Tsela ea ho khetha PCB thepa mantlha?

Ho khetha botenya ba konokono ea PCB e ba bothata ha boto ea potoloho e hatisitsoeng (PCB) moetsi o fumana qotsulo e kopang moralo oa li-multilayer mme litlhokahalo tsa thepa ha lia phethahala kapa ha li boleloe ho hang. Ka linako tse ling sena se etsahala hobane motsoako oa thepa ea mantlha ea PCB e sebelisitsoeng ha e bohlokoa bakeng sa ts’ebetso; If the overall thickness requirement is met, the end user may not care about the thickness or type of each layer.

ipcb

Empa ka linako tse ling, ts’ebetso e bohlokoa haholo mme botenya bo hloka ho laoloa ka thata hore e sebetse hantle. If the PCB designer clearly communicates all requirements in the documentation, then the manufacturer will know what the requirements are and will set the materials accordingly.

Litaba tse qaptjoang ke baqapi ba PCB li lokela ho tsotelloa

E thusa baqapi ho utloisisa lisebelisoa tse fumanehang le tse sebelisoang hangata, kahoo ba ka sebelisa melao e loketseng ea meralo ho aha PCBS kapele le ka nepo. Se latelang ke tlhaloso e khuts’oane ea hore na baetsi ba mefuta ba khetha ho sebelisa eng, le hore na ba ka hloka ho potoloha mosebetsi kapele ntle le ho liehisa projeke ea hau.

Utloisisa litšenyehelo tsa laminate tsa PCB le lenane la libuka

Ho bohlokoa ho utloisisa hore thepa ea laminate ea PCB e rekisoa mme e sebetsa “tsamaisong” le hore thepa ea mantlha le li-prereg tse bolokiloeng ke moetsi bakeng sa ts’ebeliso ea hanghang hangata li tsoa tsamaisong e ts’oanang. In other words, the constituent elements are all parts of a particular product, but with some variations, such as thickness, copper weight and prepreg style. Ntle le ho tseba le ho pheta-pheta, ho na le mabaka a mang a ho boloka palo e lekanyelitsoeng ea mefuta ea laminate.

Lisebelisoa tsa Prepreg le tsa mantlha tsa mantlha li hlophiselitsoe ho sebetsa ‘moho, empa li kanna tsa se sebetse hantle ha li sebelisoa hammoho le lihlahisoa tse ling. For example, the Isola 370HR core material will not be used in the same stack as the Nelco 4000-13 prepreg. It’s possible they’ll work together in some situations, but more likely they won’t. Lits’ebetso tsa lebasetere li u isa sebakeng se sa tsejoeng, moo boits’oaro ba lisebelisoa (bo tsebahalang ha bo sebelisoa e le litsamaiso tse ts’oanang) bo ke keng ba hlola bo nkuoa habobebe. Careless or unwitting mixing and matching of material types can lead to serious failures, so no manufacturer will mix and match unless the type is proven to be suitable for “mixed” stacking.

Lebaka le leng la ho boloka lethathamo la lisebelisoa tse patisaneng ke litheko tse phahameng tsa setifikeiti sa UL, ka hona ho tloaelehile indastering ea PCB ho fokotsa palo ea setifikeiti ho khetho e nyane ea lisebelisoa. Manufacturers will often agree to make products on laminate without standard stock, but be aware that they cannot provide UL certification through QC documentation. Ena ke khetho e ntle bakeng sa meralo eo e seng ea UL haeba e ka senoloa le ho lumellanoa esale pele mme moetsi o tseba litlhoko tsa ts’ebetso ea sistimi eo ho buuoang ka eona. For UL work, it is best to find out the manufacturer inventory of your choice and design boards to match it.

Ipc-4101d and foil construction

Kaha joale lintlha tsena li pepeneneng, ho na le lintho tse ling tse peli tseo u lokelang ho li tseba pele u ka qalella ho qaptjoa. Taba ea mantlha, ho molemo ho hlakisa li-laminate ho latela tlhaiso-leseling ea indasteri IPC-4101D eseng ho bolela lihlahisoa tse ikhethileng tseo e seng bohle ba ka li bolokang.

Secondly, it is easiest to construct multiple layers using the “foil” construction method. Foil construction means that the top and bottom layers (outer) are made from a single piece of copper foil and laminated to the remaining layers with prepreg. Le ha ho ka utloahala e le tlhaiso-leseling ho aha 8-layer PCB e nang le li-cores tse nang le mahlakore a mabeli, ho molemo ho sebelisa foil kantle pele, ebe ho sebelisoa li-cores tse tharo bakeng sa L2-L3, L4-L5, le L6-L7. Ka mantsoe a mang, rera ho rala mokhahlelo oa mekato e mengata e le hore palo ea li-cores e be ka tsela e latelang: (kakaretso ea likarolo tse tlositsoeng 2) e arotsoe ke 2. E latelang, ho bohlokoa ho tseba ho hong ka thepa ea mantlha. Ka bobona.

Motsoako o fanoa ka sekhechana se phekotsoeng ka botlalo sa FR4 ka koporo e tlotsitsoeng ka mahlakore ka bobeli. Lisebelisoa li na le botenya bo fapaneng, ‘me boholo bo sebelisoang khafetsa bo bolokoa ka setokong se seholo. Tsena ke botenya bo lokelang ho hopoloa kelellong, haholo ha o hloka ho odara lihlahisoa tse potlakileng tsa phetoho hore o se ke oa senya nako ea ho etella pele ea odara o emetse lisebelisoa tse sa tloaelehang hore li fihle ho morekisi.

Tloaelehileng tšepe konokono le botenya koporo

Li-cores tse sebelisoang haholo ho aha 0.062 “li-multilayers tse teteaneng ke 0.005”, 0.008 “, 0.014”, 0.021, 0.028 “, le 0.039”. Lenane la 0.047 “le lona le atile, kaha ka linako tse ling le sebelisoa ho aha liboto tse 2-layer. Motsoako o mong o tla lula o bolokoa ke 0.059 ho., Hobane o sebelisetsoa ho hlahisa li-board tse 2-ply tse 0.062 in. E tenya, empa e ka sebelisoa feela bakeng sa liboto tse ngata tse atisang, joalo ka 0.093 ho. Bakeng sa boemo bona, re lekanyetsa boholo ba moralo oa mantlha o nang le botenya ba ho qetela ba 0.062 inch.

Botenya ba koporo bo fapana ho tloha halofo ea ounce ho isa ho li-ounise tse tharo ho isa ho tse ‘ne, ho latela mochini o itseng oa sehlahisoa, empa boholo ba li-stock bo ka ba li-ounse tse peli kapa ka tlase ho moo. Boloka sena kelellong ‘me u hopole hore hoo e ka bang metšoasong eohle ho tla sebelisoa boima bo tšoanang ba koporo mahlakore ka bobeli a mantlha. Leka ho qoba litlhoko tsa moralo oa PCB tse hlokang koporo e fapaneng lehlakoreng le leng le le leng, hobane hangata sena se hloka theko e khethehileng ‘me se ka hloka litefiso tse potlakileng (ho tsamaisa ka lepotlapotla), ka linako tse ling se bile se sa fihlelle taelo ea bonyane ea morekisi.

Mohlala, haeba u batla ho sebelisa 1oz ea koporo ka sefofaneng ‘me u rera ho sebelisa H oz ea lets’oao, nahana ho etsa sefofane ho H oz kapa ho eketsa lets’oao ho 1oz ho etsa hore mantlha a sebelise mahlakore ka bobeli joaloka koporo e nang le boima. Ehlile, o ka etsa sena feela haeba o ntse o ka fihlela litlhoko tsa motlakase tsa moralo mme o na le libaka tse lekaneng tsa XY ho amohela melao e atolositsoeng ea moralo / sepakapaka ho fihlela bonyane ba 1oz mohatong oa lets’oao. Haeba o ka fihlela maemo ana, ho molemo ho o sebelisa joalo ka boima ba koporo. Ho seng joalo, o kanna oa hloka ho nahana ka matsatsi a seng makae a eketsehileng a nako ea ho etella pele.

Ha u nka hore u khethile botenya bo loketseng ba mantlha le boima ba koporo bo fumanehang, mefuta e fapaneng ea maqephe a prepreg e sebelisoa ho theha libaka tse setseng tsa dielectric ho fihlela botenya bo hlokahalang bo fihletsoe. Bakeng sa meralo e sa hlokeng taolo ea impedance, o ka tlohela khetho ea prereg ho moetsi. Ba tla sebelisa mofuta oa bona o tloaelehileng oa “standard”. Ka lehlakoreng le leng, haeba u na le litlhoko tsa impedance, bolela litlhokahalo tsena litokomaneng e le hore moetsi a ka fetola palo ea prereg lipakeng tsa li-cores ho fihlela litekanyetso tse boletsoeng.

Taolo ea impedance

Hore na taolo ea impedance ea hlokahala kapa che, ha ho khothaletsoe hore o leke ho ngola mofuta le botenya ba prepreg bakeng sa sebaka se seng le se seng ntle le haeba o tseba mokhoa ona.Hangata, mekotla e joalo e qaqileng qetellong e hloka ho fetoloa, ka hona e ka baka tieho. Sebakeng seo, pokello ea hau ea pokello e ka bonts’a botenya ba mantlha ba karolo e ka hare ea lera mme e bonts’a “boemo ba prereg bo hlokehang ho ipapisitsoe le impedance le litlhoko tsa botenya ka kakaretso”. This allows manufacturers to create ideal laminations to match your design.

Boemo

Sesepa se setle sa li-cores se ipapisitse le setoko se seng se le teng ke habohlokoa ho qoba ho lieha ho sa hlokahaleng ha o laela ho chencha kapele ka linako tse thata. Boholo ba baetsi ba PCB ba sebelisa meaho e mengata e mengata e ipapisitseng le khenele e tšoanang le eo ba qothisanang lehlokoa le eona. Ntle le ha PCB e ikhethile haholo, ha ho na boloi kapa kaho ea lekunutu. Therefore, it is worth familiarizing yourself with the preferred material for a particular layer and making every effort to design a PCB to match it. Ho tla lula ho na le mekhelo bakeng sa meralo e ikhethileng ea moralo, empa ka kakaretso, lisebelisoa tse tloaelehileng ke khetho e ntle ka ho fetisisa.