Improper operation of wave soldering will cause a batch of PCB solder joints to be short-circuited and tinned. Short-circuiting of PCB solder joints with tin is also the most common soldering failure among manufacturers in wave soldering. It is caused by many reasons. Let’s analyze with you the reasons why the PCB board is short-circuited and tinned after wave soldering.

1. The tin liquid has not reached the normal working temperature, and there is a “tin wire” bridge between the solder joints.

2. The direction of the substrate is not well matched with the tin wave. Change the direction of the tin.

3. Poor circuit design: The circuits or contacts are too close (there should be a distance of more than 0.6mm); if they are arranged solder joints or ICs, you should consider stealing solder pads or use white paint to separate them. The thickness of the white paint must be more than twice the thickness of the soldering pad (gold path).

4. The contaminated tin or the excessively accumulated oxides are brought on by the PUMP to cause a short circuit. The tin furnace should be cleaned or the solder in the tin bath should be completely renewed.

5. The continuous tin may be caused by insufficient preheating temperature to cause the component method to reach the temperature. During the soldering process, due to the large heat absorption of the component, it will lead to poor tin dragging and form continuous tin; it may also be the temperature of the tin furnace is low, or the welding speed is too fast .

Through the above five-point analysis, it should be possible to find the reason why the PCB board is short-circuited and tinned after wave soldering. If the above five-point investigation still cannot find the reason, it is probably the wave soldering problem. For example, the display temperature and the actual temperature of wave soldering are different.