Mafi mahimmancin manufar PCB Jiyya na saman shine don tabbatar da ingantaccen solderability ko kayan lantarki. Tun da jan ƙarfe na halitta yana ƙoƙarin kasancewa a cikin nau’in oxides a cikin iska, ba zai yuwu ya kasance a matsayin jan ƙarfe na asali na dogon lokaci ba, don haka ana buƙatar sauran jiyya don jan karfe.

1. Hot air leveling (tiwon spraying) zafi iska matakin, kuma aka sani da zafi iska solder leveling (wanda akafi sani da spraying tin), wani tsari ne na shafa narkakkar tin (lead) solder a saman PCB da sizing (busa). shi da iska mai zafi. Yana samar da wani shafi Layer cewa ba kawai tsayayya da jan karfe hadawan abu da iskar shaka, amma kuma samar da mai kyau solderability. Lokacin daidaitawar iska mai zafi, mai siyar da tagulla suna samar da mahaɗin tsaka-tsakin jan karfe-tin a haɗin gwiwa. Lokacin da aka daidaita PCB da iska mai zafi, dole ne a nutsar da shi a cikin narkakken solder; wukar iska tana busa abin saida ruwa kafin mai saida ya dahu; wukar iska na iya rage meniscus na solder akan saman jan karfe kuma ya hana mai siyarwar yin gauraya.

2. Organic Solderability Preservative (OSP) OSP tsari ne don kula da farfajiyar allon da aka buga (PCB) tagulla wanda ya dace da buƙatun umarnin RoHS. OSP ita ce taƙaitawar Abubuwan Kare Solderability na Organic, wanda aka fassara a matsayin Organic Solderability Preservatives a cikin Sinanci, wanda kuma aka sani da Kariyar Copper, ko Preflux a Turanci. A taƙaice, OSP ita ce ta haɓaka nau’in fim ɗin kwayoyin halitta akan sinadarai maras tsabta. Wannan Layer na fim yana da anti-oxidation, thermal shock resistance, da kuma danshi juriya don kare jan karfe surface daga tsatsa (hawan abu da iskar shaka ko sulfidation, da dai sauransu) a cikin al’ada yanayi; amma a cikin zafin jiki mai girma na walda, irin wannan fim ɗin mai kariya dole ne ya kasance mai sauƙi Yana da sauƙin cirewa da sauri ta hanyar juzu’i, ta yadda za’a iya haɗa saman jan karfe mai tsabta da aka fallasa nan da nan tare da narkakken solder a cikin haɗin gwiwa mai ƙarfi a cikin wani abu mai ƙarfi. gajeren lokaci.

3. Dukan farantin an lullube shi da nickel da zinariya

Platin nickel-zinari na allon shine a sanya wani Layer na nickel a saman PCB sannan kuma a sanya zinari. Plating na nickel yafi don hana yaduwa tsakanin zinari da jan karfe. Akwai nau’ikan zinare guda biyu na electroplated nickel: platin zinare mai laushi (zinariya zalla, saman gwal ba ya haskakawa) da kuma platin zinare mai wuya (fus ɗin yana da santsi kuma mai ƙarfi, mai jurewa, yana ɗauke da cobalt da sauran abubuwa, da saman zinari). ya fi haske). Ana amfani da gwal mai laushi musamman don waya ta gwal a lokacin tattara guntu; Ana amfani da gwal mai wuya musamman don haɗin wutar lantarki a wuraren da ba sa walda.

4. Immersion Zinare Zinare Zinare ne mai kauri Layer na nickel-gold gami da kyawawan kayan lantarki a saman jan karfe, wanda zai iya kare PCB na dogon lokaci; Bugu da kari, yana da juriya ga yanayin da sauran hanyoyin jiyya na saman ba su da. Bugu da kari, nutsewar zinari kuma na iya hana rushewar tagulla, wanda zai amfana da hadawa mara gubar.

5. Tin na nutsewa Tunda duk masu siyar da yanzu suna dogara ne akan tin, za’a iya daidaita Layer ɗin da kowane nau’in siyar. Tsarin nutsewar gwangwani na iya samar da fili mai tsaka-tsaki na jan karfe-tin lebur. Wannan fasalin yana sa kwano- nutsewa suna da kyakkyawar solderability iri ɗaya kamar matakin iska mai zafi ba tare da matsalar flatness na ciwon kai ba na daidaitawar iska; Ba za a iya adana allunan immersion na dogon lokaci ba , Dole ne a gudanar da taron bisa ga tsari na tin nutsewa.

6. Immersion Azurfa Tsarin azurfar nutsewa tsakanin kwayoyin halitta da nickel / nutsewar zinari mara amfani. Tsarin yana da sauƙi mai sauƙi da sauri; ko da an fallasa zuwa zafi, zafi da ƙazanta, azurfa na iya ci gaba da kula da ingantaccen solderability. Amma zai rasa kyalli. Azurfa nutsewa ba ta da kyakkyawan ƙarfin jiki na nickel/zuriyar nutsewa mara amfani saboda babu nickel ƙarƙashin layin azurfa.

7. Idan aka kwatanta da zinare na nutsewa, sinadari nickel palladium zinariya yana da ƙarin Layer na palladium tsakanin nickel da zinariya. Palladium na iya hana lalata lalacewa ta hanyar canjin canji da yin cikakken shirye-shirye don nutsewar zinare. An rufe zinari tam a kan palladium, yana samar da kyakkyawar fuskar sadarwa.

8. Gilashin zinari mai ƙarfi don haɓaka juriya na samfur da ƙara yawan sakawa da cirewa.