PCB pamusoro pekurapa maitiro

Chinangwa chikuru che PCB kurapa kwepamusoro ndeyekuona solderability yakanaka kana zvinhu zvemagetsi. Sezvo mhangura yechisikigo inowanzove iripo muchimiro cheokisidhi mumhepo, hazvibviri kuramba semhangura yepakutanga kwenguva yakareba, saka mamwe marapirwo anodiwa pamhangura.

1. Kuisa mhepo inopisa (tin spraying) kupisa kwemhepo, kunozivikanwawo semhepo inopisa solder leveling (inowanzozivikanwa sekupfapfaidza tin), maitiro ekuputira tani yakanyungudutswa (lead) pamusoro pePCB uye sizing (kuvhuvhuta) iyo nemhepo inopisa yakamanikidzwa. Iyo inoumba chifukidziro chekuputira icho kwete chete chinopikisa mhangura oxidation, asiwo inopa yakanaka solderability. Munguva yekupisa kwemhepo, solder nemhangura zvinoumba copper-tin intermetallic compound pajoini. Kana PCB yaenzaniswa nemhepo inopisa, inofanira kunyura mu solder yakanyungudutswa; banga remhepo rinofuridza solder yemvura isati yaoma solder; banga remhepo rinogona kuderedza meniscus ye solder pamusoro pemhangura uye kudzivirira solder kubva pabhiriji.

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2. Organic Solderability Preservative (OSP) OSP inzira yekurapa pamusoro peyakadhindwa redunhu board (PCB) foil yemhangura inoenderana nezvinodiwa zveRoHS rairo. OSP ndiyo chidimbu cheOrganic Solderability Preservatives, chinoshandurwa seOrganic Solderability Preservatives muchiChinese, chinozivikanwawo seCopper Protector, kana Preflux muChirungu. Zvichitaurwa zviri nyore, OSP ndeyekugadzira nemakemikari chidimbu che organic firimu panzvimbo yakachena isina mhangura. Iyi firimu yefirimu ine anti-oxidation, thermal shock resistance, uye hunyoro hunodzivirira kuchengetedza mhangura kubva kune ngura (oxidation kana sulfidation, nezvimwewo) munzvimbo yakajairika; asi mune inotevera welding tembiricha yakakwira, iyi mhando yefirimu inodzivirira inofanira kunge yakanyanya Zviri nyore kukurumidza kubviswa nekuyerera, kuitira kuti iyo yakafumurwa yakachena mhangura pamusoro inogona kusanganiswa nekukasira pamwe neyakanyungudutswa solder kuita yakasimba solder joint mune zvakanyanya. nguva pfupi.

3. Iyo ndiro yose yakaputirwa nickel negoridhe

Iyo nickel-goridhe plating yebhodhi ndeyekuisa dhizaini yenickel pamusoro pePCB uyezve chidimbu chegoridhe. Iyo nickel plating inonyanya kudzivirira kupararira pakati pegoridhe nemhangura. Kune marudzi maviri e electroplated nickel goridhe: goridhe rakapfava (goridhe rakachena, iyo goridhe pamusoro hairatidzike kupenya) uye yakaoma goridhe plating (iyo yepamusoro inotsvedzerera uye yakaoma, isingapfeki, ine cobalt nezvimwe zvinhu, uye pamusoro pegoridhe. inotaridzika kupenya). Ndarama yakapfava inonyanya kushandiswa kugadzira waya yegoridhe panguva yekurongedza chip; goridhe rakaomarara rinonyanya kushandiswa pakubatanidza magetsi munzvimbo dzisiri-welded.

4. Kunyudza goridhe Kunyudza goridhe indara yakakora yenickel-goridhe alloy ine yakanaka magetsi emagetsi pamusoro pemhangura, inogona kudzivirira PCB kwenguva refu; uyezve, inewo kushivirira kune zvakatipoteredza izvo mamwe maitiro ekurapa epamusoro haana. Mukuwedzera, kunyudzwa kwegoridhe kunogonawo kudzivirira kuparara kwemhangura, iyo inobatsira musangano usina hutungamiri.

5. Immersion tin Sezvo vatengesi vese vemazuva ano vakavakirwa parata, tin layer inogona kufananidzwa nemhando ipi neipi ye solder. Iyo tin-immersion process inogona kuita flat copper-tin intermetallic compound. Iyi ficha inoita kuti tin-immersion ive neyakafanana yakanaka solderability sekupisa-mhepo kuenzana pasina musoro kufuratira dambudziko rekupisa-mhepo; tin-immersion boards haigoni kuchengetwa kwenguva yakareba , Gungano rinofanira kuitwa maererano nehurongwa hwekunyura.

6. Kunyudza sirivha Kunyudzwa kwesirivheri maitiro ari pakati peiyo organic coating uye electroless nickel / kunyudza goridhe. Nzira yacho iri nyore uye inokurumidza; kunyange kana akafumurwa kupisa, mwando uye kusvibiswa, sirivha anogona kuramba zvakanaka solderability. Asi inozorasikirwa nekupenya kwayo. Sirivha yekunyudzwa haina simba remuviri re electroless nickel / kunyudza goridhe nekuti hapana nickel pasi pe sirivheri.

7. Kana ichienzaniswa negoridhe rakanyudzwa, kemikari nickel palladium gold ine imwe layer yepalladium pakati penickel negoridhe. Palladium inogona kudzivirira ngura kunokonzerwa nekutsiva kuita uye kuita gadziriro yakazara yekunyudza goridhe. Ndarama yakafukidzwa zvakasimba palladium, ichipa yakanaka yekubata kumeso.

8. Goridhe yakaoma electroplated kuitira kuti uvandudze kupfeka kuramba kwechigadzirwa uye kuwedzera nhamba yekuisa nekubvisa.