Nānā nui kēia ʻatikala i nā kaʻina hana ʻelua i hoʻohana pinepine ʻia ma ka PCB kaʻina hana lapaʻau ili: kemika nickel gula a me ka OSP kaʻina hana a me nā ʻano.

1. Ke gula nikela kemika

1.1 Nā ʻanuʻu kumu

Degreasing → holoi wai → neutralization → holoi wai → micro-etching → holoi wai → pre-soking → palladium activation → puhi a hoʻoulu wai holoi → electroless nickel → holoi wai wela → electroless gula → hana hou i ka wai holoi → holoi wai ma hope o ka mālama ʻana → hoʻomaloʻo

1.2 Electroless nickel

A. ʻO ka mea maʻamau, ua māhele ʻia ka nickel electroless i nā ʻano “displacement” a me “self-catalyzed”. Nui nā ʻano hoʻohālikelike, akā ʻaʻohe mea ʻē aʻe, ʻoi aku ka maikaʻi o ka uhi ʻana i ka wela kiʻekiʻe.

B. ʻO Nickel Chloride (Nickel Chloride) ke hoʻohana mau ʻia e like me ka paʻakai nickel

C. ʻO nā mea hoʻohaʻahaʻa maʻamau i hoʻohana ʻia ʻo Hypophosphite/Formaldehyde/Hydrazine/Borohydride/Amine Borane

ʻO D. Citrate ka mea hana chelating maʻamau.

E. Pono e hoʻoponopono ʻia ka pH o ka wai ʻauʻau. Ma ka maʻamau, hoʻohana ʻia ka ammonia (Amonia), akā aia kekahi mau ʻano hoʻohana e hoʻohana i ka ammonia triethanol (Triethanol Amine). Ma waho aʻe o ka pH hiki ke hoʻololi ʻia a me ka paʻa o ka ammonia i nā wela kiʻekiʻe, ua hui pū me ka sodium citrate e hana i ka huina o ka metala nickel. ʻO Chelating agent, i hiki ke waiho ʻia ka nickel ma nā ʻāpana i uhi ʻia me ka maʻalahi a me ka maikaʻi.

F. Ma waho aʻe o ka hoʻohaʻahaʻa ʻana i nā pilikia haumia, ʻo ka hoʻohana ʻana i ka sodium hypophosphite he hopena nui hoʻi i ka maikaʻi o ka uhi.

G. ʻO kēia kekahi o nā kumu hoʻohālike no nā pahu nickel kemikala.

ʻIkepili hiʻohiʻona formulation:

A. Ka hopena waiwai o ka PH: hiki mai ka turbidity i ka emi o ka pH ma mua o 8, a e hiki mai ka decomposition ke kiʻekiʻe ka pH ma mua o 10. ʻAʻohe hopena maopopo i ka ʻike phosphorus, deposition rate a me ka phosphorus content.

B. ʻO ka hopena o ka mahana: he hopena nui ka mahana i ka nui o ka ua, ua lohi ka hopena ma lalo o 70 ° C, a ua wikiwiki ka wikiwiki ma luna o 95 ° C a hikiʻole ke mālamaʻia. ʻO 90 ° C ka mea maikaʻi loa.

C. I ka haku mele ‘ana, ua ki’eki’e ka sodium citrate, pi’i ka chelating agent, emi ka deposition rate, a pi’i ka phosphorus me ka chelating agent concentration. Hiki ke kiʻekiʻe ka phosphorus o ka ʻōnaehana triethanolamine e like me 15.5%.

D. E like me ka hoʻonui ʻana o ka mea hoʻohaʻahaʻa sodium dihydrogen hypophosphite, piʻi ka deposition rate, akā hoʻoheheʻe ka wai ʻauʻau i ka wā ma mua o 0.37M, no laila ʻaʻole kiʻekiʻe ke kiʻekiʻe, kiʻekiʻe loa ka pōʻino. ʻAʻohe pilina maopopo ma waena o ka phosphorus maʻiʻo a me ka mea hoʻohaʻahaʻa, no laila, kūpono ka mālama ʻana i ka ʻike ma kahi o 0.1M.

E. E pili ana ka mana’o o ka triethanolamine i ka mea phosphorus o ka uhi a me ka helu deposition. ʻO ke kiʻekiʻe o ka ʻike, ʻoi aku ka haʻahaʻa o ka phosphorus a me ka lohi o ka waiho ʻana, no laila ʻoi aku ka maikaʻi o ka mālama ʻana ma kahi o 0.15M. Ma kahi o ka hoʻoponopono ʻana i ka pH, hiki ke hoʻohana ʻia e like me ka chelator metala.

F. Mai ka kūkākūkāʻana, uaʻikeʻia e hiki ke hoʻololi pono i ka sodium citrate concentration e hoʻololi pono i ka mea phosphorus o ka uhi.

H. Māhele ʻia nā mea hoʻohaʻahaʻa maʻamau i ʻelua mau ʻāpana:

ʻO ka ʻili keleawe ka nui o ka ʻili ʻole i hoʻāla ʻia i mea e hoʻoulu ai i ka uila maikaʻi ʻole e hoʻokō i ka pahuhopu o ka “open plating”. Hoʻohana ka ʻili keleawe i ke ʻano palladium electroless mua. No laila, aia ka phosphorus eutectosis i ka hopena, a he mea maʻamau ka 4-12% phosphorus. No laila, i ka nui o ka nickel, lilo ka uhi i kona elasticity a me ka magnetism, a piʻi ka brittle gloss, he mea maikaʻi ia no ka pale ʻana i ka ʻōpala a maikaʻi ʻole no ka hoʻopaʻa ʻana i ka uea a me ka wili.

1.3 ʻaʻohe gula uila

A. Ua hoʻokaʻawale ʻia ke gula electroless i “gula displacement” a me “gula electroless”. ʻO ka mua ka mea i kapa ʻia ʻo “immersion gold” (lmmersion Gold plaTIng). He lahilahi ka papa hoʻopalapala a paʻa ka ʻili lalo. ʻAe ka mea hope i ka mea hoʻohaʻahaʻa e hoʻolako i nā electrons i hiki i ka papa plating ke hoʻomau i ka mānoanoa o ka nickel electroless.

B. ʻO ke ʻano maʻamau o ka hoʻohaʻahaʻa hoʻohaʻahaʻa ʻana: ʻo ka hoʻemi ʻana i ka hapalua pane: Au e- Au0 oxidation half reaction formula: Reda Ox e- piha pane ʻana: Au Red aAu0 Ox.

C. Ma waho aʻe o ka hāʻawi ʻana i nā kumu gula paʻakikī a me ka hoʻohaʻahaʻa ʻana i nā mea hoʻohaʻahaʻa, pono e hoʻohana ʻia ke ʻano hoʻohālikelike gula electroless me ka hui pū ʻana me nā mea chelating, stabilizers, buffers a me nā mea pehu e pono ai.

D. Hōʻike kekahi mau hōʻike noiʻi i ka maikaʻi a me ka maikaʻi o ke gula kemika. ʻO ke kohoʻana i nā mea hoʻohaʻahaʻa ke kī. Mai ka formaldehyde mua a hiki i nā pūhui borohydride hou, ʻo ka potassium borohydride ka hopena maʻamau. ʻOi aku ka maikaʻi inā hoʻohana pū ʻia me nā mea hoʻemi ʻē aʻe.

E. Hoʻonui ka deposition rate o ka uhi me ka piʻi ʻana o ka potassium hydroxide a me ka hoʻohaʻahaʻa ʻana i ka mea hana a me ka mahana ʻauʻau, akā e emi iho me ka piʻi ʻana o ka potassium cyanide concentration.

F. ʻO ka mahana hana o nā kaʻina hana pāʻoihana ma kahi o 90 ° C, kahi hōʻike nui no ka paʻa o nā mea.

G. Inā ulu ka ʻaoʻao ma luna o ke pani kaapuni lahilahi, hiki ke hoʻopilikia i ka pōʻino.

H. He mea maʻalahi ke gula lahilahi i ka porosity a maʻalahi e hana i ka Galvanic Cell Corrosion K. Hiki ke hoʻonā ʻia ka pilikia porosity o ka papa gula lahilahi e ka passivation post-processing i loaʻa ka phosphorus.