PCB are made mainly by stacking copper and resin:

Core material, copper clad plate

Semi-cured resin material, prepreg

Copper foil with circuit design

Solder resist ink

Core material, copper clad plate

This is the material that forms the basis of sheet manufacturing. Made by impregnating a glass cloth with highly insulating glass fibers made of resin.

Copper-clad laminates are important in the characteristics of printed circuit boards.

Semi-cured resin material, prepreg

This material is more commonly needed for multilayer boards, which are made by impregnating glass cloth with resin and curing it into a semi-cured state.

The tensile, strength, heat resistance and low dielectric constant of the material vary with the composition of the glass and the weaving of the glass cloth and the composition of the impregnated resin.

Copper foil with circuit design

Made from electrolytic copper foil, like the copper plate of aluminum foil, with a purity of more than 99.8%.

Solder resist ink

An insulating ink that protects the surface of a printed circuit board, protects the circuit diagram of the circuit board from moisture, and maintains insulation.

Prevents solder from sticking to parts other than mounting points when mounting parts to printed circuit boards.