Ukuba i-wiring ayifuni umaleko owongezelelweyo, kutheni uyisebenzise? Ngaba ukunciphisa iileya bekungayi kwenza ibhodi yesekethe ibe bhityileyo? Ukuba kukho ibhodi yesekethe enye, ngaba iindleko aziyi kuba ngaphantsi? Nangona kunjalo, kwezinye iimeko, ukongeza umaleko kuya kunciphisa iindleko.

The Ibhodi PCB inezakhiwo ezibini ezahlukeneyo: isakhiwo esingundoqo kunye nesakhiwo se-foil.

Kwisakhiwo esingundoqo, zonke iileyile zokuqhuba kwibhodi yePCB zigqunywe kwizinto ezingundoqo; kwisakhiwo ifoyile, kuphela umaleko conductive yangaphakathi yebhodi PCB ziqatywe phezu impahla engundoqo, kunye umaleko conductive yangaphandle yi foil-coated ibhodi dielectric. Zonke iileyile zokuqhuba ziboshwe kunye ngokusebenzisa i-dielectric usebenzisa inkqubo yokulalisa i-multilayer.

Isixhobo senyukliya yibhodi enefoyile enamacala amabini kumzi-mveliso. Ngenxa yokuba undoqo ngamnye unamacala amabini, xa usetyenziswa ngokupheleleyo, inani leeleya zebhodi yePCB linani elilinganayo. Kutheni ungasebenzisi i-foil kwelinye icala kunye nesakhiwo esingundoqo kwabanye?

Indlela yokunciphisa iindleko zoyilo kunye nokugoba kwebhodi yePCB

Inzuzo yeendleko zePCB enenani elilinganayo

Ngenxa yokunqongophala komaleko we-dielectric kunye ne-foil, iindleko zemathiriyeli ekrwada yee-PCB ezinamanani angaqhelekanga zingaphantsi kancinci kunezo zePCB ezinamanani. Nangona kunjalo, iindleko zokusetyenzwa kweebhodi zePCB ezinamanani angaqhelekanga ziphezulu kakhulu kunezo zeebhodi zePCB ezinamanani. Iindleko zokucubungula umaleko wangaphakathi ziyafana; kodwa i-foil / i-core structure ngokucacileyo yandisa iindleko zokucubungula umaleko wangaphandle.

Iibhodi PCB ezinomnqakathi kufuneka ukongeza non-standard elaminethiweyo core bonding inkqubo yokudibanisa ngesiseko inkqubo yesakhiwo core. Xa kuthelekiswa nolwakhiwo lwenyukliya, ukusebenza kakuhle kwemveliso yeefektri ezongeza ifoyile kwisakhiwo senyukliya kuya kuncipha. Ngaphambi kokuba i-lamination kunye ne-bonding, i-core yangaphandle idinga ukuqhutyelwa okongeziweyo, okwandisa umngcipheko wokukrazula kunye neempazamo ze-etch kumaleko angaphandle.

Isakhiwo sokulinganisela ukuphepha ukugoba

Esona sizathu silungileyo sokungayila iibhodi zePCB ezinomaleko ezinamanani angaqhelekanga kukuba iibhodi zePCB ezinomaleko ezingaqhelekanga zilula ukugoba. Xa ibhodi ye-PCB ipholile emva kwenkqubo yokudibanisa i-multilayer yesekethe, ukuxinwa kwe-lamination eyahlukileyo yesakhiwo esingundoqo kunye nesakhiwo se-foil-clad siya kubangela ukuba ibhodi ye-PCB igobe. Njengoko ubukhulu bebhodi yesekethe bukhula, umngcipheko wokugoba webhodi yePCB edibeneyo enezakhiwo ezimbini ezahlukeneyo uba mkhulu. Isitshixo ekupheliseni ukugoba kwebhodi yePCB kukwamkela isitaki esilungeleleneyo. Nangona ibhodi ye-PCB enomlinganiselo othile wokugoba ihlangabezana neemfuno ezibaluliweyo, ukusebenza kakuhle kokusetyenzwa okulandelayo kuya kuncitshiswa, kubangele ukunyuka kweendleko. Ngenxa yokuba izixhobo ezikhethekileyo kunye nobugcisa bufunekayo ngexesha lokuhlanganisana, ukuchaneka kokubekwa kwecandelo kuyancitshiswa, okuya kulimaza umgangatho.

Sebenzisa iPCB enamanani alinganayo

Xa ibhodi yePCB enenombolo ezingaqhelekanga kuyilo, ezi ndlela zilandelayo zingasetyenziswa ukuphumeza ukupakishwa okulinganayo, ukunciphisa iindleko zokuvelisa ibhodi yePCB, nokuphepha ukugoba kwebhodi yePCB. Ezi ndlela zilandelayo zicwangciswe ngokulandelelana kokukhethwa.

1. Umaleko wesiginali kwaye uyisebenzise. Le ndlela ingasetyenziswa ukuba umaleko wamandla woyilo lwePCB ulinganayo kwaye umaleko wesiginali awuqhelekanga. Umaleko wongeziweyo awunyusi iindleko, kodwa unokunciphisa ixesha lokuhambisa kunye nokuphucula umgangatho webhodi yePCB.

2. Yongeza umaleko ongezelelweyo wamandla. Le ndlela ingasetyenziswa ukuba umaleko wamandla woyilo lwePCB awuqhelekanga kwaye umaleko wesiginali ulinganayo. Indlela elula kukongeza umaleko phakathi kwesitaki ngaphandle kokutshintsha ezinye izicwangciso. Okokuqala, landela iintambo zebhodi yePCB ezinamanani angaqhelekanga, emva koko ukhuphele umaleko womhlaba embindini, kwaye uphawule izaleko eziseleyo. Oku kuyafana neempawu zombane zomaleko otyebileyo wefoyile.

3. Yongeza umaleko wesignali ongenanto kufutshane nombindi wesitaki sePCB. Le ndlela inciphisa ukungalingani kokupakisha kwaye iphucula umgangatho webhodi yePCB. Okokuqala, landela iileya ezinamanani angaqhelekanga kwindlela, emva koko wongeza umaleko wesignali ongenanto, kwaye uphawule izaleko eziseleyo. Isetyenziswe kwiisekethe ze-microwave kunye nemidiya edibeneyo (ii-dielectric constants ezahlukeneyo) iisekethe.

Iingenelo ze-PCB ye-laminated elungeleleneyo: ixabiso eliphantsi, akukho lula ukugoba, ukunciphisa ixesha lokuhambisa, kunye nokuqinisekisa umgangatho.