Ibhodi PCB Inkcazo yokuvelisa:

Gqibezela uqhagamshelo kwiimodyuli zombane zebhodi yesekethe eprintiweyo okanye i-PCB. Ineesekethe ezizodwa nezisebenzayo. La macwecwe anelisa isidingo soomatshini beesekethe kunye neesekethe. Ibhodi ye-PCB ine-substrate yezinto zokwambathisa apho kufakwe umaleko omncinci wezixhobo eziqhubayo. Izinto ezithile ze-elektroniki zibekiwe kwizinto zokwambathisa (i-substrate) yePCB kwaye iqhagamshelwe kwisekethe yokunxibelelana ngokushushu kunye nokuncamathela. Banokusetyenziswa njengeebhodi zokutshintsha ezihambelanayo.

Abadali kulindeleke ukuba basasaze naziphi na iimpazamo ezingenamsebenzi kwisicwangciso esilungisiweyo. Nangona kunjalo, imeko iya isanda ngokungaqhelekanga njengoko imibutho emininzi ikhupha izicelo zazo zemveliso ye-PCB kubaboneleli bangaphandle.

udidi:

I-PCB yakha iwela kwiintlobo ezintathu eziphambili:

Icala elinye: Ezi PCBS zinobumba obucekeceke bokuqhuba ubushushu kunye nolwahlulo lobhedu olaminethiweyo lwe-dialectics. Izixhobo zombane ziqhagamshelwe kwelinye icala le-substrate.

Amacala aphindwe kabini: Kule PCB, izinto ezingaphezulu kunokuxhonywa kwi-substrate kune-PCB enamacala amabini.

Ii-multilayer: Izinto ezikwisiqendwana ziqhagamshelwe ngokugrumba phantsi kwimingxunya yeelectroplated kumaleko afanelekileyo esekethe. Inani lee-PCBS ze-multilayer ezifakiweyo zigqitha kwicala elinye kunye namacala amabini e-PCBS. Yenza iphethini yesekethe ibe lula.

Kukho iindidi ezimbini: iisekethi ezidityanisiweyo (ezaziwa njengeiic okanye ii-microchips) kunye neesekethe ezihlanganisiweyo. Indlela ye-IC iyafana nezinye iintlobo, kodwa iisekethe ezingaphezulu zibekwe kumphezulu weetshiphusi ezincinci. Umahluko kuphela kwiisekethi ezingumxube kukuba izinto zikhuliswa ngaphezulu endaweni yokubekwa kwindawo yokuncamathelisa.

Izixhobo:

Kwibhodi yePCB, icandelo lombane lifakwe ngaphezulu. Kukwakho neendlela ezahlukeneyo, ezinje:

Ngokusebenzisa umngxuma technology:

Kwiminyaka emininzi, iteknoloji yokufaka umngxunya isetyenziselwe ukwenza phantse zonke iibhodi zesekethe eziprintiweyo (PCBS). Inxalenye yemingxunya eqengqelekayo inyuswe ngamacala amabini e-axial. Ngamandla oomatshini, izikhokelo zigobile kwi-Angle ye-90 degrees kwaye zithengiswa kwicala elichaseneyo. Ukufakwa ngaphakathi emngxunyeni kuthembekile kakhulu njengoko kubonelela ngonxibelelwano olomeleleyo lomatshini; Nangona kunjalo, ukombiwa okongezelelweyo kwenza ukuba iibhodi zibize kakhulu ukuvelisa.

Itekhnoloji yokunyuka komhlaba:

I-SMT ingaphantsi komlingani wayo ohamba ngemingxunya. Kungenxa yokuba into ye-SMT inezikhokelo ezincinci okanye akukho zikhokelo konke konke. Yikota ukuya kweyesithathu ngomngxuma. I-PCBS enezixhobo zonyuso lomhlaba (i-SMD) azidingi kubhola kakhulu, kwaye ezi zinto zihambelana kakhulu, zivumela uxinano lwesekethe oluphezulu kwiibhodi ezincinci.

Ngedigri elungileyo yokuzenzekelayo, iindleko zomsebenzi ziyacuthwa kwaye imveliso iphuculwe ngokubonakalayo.

Design:

Abavelisi bebhodi ye-PCB basebenzisa iikhompyuter ezincedisayo (CAD) ukuyila iisampulu zesekethe ebhodini. Imisebenzi ekhethekileyo yabelwe iimveliso ezithile. Ibhodi yabalawuli kufuneka iwenzile umsebenzi, ewonyula. Isithuba esiphakathi kwesekethe kunye nendlela ehambayo imxinwa. Ihlala ikwi-0.04 intshi (1.0 mm) okanye ngaphantsi.

Iya kubonisa kwakhona ukukhokelela kwento okanye indawo yokuchukumisa kufutshane nomngxunya, kwaye le rekhodi iya kuguqulwa ibe yimiyalelo yekhompyuter ye-CNC yokomba okanye itekhnoloji yokuvelisa esetyenziswa kwiipleyiti zokuzenzekelayo ezizenzekelayo.

Printa umfanekiso onesiphene okanye imaski kubungakanani obuthile kwiphepha leplastiki elicocekileyo, umz. Nje emva kokubonisa iisampulu zesekethe. Ukuba ifoto ayilunganga, indawo engasenakuba sisampulu sesekethe iya kusekwa ngombala omnyama kwaye ipateni yesekethe iya kuvavanywa icace gca.