Morero oa mantlha oa ho PCB kalafo holim’a ke ho etsa bonnete ba hore molemo solderability kapa thepa ea motlakase. Kaha koporo ea tlhaho e atisa ho ba teng ka mokhoa oa li-oxide moeeng, ho ke ke ha etsahala hore e lule e le koporo ea pele nako e telele, kahoo ho hlokahala mekhoa e meng ea phekolo bakeng sa koporo.

1. Tekanyo ea moea o chesang (ho fafatsa ka tin) boemo ba moea o chesang, oo hape o tsejoang e le hot air solder leveling (eo hangata e tsejoang e le tin ea ho fafatsa), ke mokhoa oa ho roala lesela le qhibilihisitsoeng holim’a PCB le sizing (ho foka) e nang le moea o hatelitsoeng o futhumetseng. E etsa lera la ho roala le sa hanyetse oxidation ea koporo feela, empa hape le fana ka solderability e ntle. Nakong ea ho lekanngoa ha moea o chesang, solder le koporo li etsa motsoako oa koporo-tin intermetallic ka lenonyeletso. Ha PCB e lekanngoa ka moea o chesang, e tlameha ho qoelisoa ka har’a solder e entsoeng ka ho qhibilihisoa; thipa ea moea e phethola solder ea metsi pele solder e tiea; thipa ea moea e ka fokotsa meniscus ea solder holim’a koporo le ho thibela solder ho tloha borokhong.

2. Organic Solderability Preservative (OSP) OSP ke ts’ebetso ea phekolo ea bokaholimo ba foil ea koporo e hatisitsoeng (PCB) e fihlelang litlhoko tsa taelo ea RoHS. OSP ke khutsufatso ea Organic Solderability Preservatives, e fetoletsoeng e le Organic Solderability Preservatives ka Sechaena, e tsejoang hape e le Copper Protector, kapa Preflux ka Senyesemane. Ka mantsoe a bonolo feela, OSP ke ho holisa ka lik’hemik’hale moalo oa filimi ea tlhaho sebakeng se hloekileng sa koporo. Lera lena la filimi le na le anti-oxidation, ho hanyetsa mocheso oa mocheso, le ho hanyetsa mongobo ho sireletsa bokaholimo ba koporo ho tloha mafome (oxidation kapa sulfidation, joalo-joalo) sebakeng se tloaelehileng; empa ka mor’a moo tjheseletsa mocheso phahameng, mofuta ona oa tšireletso filimi e lokela ho ba haholo Ho bonolo ho ka potlako ho tlosoa ke flux, e le hore pepenene hloekileng koporo holim’a ka ho hang-hang ho kopantswe le ho qhibilihisoa solder ka e matla solder kopanetsweng ka haholo. nako e kgutshwane.

3. Letlapa lohle le koahetsoe ka nickel le khauta

Sekhahla sa nickel-gauta sa boto ke ho beha lesela la nickel holim’a PCB ebe lera la khauta. Nickel plating ke ho thibela karohano lipakeng tsa khauta le koporo. Ho na le mefuta e ‘meli ea khauta ea nickel e entsoeng ka electroplated: khauta e bonolo (khauta e hloekileng, bokaholimo ba khauta ha bo shebahale bo khanya) le khauta e thata ea khauta (ka holim’a metsi e boreleli ebile e thata, ha e khanye, e na le cobalt le likarolo tse ling, le bokaholimo ba khauta. e shebahala e kganya). Khauta e bonolo e sebelisoa haholo-holo bakeng sa terata ea khauta nakong ea ho paka chip; khauta e thata e sebelisoa haholo-holo bakeng sa ho hokela motlakase libakeng tseo e seng li-welded.

4. Ho qoelisoa khauta Ho qoelisoa khauta ke lesela le teteaneng la motsoako oa nickel-gold o nang le thepa e ntle ea motlakase holim’a koporo, e ka sireletsang PCB ka nako e telele; ho phaella moo, e boetse e na le mamello ho tikoloho eo mekhoa e meng ea phekolo ea holim’a metsi e se nang eona. Ho phaella moo, khauta e qoelisoang e ka boela ea thibela ho qhibiliha ha koporo, e leng ho tla thusa kopano e se nang loto.

5. Lesela la ho qoelisoa Kaha lihlahisoa tsohle tsa hona joale li thehiloe holim’a thini, lesela la thini le ka kopanngoa le mofuta ofe kapa ofe oa solder. Ts’ebetso ea ho qoelisoa ka thini e ka etsa motsoako o sephara oa koporo-tin intermetallic. Tšobotsi ena e etsa hore ho qoelisoa ka thini ho be le solderability e ntle e ts’oanang le ea moea o chesang ntle le bothata ba hlooho ea ho bata ha moea o chesang; mapolanka a ho qoelisoa ka tin a ke ke a bolokoa nako e telele haholo , Kopano e tlameha ho etsoa ho ea ka tatellano ea thini e tebang.

6. Ho qoelisoa silevera Ho qoelisoa tsamaiso ea silevera e pakeng tsa barbotage organic le electroless nickel / qoelisoa khauta. Ts’ebetso e batla e le bonolo ebile e potlakile; esita le haeba e pepesehetse mocheso, mongobo le tšilafalo, silevera e ntse e ka boloka solderability e ntle. Empa e tla lahleheloa ke khanya ea eona. Silevera ea ho qoelisoa ha e na matla a matle a ‘mele a nickel e se nang motlakase / khauta ea ho qoelisoa hobane ha ho na nickel tlas’a lera la silevera.

7. Ha ho bapisoa le khauta e qoelisoang, k’hemik’hale ea nickel palladium khauta e na le lesela le eketsehileng la palladium pakeng tsa nickel le khauta. Palladium e ka thibela kutu e bakoang ke karabelo e ncha le ho etsa litokisetso tse felletseng tsa ho qoelisoa ka khauta. Khauta e koahetsoe ka thata holim’a palladium, e fana ka sebaka se setle sa ho kopana.

8. Khauta e thata ea electroplated e le ho ntlafatsa ho hanyetsa ho apara ha sehlahisoa le ho eketsa palo ea ho kenngoa le ho tlosoa.