Aikace -aikacen fasahar sarrafa laser a m kewaye hukumar

Babban katako mai sauƙin sassauƙa yanki ne na duk madaidaiciyar madaidaiciyar madaidaiciya, wacce aka ayyana gaba ɗaya azaman layin ƙasa da 200 μ M ko micro ta hanyar ƙasa da μ 250 μ M m. Babban katako mai sauƙin sassauƙa yana da aikace -aikace iri -iri, kamar sadarwa, kwamfutoci, da’irori masu haɗawa da kayan aikin likita. Yin niyya kan kaddarori na musamman na kayan katako mai sassauƙa, wannan takarda tana gabatar da wasu mahimman matsalolin da za a yi la’akari da su a cikin sarrafa laser na katako mai sauƙin sassauƙa da micro ta hanyar hakowa p>

Siffofin musamman na hukumar da’irar mai sassaucin ra’ayi ta sa ta zama madaidaicin madaidaiciyar madaidaiciyar madaidaiciya da tsarin wayoyin gargajiya a lokuta da yawa. A lokaci guda kuma, yana inganta ci gaban sabbin fannoni da yawa. Mafi saurin haɓaka FPC shine layin haɗin ciki na rumbun kwamfutarka (HDD). Shugaban magnetic na diski mai wuya zai koma da baya a kan faifai mai jujjuyawa don dubawa, kuma ana iya amfani da madaidaicin madaidaicin don maye gurbin waya don gane haɗin tsakanin shugaban maganadisu na hannu da hukumar kewaye. Masu kera faifan diski suna haɓaka samarwa da rage farashin taro ta hanyar fasaha da ake kira “dakatar da farantin da aka dakatar” (FOS). Bugu da ƙari, fasahar dakatarwa mara waya tana da mafi kyawun juriya na girgizar ƙasa kuma tana iya haɓaka amincin samfur. Wani katako mai sassauƙa mai sauƙin sassauƙa da ake amfani da shi a cikin rumbun kwamfutarka shine lanƙwasa interposer, wanda ake amfani dashi tsakanin dakatarwa da mai sarrafawa.

Filin girma na biyu na FPC shine sabon fakitin kewaye. Ana amfani da da’irori masu sassauƙa a cikin kwandon matakin guntu (CSP), ƙirar guntu da yawa (MCM) da guntu a kan katako mai sassauƙa (COF). Daga cikin su, da’irar ciki ta CSP tana da babbar kasuwa, saboda ana iya amfani da ita a cikin na’urorin semiconductor da ƙwaƙwalwar filasha, kuma ana amfani da ita sosai a cikin katunan PCMCIA, faifan faifai, mataimakan dijital na sirri (PDAs), wayoyin hannu, pagers Kamara Dijital da kyamarar dijital . Bugu da ƙari, nuni na kristal na ruwa (LCD), sauya fim ɗin polyester da harsashi mai buga tawada-jet wasu filayen aikace-aikacen girma uku ne na babban madaidaiciyar madaidaiciya.

Kwarewar kasuwa na fasahar layin sassauƙa a cikin na’urori masu ɗaukuwa (kamar wayoyin hannu) suna da girma sosai, wanda na halitta ne, saboda waɗannan na’urori suna buƙatar ƙaramin ƙima da nauyi don biyan bukatun masu amfani; Bugu da ƙari, sabbin aikace -aikace na fasaha mai sassauƙa sun haɗa da nunin faifai da na’urorin likitanci, waɗanda masu zanen kaya za su iya amfani da su don rage ƙima da nauyin samfura kamar kayan ji da shigar mutum.

Babban girma a cikin filayen da ke sama ya haifar da ƙaruwa a cikin fitarwa na duniya na sassauƙan allon kewaye. Misali, ana sa ran adadin tallace -tallace na rumbun kwamfutoci na shekara -shekara zai kai raka’a miliyan 345 a 2004, kusan sau biyu na 1999, kuma adadin tallace -tallace na wayoyin hannu a 2005 an ƙididdige shi zuwa raka’a miliyan 600. Waɗannan haɓaka suna haifar da ƙaruwa na shekara-shekara na 35% a cikin fitowar katako mai sassauƙa mai ƙarfi, ya kai murabba’in miliyan 3.5 ta 2002. Irin wannan buƙatu mai girma yana buƙatar fasaha mai aiki mai inganci kuma mai arha, kuma fasahar sarrafa laser na ɗaya daga cikinsu .

Laser yana da manyan ayyuka guda uku a cikin tsarin kera jirgi mai sassauƙa: sarrafawa da kafa (yankan da yankan), yankan da hakowa. A matsayin kayan aikin injin da ba a tuntuɓe ba, ana iya amfani da laser a cikin ƙaramin mayar da hankali (100 ~ 500) μ m) Ana amfani da babban ƙarfin haske mai ƙarfi (650MW / mm2) akan kayan. Ana iya amfani da irin wannan babban ƙarfin don yankan, hakowa, sa alama, walda, sa alama da sauran aiki. Gudun sarrafawa da inganci suna da alaƙa da kaddarorin kayan sarrafawa da halayen laser da ake amfani da su, kamar raƙuman ruwa, ƙarfin kuzari, ƙarfin ganiya, faɗin bugun jini da mita. Gudanar da katako mai sassauƙa yana amfani da hasken ultraviolet (UV) da laser infrared (FIR). Tsohon yana amfani da excimer ko UV diode pumped solid-state (uv-dpss) lasers, yayin da na ƙarshe gabaɗaya yana amfani da CO2 lasers div>

Fasahar siyan Vector tana amfani da kwamfuta don sarrafa madubin da ke sanye da mitar kwarara da software na CAD / CAM don ƙirƙirar zane da hakowa, kuma yana amfani da tsarin ruwan tabarau na telecentric don tabbatar da cewa Laser ɗin yana haskakawa tsaye akan saman aikin < / div>

Laser hakowa aiki yana da babban madaidaici da fa’ida mai yawa. Yana da ingantaccen kayan aiki don ƙirƙirar katako mai sassauƙa. Ko Laser CO2 ko Laser DPSS, ana iya sarrafa kayan cikin kowane siffa bayan an mai da hankali. Yana harba katako na laser da aka mayar da hankali a ko’ina akan farfajiyar aikin ta hanyar sanya madubi akan galvanometer, sannan yana gudanar da sarrafa lamba ta kwamfuta (CNC) akan galvanometer ta amfani da fasahar binciken vector, kuma yana yin yankan zane tare da taimakon software CAD / CAM. Wannan “kayan aiki mai taushi” zai iya sarrafa laser cikin sauƙi a cikin ainihin lokacin da aka canza ƙirar. Ta hanyar daidaita ƙwanƙwasa haske da kayan aikin yankan iri -iri, sarrafa laser na iya sake tsara zane -zanen daidai, wanda shine wani babban fa’ida.

Binciken vector na iya yanke substrates kamar fim ɗin polyimide, yanke duk kewaye ko cire yanki a kan allon da’irar, kamar rami ko toshe. A yayin aiwatarwa da kafawa, ana kunna katako na laser koyaushe lokacin da madubi ke bincika dukkan aikin sarrafawa, wanda yake akasin tsarin hakowa. Yayin hakowa, ana kunna laser ne kawai bayan an gyara madubi a kowane wurin hakowa div>

sashe

“Slicing” a cikin jargon shine aiwatar da cire ɗayan kayan abu daga wani tare da laser. Wannan tsari ya fi dacewa da laser. Za’a iya amfani da fasahar sikirin vector iri ɗaya don cire mutuƙar wutar lantarki da fallasa kushin da ke ƙasa. A wannan lokacin, babban madaidaicin sarrafa laser yana sake nuna fa’idodi masu yawa. Tunda hasken FIR zai nuna ta hanyar jan ƙarfe, galibi ana amfani da laser CO2 anan.

huda rami

Kodayake wasu wurare har yanzu suna amfani da hakowa na injin, stamping ko plasma etching don samar da micro ta cikin ramuka, hakowa na laser har yanzu shine mafi yawan amfani da micro ta hanyar rami da ke samar da hanyar katako mai sassauƙa, galibi saboda babban ƙarfin sa, sassauƙar ƙarfi da tsawon lokacin aiki na al’ada. .

Haɗin injin da hatimi yana ɗaukar raƙuman madaidaiciyar madaidaiciya kuma ya mutu, wanda za’a iya yin shi akan katako mai sassauƙa tare da diamita kusan 250 μ M, amma waɗannan madaidaitan na’urori suna da tsada sosai kuma suna da ɗan gajeren rayuwar sabis. Dangane da madaidaiciyar madaidaiciyar madaidaiciyar madaidaiciya, ramin ramin da ake buƙata shine 250 μ M ƙarami ne, don haka ba a fifita hako injin.

Za’a iya amfani da plasma etching a 50 μ M m polyimide film substrate tare da girman da bai wuce 100 μ M ba, amma kayan aikin saka hannun jari da farashin aiwatarwa sun yi yawa sosai, kuma farashin kula da tsarin etching na plasma shima yana da girma sosai, musamman farashin da ya shafi ga wasu magungunan sharar gida da abubuwan amfani. Bugu da ƙari, yana ɗaukar lokaci mai tsawo don etching na plasma don yin madaidaicin abin dogaro na micro vias lokacin kafa sabon tsari. Amfanin wannan tsari shine babban dogaro. An ba da rahoton cewa ƙimar micro ta hanyar shine 98%. Sabili da haka, etching na plasma har yanzu yana da takamaiman kasuwa a cikin kayan aikin likitanci da avionics div>

Sabanin haka, kirkirar micro vias ta hanyar Laser tsari ne mai sauki da tsada. Zuba jarin kayan aikin Laser yana da ƙarancin ƙarfi, kuma laser kayan aiki ne da ba a tuntuɓe. Ba kamar hako injin ba, za a sami tsadar kayan aiki mai tsada. Bugu da kari, CO2 na zamani da laser uv-dpss ba su da kyauta, wanda zai iya rage lokacin aiki kuma yana haɓaka haɓaka ƙima.

Hanyar samar da micro vias akan katako mai sassauƙa daidai yake da na pcb mai ƙarfi, amma ana buƙatar canza wasu mahimman sigogi na laser saboda bambancin substrate da kauri. Rufe CO2 da uv-dpss lasers na iya amfani da fasahar sikelin vector iri ɗaya kamar gyare-gyare don haƙa kai tsaye a kan madaidaiciyar allon kewaye. Bambanci kawai shine software na aikace -aikacen hakowa zai kashe Laser yayin sikirin madubin dubawa daga micro zuwa wani. Ba za a kunna katakon Laser ba har sai ya kai wani wurin hakowa. Domin yin rami daidai da farfajiyar madaidaicin madaidaiciyar madaidaiciyar madaidaicin katako, dole ne katako na Laser ya haskaka a tsaye a kan matattarar jirgin da’irar, wanda za a iya cimma ta hanyar amfani da tsarin ruwan tabarau na telecentric tsakanin madubin dubawa da substrate (Fig. 2) ) gaba>

An haƙa ramukan akan Kapton ta amfani da Laser UV

Laser CO2 kuma yana iya amfani da fasahar abin rufe fuska don hako micro vias. Lokacin amfani da wannan fasaha, ana amfani da saman jan ƙarfe azaman abin rufe fuska, ana toshe ramukan akan shi ta hanyar hanyar bugawa ta yau da kullun, sannan kuma ana haska katako na CO2 akan ramukan murfin jan ƙarfe don cire kayan mutuƙar da aka fallasa.

Hakanan ana iya yin micro vias ta amfani da laser excimer ta hanyar abin rufe fuska. Wannan fasaha tana buƙatar yin taswirar hoton micro ta hanyar ko gaba ɗaya micro ta hanyar tsararraki zuwa substrate, sannan ƙwaƙƙwaran katako na laser yana haskaka abin rufe fuska don yin taswirar hoton abin rufe fuska zuwa saman ƙasa, don ramin rami. Ingancin hakar Laser excimer yana da kyau sosai. Rashin hasararsa shine ƙarancin gudu da tsada.

Zaɓin Laser kodayake nau’in Laser don sarrafa katako mai sassauƙa iri ɗaya ne da wancan don sarrafa pcb mai ƙarfi, bambancin kayan aiki da kauri zai shafi sigogin sarrafawa da sauri. Wani lokaci ana iya amfani da Laser excimer da isasshen gas mai daɗi (shayi) CO2 laser, amma waɗannan hanyoyin guda biyu suna da saurin jinkiri da ƙimar kulawa mai ƙarfi, wanda ke iyakance haɓaka haɓaka aiki. A kwatankwacin, CO2 da uv-dpss lasers ana amfani da su sosai, da sauri da ƙarancin farashi, don haka galibi ana amfani da su a ƙirƙira da sarrafa micro vias na allon allon m.

Ya bambanta da iskar gas CO2 laser, hatimin CO2 laser （http://www.auto-alt.cn technology An saki fasahar sakin toshe don iyakance cakuda iskar gas ɗin zuwa ramin Laser da keɓaɓɓun faranti na rectangular biyu. An rufe ramin Laser yayin duk rayuwar sabis (yawanci kusan shekaru 2 ~ 3). Ramin Laser ɗin da aka rufe yana da ƙaramin tsari kuma baya buƙatar musayar iska. Shugaban Laser na iya yin aiki na ci gaba sama da awanni 25000 ba tare da kulawa ba. Babbar fa’idar ƙirar sealing ita ce tana iya haifar da bugun hanzari. Misali, Laser mai toshe shinge na iya fitar da bugun mitar (100kHz) tare da madaidaicin iko na 1.5KW. Tare da madaidaicin mita da madaidaicin iko, ana iya aiwatar da injin da sauri ba tare da wani ɓarna mai zafi ba

Uv-dpss Laser shine ingantaccen kayan aiki na jihar wanda ke ci gaba da tsotsar neodymium vanadate (Nd: YVO4) sandar kristal tare da tsararren diode na laser. Yana haifar da fitowar bugun jini ta hanyar sauyawar Q-acousto-optic, kuma yana amfani da janareta na jituwa na uku don canza fitowar Nd: YVO4 laser daga 1064nm & nbsp; An rage girman madaidaicin IR zuwa 355 nm UV. Gabaɗaya 355nm < / div>

Matsakaicin ƙarfin fitarwa na uv-dpss laser a 20kHz ƙimar maimaita bugun jini fiye da 3W div>

Uv-dpss laser

Dukansu dielectric da jan ƙarfe na iya ɗaukar laser uv-dpss tare da saurin fitowar 355nm. Uv-dpss laser yana da ƙaramin tabo mai haske da ƙananan ƙarfin fitarwa fiye da laser CO2. A cikin aikin sarrafa wutar lantarki, galibi ana amfani da laser uv-dpss don ƙaramin girma (ƙasa da 50%) μ m) Saboda haka, yakamata a sarrafa diamita ƙasa da 50 akan madaidaicin madaidaiciyar madaidaiciyar madaidaiciyar madauri μ M micro ta , Yin amfani da Laser UV yana da kyau sosai. Yanzu akwai babban uv-dpss laser, wanda zai iya haɓaka aiki da hakowa na uv-dpss laser div>

Fa’idar uv-dpss laser shine cewa lokacin da foton sa na UV mai ƙarfi ke haskakawa akan yawancin yadudduka waɗanda ba ƙarfe ba, za su iya katse hanyar haɗin kwayoyin, kai tsaye tare da tsarin lithography na “sanyi”, da rage girman matakin lalacewar zafi da zafi. Sabili da haka, ƙananan micro UV yana dacewa da lokutan buƙatu masu yawa inda bayan magani ba zai yiwu ba ko ba dole ba>

Laser CO2 (madadin sarrafa kansa)

Laser CO2 mai rufi na iya fitar da raƙuman ruwa na 10.6 μ M ko 9.4 μ M FIR laser, kodayake duka raƙuman raƙuman ruwa suna da sauƙin ɗaukar su ta hanyar dielectrics kamar su fim ɗin polyimide, bincike ya nuna cewa 9.4 μ Sakamakon M zango mai sarrafa irin wannan kayan yafi kyau. Dielectric 9.4 μ Ƙaƙidar shaƙuwa ta ƙarfin M yana da girma, wanda ya fi 10.6 don hakowa ko yankan kayan μ M saurin sauri. tara maki huɗu laser M laser ba kawai yana da fa’idodin bayyane a cikin hakowa da yankewa ba, har ma yana da tasiri mai mahimmanci. Sabili da haka, yin amfani da gajeriyar raƙuman ruwa na laser zai iya haɓaka yawan aiki da inganci.

Gabaɗaya magana, raƙuman fir yana sauƙaƙa sha da dielectrics, amma jan ƙarfe zai dawo da shi. Sabili da haka, ana amfani da mafi yawan lasisin CO2 don sarrafa dielectric, gyare -gyare, yankan da delamination na dielectric substrate da laminate. Saboda ikon fitarwa na laser CO2 ya fi na DPSS Laser, ana amfani da laser CO2 don sarrafa dielectric a mafi yawan lokuta. CO2 laser da uv-dpss laser galibi ana amfani dasu. Misali, lokacin da ake hakar micro vias, da farko cire murfin jan ƙarfe tare da Laser DPSS, sannan a hanzarta haƙa ramuka a cikin murfin dielectric tare da Laser CO2 har sai ɓaɓen murfin jan ƙarfe na gaba ya bayyana, sannan sake maimaita aikin.

Saboda raƙuman raƙuman ruwa na UV da kansa yana da ɗan gajeren lokaci, tabo mai haske da UV laser ke fitarwa ya fi na Laser CO2 kyau, amma a wasu aikace-aikace, babban tabo mai girman diamita da CO2 laser ya samar ya fi amfani da laser uv-dpss. Misali, yanke manyan kayan yanki kamar ramuka da tubalan ko haƙa manyan ramuka (diamita mafi girma fiye da 50) μ m) Yana ɗaukar ƙarancin lokaci don aiwatarwa tare da laser CO2. Gabaɗaya, raunin buɗewa shine 50 μ Lokacin da m ya yi girma, aikin laser na CO2 ya fi dacewa, kuma buɗewar ƙasa da 50 μ M, tasirin uv-dpss laser ya fi kyau.