitudinis, recta inserta, commissura, caudex amplitudo, paxillus longitudo et latitudo, paxillus spaing, etc.) in repraesentatione graphica, ut in. dici potest cum PCB schemate trahens.

1) PCB fasciculus dividi potest in cogitationes montis, obturaculum-in machinis, machinas mixtas (utroque inscendere et obturaculum-in eodem tempore existere) et cogitationes speciales secundum modum institutionis. Singulares cogitationes plerumque laminae machinas mergi referuntur.

2) PCB fasciculum dividi potest in genera sequentia secundum functiones et formas machinae;

SMD: Superficies Mount Devices/ Superficies Mount Devices.

RA: Resistor Arrays/Resistor.

MELF: Metallum faciei Electrode Componentes/Metal electrode sine fine plumbi composita.

SOT: Forma transistor / Forma transistor

SOD: Small Outline diode/ Small outline diode.

SOIC: Circuitus parvus delineatio Integrated.

Horreat Small Outline Integrated Circuits SSOIC: Shrink Parvus Outline Integrated Circuitus

SOP: Small Outline Package Integrated Circuits.

SSOP: Shrink Small Package Integrated Circuits

TSOP: Tenues parvae Italic Package / tenues parvae Italic Package.

TSSOP, tenuis Shrink parva Italic Package / tenuis Shrink Parvus Italic Package

SOJ: Delineatio Integrated Circuitus cum J Leads / “J” paxillos

CFP: Ceramic Flat Packs.

PQFP: Plastic Quad Flat Pack/Plastic square Flat Pack

SQFP: Shrink Quad Flat Pack/ Shrink quadratum Flat Pack.

CQFP: Ceramic Quad Flat Pack/Ceramic square Flat Pack.

PLCC: Plastic Leaded chip Cariers/Plastic Package.

LCC: Leadless Ceramic Chip Portitores / Leadless tellus chip Carriers

QFN: Quad involucrum Flat non plumbatum/quattuor laterum paxillus minus sarcina plana.

DIP: dual-in-line components/ Dual clavum components.

PBGA: PlasTIc Ball Grid Array/PlasTIc Ball Grid Array.

RF: RF Proin cogitationes.

AX: Discretae axialis plumbatae Non polarised / Axialis Axialis Non polaris componentibus discretis.

CPAX: Capacium polarizatum, axiale / clavum axiale capacitor cum verticitate.

CPC: Capacius polarized, capacitor cylindricus

CYL: Non polarized elementum cylindricum

Diode: No.

DUXERIT: Lucem emittens Diod.

DISC: Non-polarized offset plumbatis Discs/discretis elementis cum cinguli cinguli non polarizati.

RAD: Non polarized Discretae Radiales-Plumatae/ Non polarized clavus radialis partes discretae.

TO: Transistores, JEDEC compatibilia genera/ Transistor species, JEDEC genus component.

VRES: Resistors variabilis / Novifacta potentiometer

PGA: Plastic Grid Forum/Plastic Grid Array

RELAY: RELAY/RELAY.

HAUSTUS: una-in-linea partium/singulorum ordo pin componentibus.

TRAN: Transformer/ Transformer.

PWR: Virtutis modulus/ Virtutis modulus.

CO: Crystal oscillator.

OPT: moduli Optica / fabrica Optical.

SW: Switch / Switch fabrica (praesertim non-vexillum sarcina).

IND: Inductance/inductor (c. Non-vexillum sarcina)