PCB ibhodi incazelo yokukhiqiza:

Qedela ukuxhumana kwamamojula we-elekthronikhi ibhodi lesifunda noma i-PCB. Inamasekethe asebenzayo angashadile futhi amaningi. La mapuleti anelisa isidingo semishini namasekhethi kagesi. Ibhodi le-PCB line-substrate ebonakalayo evikela indawo lapho kufakwa khona ungqimba oluncane lwento ehambayo. Izakhi ezithile ze-elekthronikhi zibekiwe kokuvikela izinto (i-substrate) ye-PCB futhi kuxhunywe kwisekethe ye-interconnect ngendlela efudumele nenamathelayo. Zingasetshenziswa futhi njengama-switchboards ahambisanayo.

Abadali kulindeleke ukuthi basabalalise noma yimaphi amaphutha angenangqondo kuhlelo oluhleliwe. Noma kunjalo, lo mkhuba uya ngokuya ungahambelani njengoba izinhlangano eziningi zisebenzisa ezinye izicelo zazo zokukhiqizwa kwe-PCB kubahlinzeki bangaphandle.

Uhlobo:

Ukwakhiwa kwe-PCB kuwela ezinhlotsheni ezintathu eziyinhloko:

Uhlangothi olulodwa: Lawa ma-PCBS anezingqimba ezincanyana zezinto eziqhuba ukushisa kanye nongqimba lwethusi le-laminated insulation dialectics. I-elekthronikhi ixhunywe kolunye uhlangothi lwe-substrate.

Emaceleni omabili: Kule PCB, izingxenye eziningi zingafakwa ku-substrate kune-PCB eyodwa emaceleni.

I-Multilayer: Izinto ezise-substrate zixhunywe ngokumba phansi emigodini ekhethiwe ku-ungqimba wesifunda ofanele. Inani lama-PCBS ama-multilayer afakiwe lidlula i-PCBS enamacala amabili nhlangothi zombili. Kwenza iphethini yesifunda ibe lula.

Kunezinhlobo ezimbili futhi: amasekhethi ahlanganisiwe (aziwa nangokuthi ama-ics noma ama-microchips) namasekhethi e-hybrid. Indlela ye-IC iyafana nezinye izinhlobo, kepha ngamasekethe amaningi aqoshwe ebusweni bamachips amancane we-silicon. Umehluko okuwukuphela kwamasekethe we-hybrid ukuthi izingxenye zikhuliswa ngaphezulu kunokuba zibekwe nge-adhesive.

Izingxenye:

Ebhodini le-PCB, ingxenye kagesi ifakwe phezulu. Kukhona namasu ahlukahlukene, njenge:

Ngokusebenzisa imbobo ubuchwepheshe:

Sekuyiminyaka eminingi, ubuchwepheshe obunemigodi busetshenziselwe ukwenza cishe wonke amabhodi wesifunda aphrintiwe (PCBS). Ingxenye yemigodi ebekiwe ifakwa yimikhombandlela emibili ye-axial. Ukuze uthole amandla womshini, ukuhola kugobeke nge-90 degree Angle futhi kuthengiswe kolunye uhlangothi. Ukukhweza ngembobo kunokwethenjelwa kakhulu njengoba kunikeza ukuxhumana okuqinile kwemishini; Kodwa-ke, ukubhola okungeziwe kwenza amabhodi abiza kakhulu ukukhiqiza.

Surface ukukhweza ubuchwepheshe:

I-SMT incane kunomlingani wayo odabula imbobo. Lokhu kungenxa yokuthi i-SMT factor inemikhombandlela emincane noma ayikho imikhondo nhlobo. Kuyikota kuya kwesithathu ngembobo. Ama-PCBS anamadivayisi we-surface mount (SMD) awadingi ukubhola okungaka, futhi lezi zinto zihlangene kakhulu, okuvumela ukuqina kwesifunda okuphezulu emabhodini amancane.

Ngokusebenzisa i-automation degree enhle, izindleko zabasebenzi ziyehliswa futhi umkhiqizo wenziwa ngcono kakhulu.

design:

Abakhiqizi bebhodi le-PCB basebenzisa izakhiwo zokudweba ezisizwa yikhompyutha (CAD) ukuklama amasampula wesifunda ebhodini. Imisebenzi ethile inikezwa kumikhiqizo ethile. Ibhodi labaqondisi kufanele lenze umsebenzi eliwubekayo. Isikhala esiphakathi kwesekethe nendlela eqhubayo sincane. Imvamisa iba ngamasentimitha angu-0.04 (1.0 mm) noma ngaphansi.

Izophinde ikhombise ukuhola kwento noma into ethintwayo eduzane nomgodi, futhi leli rekhodi lizoguqulwa libe yimiyalo yekhompyutha ephathekayo ye-CNC noma ubuchwepheshe bokukhiqiza obusetshenziswa kuzinsimbi zokushisela okuzenzakalelayo.

Phrinta isithombe noma isifihla-buso esinesici ngosayizi othize ephepheni lepulasitiki elihlanzekile, isb ngemuva nje kokukhombisa amasampula wesekethe. Uma isithombe asisihle, indawo okungenzeka ukuthi ayiseyona ingxenye yesampula yesekethe izosungulwa ngombala omnyama bese iphethini yesifunda izovivinywa icace.