Solution to PCB lamination problem

It is impossible for us to produce PCB without problems, especially in the process of pressing. Most cases are attributed to the problems of pressing materials, so that a perfectly written PCB technical process specification cannot specify the corresponding test items for the problems occurred in PCB lamination. So here are some common ways to deal with problems.

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When we encounter the problem of PCB lamination, the first thing we should consider is to incorporate this problem into the PROCESS specification of PCB. When we enrich our technical specification step by step, quality changes will occur when a certain amount is reached. Most of the quality problems of PCB lamination are caused by the raw materials of suppliers or different lamination loads. Only a few customers can have the corresponding data records, so that they can distinguish the corresponding load value and material batch during production. As a result, serious warping occurs when THE PCB board is produced and the corresponding components are affixed, so a lot of costs will be incurred later. So if you can predict the quality control stability and continuity of PCB lamination in advance, you can avoid a lot of losses. Here is some information about raw materials.

PCB copper-clad board surface problems: poor copper structure adhesion, coating adhesion check, some parts can not be etched or part can not tin. The surface water pattern can be formed on the water surface by visual inspection method. The reason for this is that the laminator has not removed the release agent, and there are pinholes on the copper foil, resulting in resin loss and accumulation on the surface of the copper layer. Excess antioxidants are coated on the copper layer. Improper operation, a large amount of dirt grease in the board. Therefore, contact the manufacturer of laminate to check the unqualified copper layer on the surface and recommend the use of hydrochloric acid followed by the use of a machine brush to remove the foreign body on the surface. All process personnel must wear gloves, before and after the lamination process must be removed oil treatment.