Ungazinciphisa kanjani izindleko zokuklama nokugoba kwebhodi le-PCB?

Uma i-wiring ingadingi isendlalelo esengeziwe, kungani siyisebenzisa? Ingabe ukwehlisa izendlalelo ngeke kwenze ibhodi lesifunda libe mncane? Uma kunebhodi lesifunda elilodwa elincane, ngeke yini izindleko zibe phansi? Nokho, kwezinye izimo, ukwengeza isendlalelo kuzonciphisa izindleko.

The PCB ibhodi inezakhiwo ezimbili ezihlukene: isakhiwo esiwumgogodla kanye nesakhiwo se-foil.

Esakhiweni esiwumongo, zonke izingqimba ze-conductive ebhodini le-PCB ziboshwe ezintweni eziwumgogodla; esakhiweni se-foil, kuphela ungqimba olungaphakathi lwebhodi le-PCB olumbozwe phezu kwezinto eziyinhloko, futhi ungqimba olungaphandle lwe-conductor luyibhodi le-dielectric elihlanganiswe ne-foil. Zonke izingqimba eziqhutshwayo zihlanganiswe ndawonye nge-dielectric kusetshenziswa inqubo yokufaka i-multilayer lamination.

ipcb

Impahla yenuzi iyibhodi elifakwe ucwecwe elinezinhlangothi ezimbili efektri. Ngenxa yokuthi umongo ngamunye unezinhlangothi ezimbili, uma usetshenziswa ngokugcwele, inani lezingqimba zebhodi le-PCB liyinombolo elinganayo. Kungani ungasebenzisi i-foil ngakolunye uhlangothi kanye nesakhiwo esiyinhloko kokunye?

Indlela yokunciphisa izindleko zokuklama nokugoba kwebhodi le-PCB

Inzuzo yezindleko ze-PCB enezinombolo ezilinganayo

Ngenxa yokuntuleka kongqimba lwe-dielectric kanye ne-foil, izindleko zezinto zokusetshenziswa zama-PCB anenombolo eyinqaba ziphansi kancane kunalezo zama-PCB anezinombolo ezilinganayo. Kodwa-ke, izindleko zokucubungula zamabhodi e-PCB anenombolo eyinqaba ziphezulu kakhulu kunalezo zamabhodi e-PCB anezinombolo ezilinganayo. Izindleko zokucubungula zesendlalelo sangaphakathi ziyafana; kodwa isakhiwo se-foil/core ngokusobala sandisa izindleko zokucubungula ungqimba lwangaphandle.

Amabhodi e-PCB anezinombolo ezingavamile adinga ukungeza inqubo yokubopha ungqimba oluwumgogodla we-laminated engajwayelekile ngesisekelo senqubo yesakhiwo esiwumongo. Uma kuqhathaniswa nesakhiwo senuzi, ukusebenza kahle kokukhiqizwa kwamafekthri anezela i-foil esakhiweni senuzi kuzokwehla. Ngaphambi kwe-lamination kanye ne-bonding, i-core yangaphandle idinga ukucutshungulwa okwengeziwe, okwandisa ingozi yokuklwebheka kanye namaphutha etch kungqimba lwangaphandle.

Isakhiwo sokulinganisela ukuze ugweme ukugoba

Isizathu esingcono kakhulu sokungaklami amabhodi e-PCB anezingqimba ezinezinombolo ezingavamile ukuthi amabhodi e-PCB ezingxenyeni ezinezinombolo ezingavamile kulula ukuwagoba. Lapho ibhodi le-PCB selipholile ngemva kwenqubo yokuhlanganisa isekethe ye-multilayer, ukungezwani okuhlukile kwe-lamination kwesakhiwo esiyinhloko kanye nesakhiwo esigqoke ucwecwe kuzobangela ukuthi ibhodi le-PCB ligobe. Njengoba ukushuba kwebhodi lesifunda kwanda, ingozi yokugoba ibhodi le-PCB eliyinhlanganisela enezakhiwo ezimbili ezihlukene iba nkulu. Isihluthulelo sokuqeda ukugoba kwebhodi le-PCB ukuthatha isitaki esinokulinganisela. Nakuba ibhodi le-PCB elinezinga elithile lokugoba lihlangabezana nezidingo ezibekiwe, ukusebenza kahle kokucubungula okulandelayo kuzoncishiswa, okuzophumela ekwenyukeni kwezindleko. Ngenxa yokuthi imishini ekhethekile kanye nobuciko buyadingeka ngesikhathi sokuhlanganiswa, ukunemba kokubekwa kwengxenye kuyancishiswa, okuzolimaza ikhwalithi.

Sebenzisa i-PCB enenombolo elinganayo

Uma ibhodi le-PCB elinenombolo eyinqaba livela ekwakhiweni, izindlela ezilandelayo zingasetshenziswa ukuze kuzuzwe ukupakishwa okulinganiselwe, ukunciphisa izindleko zokukhiqiza ibhodi le-PCB, nokugwema ukugoba kwebhodi le-PCB. Izindlela ezilandelayo zihlelwa ngokulandelana okuthandwayo.

1. Isendlalelo sesignali bese usisebenzisa. Le ndlela ingasetshenziswa uma ungqimba lwamandla we-PCB yokuklama lulingana futhi ungqimba lwesignali luyinqaba. Isendlalelo esingeziwe asikhuphuli izindleko, kodwa singanciphisa isikhathi sokulethwa futhi sithuthukise ikhwalithi yebhodi le-PCB.

2. Engeza isendlalelo samandla esengeziwe. Le ndlela ingasetshenziswa uma ungqimba lwamandla we-PCB yokuklama iyinqaba futhi isendlalelo sesiginali silingana. Indlela elula iwukwengeza ungqimba phakathi kwesitaki ngaphandle kokushintsha ezinye izilungiselelo. Okokuqala, landela izintambo zebhodi le-PCB elinezinombolo ezingavamile, bese ukopisha ungqimba lomhlabathi phakathi, bese umaka izendlalelo ezisele. Lokhu kuyafana nezici zikagesi zongqimba olujiyile lwe-foil.

3. Engeza ungqimba lwesignali olungenalutho eduze nendawo emaphakathi yesitaki se-PCB. Le ndlela inciphisa ukungalingani kokunqwabelanisa futhi ithuthukise ikhwalithi yebhodi le-PCB. Okokuqala, landela izendlalelo ezinezinombolo ezingavamile ukuya emzileni, bese wengeza isendlalelo sesignali esingenalutho, bese umaka izendlalelo ezisele. Isetshenziswa kumasekhethi e-microwave nakumasekhethi wemidiya exubile (ama-dielectric constants ahlukene).

Izinzuzo ze-PCB ene-laminated elinganiselwe: izindleko eziphansi, akulula ukugoba, ukunciphisa isikhathi sokulethwa, nokuqinisekisa ikhwalithi.