Kana iyo wiring isingade yakawedzera layer, nei uchiishandisa? Kuderedza zvidimbu hazvingaiti kuti bhodhi redunhu riite mutete? Kana paine bhodhi redunhu rakaderera, mari yacho haingave yakaderera here? Nekudaro, mune zvimwe zviitiko, kuwedzera jira kunoderedza mutengo.

The Pcb bhodhi ine zvimiro zviviri zvakasiyana: core structure uye foil chimiro.

Mune yepakati chimiro, ese conductive layers muPCB board akaputirwa pane yakakosha zvinhu; mune iyo foil chimiro, iyo yemukati conductive layer yePCB board ndiyo chete yakavharwa pane yakakosha zvinhu, uye yekunze conductive layer ndeye foil-yakavharwa dielectric board. Yese conductive layers inosungirirwa pamwechete kuburikidza nedielectric uchishandisa multilayer lamination process.

Chigadzirwa chenyukireya ibhodhi rine mativi maviri akapfeka foil mufekitari. Nekuti imwe neimwe core ine mativi maviri, kana ikashandiswa zvizere, huwandu hwema conductive layers ePCB board inhamba yakaenzana. Wadii kushandisa foil kune rumwe rutivi uye musimboti chimiro kune mamwe ese?

Maitiro ekudzikisa mutengo wekugadzira uye kukotama kwePCB board

Iyo mutengo mukana weiyo-yakaverengerwa PCB

Nekuda kwekushaikwa kwedhizaini yedielectric uye foil, mutengo wezvigadzirwa zvezvisinganzwisisike-nhamba dzePCBs wakadzikira zvishoma pane wePCB ane nhamba. Nekudaro, iyo mutengo wekugadzirisa wezvisinganzwisisike-nhamba PCB mabhodhi wakakwira zvakanyanya kupfuura iwo-akaverengerwa PCB mabhodhi. Mutengo wekugadzirisa wemukati wemukati wakafanana; asi iyo foil / musimboti chimiro sezviri pachena inowedzera mutengo wekugadzirisa weiyo yekunze layer.

Odd-nhamba-nhamba PCB mabhodhi anofanirwa kuwedzera isiri-yakajairwa laminated core layer bonding process pahwaro hweiyo core structure process. Zvichienzaniswa nechimiro chenyukireya, kugona kugadzira kwemafekitari anowedzera foil kuchimiro chenyukireya kunoderera. Pamberi pe lamination uye bonding, yekunze musimboti inoda kumwe kugadzirisa, izvo zvinowedzera njodzi yekukwenya uye etch zvikanganiso pane yekunze layer.

Balance chimiro kudzivirira kukotama

Chikonzero chakanakisa chekusagadzira mabhodhi ePCB ane matinji ane nhamba isinganzwisisike ndechekuti iwo asinganzwisisike-ane manhamba akaturikidzana ePCB mabhodhi ari nyore kukotama. Kana iyo PCB bhodhi yatonhodzwa mushure meiyo multilayer yedunhu bonding process, iyo yakasiyana lamination tension yeiyo musimboti chimiro uye foil-clad dhizaini ichaita kuti bhodhi rePCB rikotame. Sezvo ukobvu hwebhodhi redunhu hunowedzera, njodzi yekukotama yemubatanidzwa PCB bhodhi ine maviri akasiyana zvimiro inova yakakura. Kiyi yekubvisa PCB bhodhi kubhenda ndeyekutora yakaringana stack. Kunyangwe iyo PCB bhodhi ine imwe dhigirii yekukotama inosangana nezvinodiwa, iyo inotevera yekugadzirisa inoshanda inodzikiswa, zvichikonzera kuwedzera kwemutengo. Nokuti midziyo yakakosha uye mhizha inodiwa panguva yegungano, kururamisa kwekuiswa kwechikamu kunoderedzwa, izvo zvinokuvadza kunaka.

Shandisa kunyange-nhamba-nhamba PCB

Kana bhodhi rePCB risinganzwisisike richionekwa mudhizaini, nzira dzinotevera dzinogona kushandiswa kuwana zvakadzikama stacking, kuderedza PCB bhodhi mutengo wekugadzira, uye kudzivirira PCB bhodhi kukotama. Nzira dzinotevera dzakarongwa maererano nezvinodiwa.

1. Chiratidzo chechiratidzo uye chishandise. Iyi nzira inogona kushandiswa kana simba rekugadzira PCB rakafanana uye chiratidzo chechiratidzo chisinganzwisisike. Iyo yakawedzerwa layer haina kuwedzera mutengo, asi inogona kupfupisa nguva yekuendesa uye kuvandudza kunaka kwePCB board.

2. Wedzera imwe simba rekuwedzera. Iyi nzira inogona kushandiswa kana simba rekugadzira PCB risinganzwisisike uye chiratidzo chechiratidzo chakaenzana. Nzira iri nyore ndeyekuwedzera jira pakati pechitubu pasina kushandura mamwe marongero. Chekutanga, tevera isinganzwisisike-nhamba PCB board wiring, wobva wakopa pasi pasi pakati, womaka zvidimbu zvasara. Izvi zvakafanana nemaitiro emagetsi emutsetse wakakora wefoiri.

3. Wedzera blank sign layer pedyo nepakati pePCB stack. Iyi nzira inoderedza kusaenzana kwekuisa uye inovandudza kunaka kwePCB board. Chekutanga, tevera zvisinganzwisisiki-zviverengo kuti uende munzira, wobva wawedzera chiratidzo chisina chinhu, uye womaka zvidimbu zvasara. Inoshandiswa mumaseketi emicrowave uye midhiya yakasanganiswa (yakasiyana dielectric constants) maseketi.

Zvakanakira zveyakaenzana laminated PCB: yakaderera mutengo, isiri nyore kukotama, kupfupisa nguva yekuendesa, uye kuve nechokwadi chemhando.