Eyona njongo isisiseko ye PCB unyango umphezulu kukuqinisekisa solderability elungileyo okanye iimpawu zombane. Ekubeni ubhedu bendalo buhlala bukhona ngendlela yee-oxides emoyeni, akunakwenzeka ukuba buhlale bubhedu bendalo ixesha elide, ngoko ke ezinye iindlela zonyango ziyafuneka kubhedu.

1. Umgangatho womoya oshushu (ukutshiza ngenkcenkce) ukulinganisa umoya oshushu, okwakwaziwa ngokuba yi-hot air solder leveling (eyaziwa ngokuba yitoti yokutshiza), yinkqubo yokugquma i-solder etyhidiweyo kumphezulu we-PCB kunye nokulinganisa (ukuvuthela) ngayo ngomoya oxinanisiweyo. Yakha umaleko wokugquma ongaxhathisi kuphela i-oxidation yobhedu, kodwa ikwabonelela nge-solderability elungileyo. Ngethuba lokunyuka komoya oshushu, i-solder kunye nobhedu zenza i-copper-tin intermetallic compound kwi-joint. Xa i-PCB ilingana nomoya oshushu, kufuneka ifakwe kwi-solder etyhidiweyo; imela yomoya ivuthela i-solder engamanzi ngaphambi kokuba i-solder iqine; imela yomoya inokunciphisa i-meniscus ye-solder kumphezulu wobhedu kwaye ithintele i-solder ekubeni ibhulorho.

2. I-Organic Solderability Preservative (OSP) i-OSP yinkqubo yonyango lomphezulu webhodi yesekethe eprintiweyo (PCB) ifoyile yobhedu ehlangabezana neemfuno zomyalelo we-RoHS. I-OSP sisishunqulelo se-Organic Solderability Preservatives, eguqulelwe njenge-Organic Solderability Preservatives ngesiTshayina, ekwaziwa njengeCopper Protector, okanye iPreflux ngesiNgesi. Ukubeka nje ngokulula, i-OSP kukukhulisa ngokwekhemikhali umaleko wefilimu ephilayo kwindawo yobhedu engenanto. Olu luhlu lwefilimu lune-anti-oxidation, ukuxhathisa ukutshitshiswa kwe-thermal, kunye nokumelana nomswakama ukukhusela ubuso bobhedu kwi-rust (i-oxidation okanye i-sulfidation, njl.) kwindawo eqhelekileyo; kodwa kwi-welding elandelayo ubushushu obuphezulu, olu hlobo lwefilimu ekhuselayo kufuneka lube lukhulu Kulula ukuba lususwe ngokukhawuleza yi-flux, ukuze indawo yobhedu evezwe ecocekileyo inokudityaniswa ngokukhawuleza kunye ne-solder etyhidiweyo ibe yinto eqinile ye-solder edibeneyo. ixesha elifutshane.

3. Ipleyiti yonke ifakwe nge-nickel negolide

I-nickel-gold plating yebhodi kukucwenga umaleko wenikeli kumphezulu we-PCB kwaye emva koko umaleko wegolide. I-nickel plating yenzelwe ukuthintela ukusasazwa phakathi kwegolide kunye nobhedu. Kukho iindidi ezimbini zegolide ye-nickel ene-electroplated: igolide ethambileyo (igolide esulungekileyo, umphezulu wegolide awubonakali uqaqambile) kunye nokufakwa kwegolide enzima (umphezulu ugudile kwaye uqinile, awunxibi, unecobalt kunye nezinye izinto, kunye nomphezulu wegolide. ibonakala iqaqambile). Igolide ethambileyo isetyenziswa ikakhulu kucingo lwegolide ngexesha lokupakishwa kwetshiphu; igolide eqinileyo isetyenziswa ikakhulu kuqhagamshelo lombane kwiindawo ezingadityaniswanga.

4. Ukuntywiliselwa kwegolide Ukuntywiliselwa kwegolide ngumaleko oshinyeneyo we-nickel-gold alloy eneempawu zombane ezilungileyo kumphezulu wobhedu, onokukhusela iPCB ixesha elide; ukongeza, nayo inonyamezelo kwimo engqongileyo ukuba ezinye iinkqubo zonyango lomphezulu azinayo. Ukongezelela, ukuntywiliselwa kwegolide kunokuthintela ukuchithwa kobhedu, okuya kuzuza indibano engenalo ilothe.

5. I-tin yokuntywila Ekubeni zonke ii-solders zangoku zisekelwe kwi-tin, i-tin layer inokuhambelana naluphi na uhlobo lwe-solder. Inkqubo yokuntywiliselwa kwe-tin inokwenza i-copper-tin intermetallic compound. Olu phawu lwenza ukuba i-tin-intywiliselwe ibe ne-solderability efanayo kunye nomgangatho womoya oshushu ngaphandle kwengxaki yokunyuka kwentloko yomgangatho womoya oshushu; iibhodi ze-tin-immersion azikwazi ukugcinwa ixesha elide , Indibano kufuneka iqhutywe ngokomyalelo we-tin yokucwina.

6. Ukuntywiliselwa kwesilivere Inkqubo yesilivere yokuntywiliselwa iphakathi kokutyabeka kwezinto eziphilayo kunye ne-electroless nickel/igolide yokuntywiliselwa. Inkqubo ilula kwaye iyakhawuleza; nokuba ibonakaliswe kubushushu, ukufuma kunye nongcoliseko, isilivere isenokugcina i-solderability elungileyo. Kodwa iya kulahlekelwa ukubengezela kwayo. Isilivere yokuntywiliselwa ayinawo amandla afanelekileyo enziwe nge-electroless nickel/igolide yokuntywiliselwa kuba akukho nickel phantsi komgangatho wesilivere.

7. Xa kuthelekiswa negolide yokuntywiliselwa, ikhemikhali yenickel palladium gold inomaleko ongezelelweyo wepalladium phakathi kwenickel negolide. I-Palladium inokuthintela umhlwa obangelwa kukusabela endaweni kwaye wenze amalungiselelo apheleleyo okuntywiliselwa kwegolide. Igolide igutyungelwe ngokuqinileyo kwi-palladium, inika indawo efanelekileyo yokudibanisa.

8. Igolide enzima ye-electroplated ukwenzela ukuba kuphuculwe ukuxhathisa ukunxiba kwemveliso kunye nokwandisa inani lokufakwa kunye nokususwa.