PCB zenziwa ikakhulukazi ngokufaka ithusi nenhlaka:

I-core material, ipuleti le-copper clad

I-resin material ephulukisiwe, i-prepreg

I-foil yethusi enomklamo wesifunda

Uyinki wokumelana ne-solder

I-core material, ipuleti le-copper clad

Lokhu kuyizinto ezakha isisekelo sokukhiqiza amashidi. Yenziwe ngokufaka indwangu yengilazi enemicu yengilazi evikela kakhulu eyenziwe nge-resin.

Ama-laminates ane-Copper-clad abalulekile ezicini zamabhodi wesifunda aphrintiwe.

I-resin material ephulukisiwe, i-prepreg

Le nto idingeka kakhulu kumabhodi ama-multilayer, enziwa ngokumithisa indwangu yengilazi nge-resin nokuyiphulukisa ibe esimweni eselapheka kancane.

Ukuqina, amandla, ukumelana nokushisa kanye nokungaguquki kwe-dielectric okuphansi kwempahla kuyahlukahluka ngokubunjwa kwengilazi nokwelukwa kwendwangu yengilazi kanye nokwakheka kwe-resin efakiwe.

I-foil yethusi enomklamo wesifunda

Yenziwe ngecwecwe lethusi le-electrolytic, njengepuleti lethusi le-aluminium ucwecwe, nobumsulwa obungaphezu kuka-99.8%.

Uyinki wokumelana ne-solder

Uyinki ovikelayo ovikela ingaphezulu lebhodi lesekethe eliphrintiwe, uvikela umdwebo wesifunda webhodi lesifunda kumswakama, futhi ugcina ukwahlukanisa.

Ivimbela i-solder ekunamatheleni kwezinye izingxenye ngaphandle kwamaphoyinti okukhweza lapho ukhweza izingxenye kumabhodi esekethe aphrintiwe.