PCB ambalaji khopolo le mofuta wa selelekela

PCB Ho paka ke lisebelisoa tsa elektroniki, chip le likarolo tse ling (joalo ka boholo ba likarolo, bolelele le bophara, kenyelletso e otlolohileng, setsiba, boholo ba pad, bolelele ba pini le bophara, sebaka sa lipini, jj.) ka setšoantšo se hlakileng ka bitsoa ha ho atamela PCB setshwantsho.

ipcb

1) Ho paka PCB ho ka aroloa ka lisebelisoa tsa thaba, lisebelisoa tsa plug-in, lisebelisoa tse tsoakiloeng (bobeli ba mount le plug-in li teng ka nako e le ‘ngoe) le lisebelisoa tse ikhethang ho latela mokhoa oa ho kenya. Lisebelisoa tse ikhethang ka kakaretso li bua ka lisebelisoa tsa poleiti ea teba.

2) Ho paka PCB ho ka aroloa ka mekhahlelo e latelang ho latela mesebetsi le libopeho tsa sesebelisoa:

SMD: Bokaholimo ba Lisebelisoa / Lisebelisoa tsa Mount.

RA: Resistor Arrays / Resistor.

MELF: Metal elektrode sefahleho Lisebelisoa / elektrode ea tšepe e se nang likarolo tsa pheletso ea lead.

SOT: Kemiso e nyane transistor / kemiso e nyane transistor

SOD: Diode ea Kemiso e Nyane / diode e nyane ea kemiso.

SOIC: Kemiso e nyane ea Likarolo tse Kopaneng.

Fokotsa Kemiso e Nyane ea Likarolo tse Kopaneng SSOIC: Fokotsa Kemiso e Nyane ea Likarolo tse Kopaneng

SOP: Potoloho e Nyane ea Kemiso ea Potoloho.

SSOP: Fokotsa Sephutheloana se Nyane sa Lenaneo

TSOP: Sephutheloana se Sesaane sa Kemiso ea Lethathamo / Sephutheloana se Sesaane sa Kemiso.

TSSOP: Thin Shrink Small Outline Package / Thin Shrink Small Outline Package

SOJ: Lenane le lenyenyane le kopantseng lipotoloho tse nang le J Leads / “J” pin

CFP: Lipakete tsa Flat tsa Ceramic.

PQFP: Polasetiki ea Quad Flat Pack / Palo ea polasetiki ea Flat Pack

SQFP: Shrink Quad Flat Pack / Shrink square Flat Pack.

CQFP: Ceramic Quad Flat Pack / Ceramic Square Flat Pack.

PLCC: PlasTIc Leaded chip Carriers / PlasTIc Sephutheloana.

LCC: Likoloi tsa Ceramic tse sa etelletseng pele / tse sa etelletseng pele ka letsopa

QFN: Sephutheloana sa Quad Flat se sa etelletsoeng pele / pene e lehlakoreng e ‘ngoe e tlase sephutheloana sa Flat.

DIP: likarolo tse peli-ka-moleng / likarolo tse peli tsa pin.

PBGA: PlasTIc Ball Grid Array / PlasTIc Ball Grid Array.

RF: Lisebelisoa tsa microwave tsa RF.

AX: Lisebelisoa tse sa tsamaeang ka li-axial-leaded Discretes / Non-polar Axial pin discrete.

CPAX: Polarized capacitor, axial / Axial pin capacitor e nang le polarity.

CPC: Polarized capacitor, cylindrical capacitor

CYL: Karolo ea cylindrical e sa silafatsoang

DIODE: Che.

LED: Diode e khanyang.

DISC: Lisebelisoa tsa li-discs tse sa etsoang ka litšepe tse sa sebetsoeng ka polasetiki tse nang le lithakhisa tse sa sebetseng tsa Offset.

RAD: Lisebelisoa tse sa etsoang ka mahlaseli a marang-rang / lisebelisoa tse sa silafatsoang tsa Radial pin tse arohaneng.

HO: Transistors, JEDEC compaTIble mefuta / Ponahalo ea Transistor, mofuta oa karolo ea JEDEC.

VRES: Resistors e fapaneng / potentiometer e fetolehang

PGA: Grid Array / PlasTIc Grid Array

MOTSOALLE: RELAY / RELAY.

SIP: lisebelisoa tsa single-in-line / li-pin tsa mola o le mong.

TRAN: Transformer / Transformer.

PWR: Power module / Power module.

CO: Sesebelisoa sa Crystal.

KHETHA: Module ea Optical / Sesebelisoa sa Optical.

SW: Sesebelisoa sa switch / switch (haholo-holo sephutheloana se sa tloaelehang).

IND: Inductance / inductor (esp. Sephutheloana se seng se tloaelehileng)