Ukusetyenziswa kwetekhnoloji yokulungisa i-laser kwi ibhodi yesekethe eguqukayo

Ukuxinana okuphezulu kwebhodi yesekethe eguqukayo yinxalenye yebhodi yesekethe eguqukayo, echazwa ngokubanzi njengendawo yokuqhawula umgca ngaphantsi kwama-200 μ M okanye imicro nge-250 μ M kwibhodi yesekethe eguqukayo. Ukuxinana okuphezulu kwebhodi yesekethe eguqukayo inezicelo ezininzi, ezinje ngothungelwano ngomnxeba, iikhompyuter, iisekethi ezihlanganisiweyo kunye nezixhobo zonyango. Ukujolisa kwiipropathi ezikhethekileyo zezinto eziguquguqukayo zebhodi yesekethe, eli phepha lazisa ezinye zeengxaki eziphambili ekufuneka ziqwalaselwe ekusetyenzisweni kwelaser kwibhodi yesekethe eguqukayo ephezulu kunye ne-micro ngokusebenzisa ukubhola p>

Iimpawu ezizodwa zebhodi yesekethe eguqukayo ziyenza ukuba ibe yenye indlela kwibhodi yesekethe engqongqo kunye nesikimu socingo lwendabuko amaxesha amaninzi. Kwangelo xesha, ikwakhuthaza uphuhliso lwamacandelo amaninzi amatsha. Elona candelo likhula ngokukhawuleza le-FPC ngumgca woqhagamshelo lwangaphakathi lwehardware yediski yediski (i-HDD). Intloko yemagnethi yediski enzima iya kuhamba emva naphambili kwidiski ejikelezayo yokuskena, kwaye isekethe eguqukayo ingasetyenziselwa ukubuyisela ucingo ukuze ibone unxibelelwano phakathi kwentloko yemagnethi ephathekayo kunye nebhodi yesekethe yolawulo. Abavelisi beediski ezilukhuni bonyusa imveliso kwaye banciphise iindleko zebandla kwitekhnoloji ebizwa ngokuba “yiplatable flexible plate” (FOS). Ukongeza, iteknoloji yokumisa ngaphandle kwamacingo inokumelana nokunyikima okungcono kwaye inokuphucula ukuthembeka kwemveliso. Enye ibhodi yesekethe ebhetyebhetye ephezulu esetyenziswa kwidiski enzima yi-interposer flex, esetyenziswa phakathi kokumiswa kunye nolawulo.

Intsimi yesibini ekhulayo ye-FPC yinto entsha yokudityaniswa kwesekethe. Iisekethe eziguquguqukayo zisetyenziselwa ukupakisha kwinqanaba le-chip (CSP), imodyuli ye-chip (MCM) kunye ne-chip kwibhodi yesekethe eguqukayo (COF). Phakathi kwazo, isekethe yangaphakathi ye-CSP inentengiso enkulu, kuba inokusetyenziswa kwizixhobo ze-semiconductor nakwimemori yefleshi, kwaye isetyenziswa kakhulu kumakhadi e-PCMCIA, kwidiski yediski, abancedisi bedijithali yobuqu (ii-PDAs), iifowuni eziphathwayo, ii-pager zekhamera yedijithali kunye nekhamera yedijithali. . Ukongeza, umboniso wekristale engamanzi (i-LCD), iswitshi sefilimu somatshini kunye ne-ink-jet umshicileli wecartridge zezinye iinkalo ezintathu zokukhula okuphezulu kwibhodi yesekethe eguqukayo

Amandla emarike yetekhnoloji yomgca eguqukayo kwizixhobo eziphathwayo (ezinje ngeefowuni eziphathwayo) inkulu kakhulu, eyindalo kakhulu, kuba ezi zixhobo zifuna umthamo omncinci kunye nobunzima bokukhanya ukuze zihlangabezane neemfuno zabathengi; Ukongeza, usetyenziso lwamva nje lwetekhnoloji eguqukayo ibandakanya ukuboniswa kwepaneli ethe tyaba kunye nezixhobo zonyango, ezinokuthi zisetyenziswe ngabaqulunqi ukunciphisa ivolumu kunye nobunzima beemveliso ezinje ngezixhobo zokuva kunye nokufakwa kwabantu.

Ukukhula okukhulu kwezi nkalo zingasentla kukhokelele ekwandeni kwimveliso yehlabathi yeebhodi zesekethe eziguqukayo. Umzekelo, umthamo weentengiso zediski ezilukhuni kulindeleke ukuba ufikelele kwiiyunithi ezingama-345 ezigidi ngo-2004, phantse kabini kunaleyo yowe-1999, kunye nomthamo wentengiso yeefowuni eziphathwayo ngowama-2005 uqikelelwa ukuba ziiyunithi ezingama-600 ezigidi. Oku kunyuka kukhokelela kukonyuka kwama-35% ngonyaka kwiibhodi zesekethe ezixineneyo, ukufikelela kwi-3.5 yezigidi zeemitha zesikwere ngo-2002. Imveliso ephezulu enjalo ifuna ubuchwephesha bokusebenza kunye neendleko eziphantsi, kunye netekhnoloji yokulungisa i-laser yenye yazo .

I-Laser inemisebenzi emithathu ephambili kwinkqubo yokuvelisa ibhodi yesekethe eguqukayo: ukuqhubekeka nokwenza (ukusika nokusika), ukusika kunye nokomba. Njengesixhobo sokuqhagamshela esingadibaniyo, i-laser inokusetyenziselwa ukugxila okuncinci (100 ~ 500) μ m) Amandla ombane wokukhanya okuphezulu (650MW / mm2) asetyenziswa kwimathiriyeli. Amandla anjalo aphezulu anokusetyenziselwa ukusika, ukubhola, ukumakisha, ukuwelda, ukumakisha nokunye ukuqhubekeka. Isantya sokusebenza kunye nomgangatho unxulumene nepropathi yezinto ezigqityiweyo kunye neempawu zelaser ezisetyenzisiweyo, ezinje ngobude bamaza, amandla oxineneyo, amandla encopho, ukubetha kobubanzi kunye nokuhamba rhoqo. Ukulungiswa kwebhodi yesekethe eguqukayo isebenzisa i-ultraviolet (UV) kunye ne-laser infrared (MOTO). Indawo yangaphambili ihlala isebenzisa i-excimer okanye i-UV diode epomped solid-state (uv-dpss) lasers, ngelixa eyokugqibela isebenzisa i-CO2 lasers div>

Itekhnoloji yokuvavanywa kweVector isebenzisa ikhompyuter ukulawula isipili esixhotyiswe ngemitha yokuhamba kunye nesoftware yeCAD / CAM yokuvelisa ukusika kunye nokugrumba imizobo, kwaye isebenzisa inkqubo yeelensi zetelecentric ukuqinisekisa ukuba i-laser ikhanya ngokuthe nkqo kumphezulu womsebenzi </ div>

Laser ukubhola processing has ngobuciko eliphezulu kunye nesicelo ebanzi. Isixhobo esifanelekileyo sokwenza ibhodi yesekethe eguqukayo. Nokuba i-laser ye-CO2 okanye i-DPSS laser, izinto zinokuqwalaselwa nakweyiphi na imilo emva kokugxila. Ikhupha i-laser beam egxile naphi na kwindawo yokusebenza ngokufaka isipili kwi-galvanometer, emva koko yenza ulawulo lwamanani wekhompyuter (i-CNC) kwi-galvanometer ngokusebenzisa itekhnoloji yokuskena i-vector, kwaye yenze ukusika imifanekiso ngoncedo lwesoftware ye-CAD / CAM. Esi “sixhobo sithambileyo” sinokulawula ngokulula i-laser ngexesha lokwenyani xa uyilo lutshintshiwe. Ngokuhlengahlengisa ukukhanya okucothayo kunye nezixhobo ezahlukeneyo zokusika, ukulungiswa kwe-laser kunokuvelisa ngokuchanekileyo imizobo yoyilo, eyenye inzuzo ebalulekileyo.

Iskena seVector sinokusika ii-substrates ezinjengefilimu ye-polyimide, usike isekethe yonke okanye ususe indawo kwibhodi yesekethe, enje ngesakhiwo okanye ibhloko. Kwinkqubo yokulungisa kunye nokwakha, umqadi we-laser uhlala uvuliwe xa isipili sikhangela yonke indawo yokusebenza, ejongene nenkqubo yokomba. Ngexesha lokomba, i-laser ivuliwe kuphela emva kokuba isipili simisiwe kwindawo nganye yokugrumba div>

icandelo

“Ukucanda” kwijoggon yinkqubo yokususa umaleko omnye wemathiriyeli kwenye into ene-laser. Le nkqubo ifaneleka ngakumbi kwi-laser. Itekhnoloji efanayo yokuskena i-vector inokusetyenziselwa ukususa i-dielectric kunye nokuveza iphedi yokuqhuba engezantsi. Ngeli xesha, ukuchaneka okuphezulu kokulungiswa kwelaser kwakhona kubonisa izibonelelo ezinkulu. Ukusukela ukuba imitha ye-MOTO laser iya kubonakala ngefoyile yobhedu, i-laser ye-CO2 ihlala isetyenziswa apha.

umngxunya wokugrumba

Nangona ezinye iindawo zisasebenzisa ukubhola ngoomatshini, ukunyathela okanye ukutsala iplasma ukwenza imingxunya ngemingxunya, ukubhola kwelaser kuseyona nto isetyenziswa kakhulu ngokusebenzisa umngxuma wendlela yebhodi yesekethe eguqukayo, ikakhulu ngenxa yemveliso yayo ephezulu, ubhetyebhetye obomeleleyo kunye nexesha elide lokusebenza .

Ukubholwa koomatshini kunye nokunyathela kugqityiwe kusetyenziswe izixhobo zokuchaneka okuphezulu kunye nokufa, ezinokuthi zenziwe kwibhodi yesekethe eguqukayo enobubanzi obuphantse bube yi-250 μ M, kodwa ezi zixhobo zichaneke kakhulu zibiza kakhulu kwaye zinobomi obufutshane benkonzo. Ngenxa yokuxinana kwebhodi yesekethe eguqukayo, umyinge wokuvula ovunyiweyo yi-250 μ M incinci, ke ngoko ukubhola ngomatshini akuthandeki.

Ukutsalwa kwePlasma kunokusetyenziswa kwi-substrate yefilimu ye-polyimide enobunzima obungaphantsi kwe-50 μ M, kodwa izixhobo zotyalo-mali kunye nenkqubo yeendleko ziphezulu kakhulu, kwaye iindleko zokugcina inkqubo ye-plasma etching nayo iphezulu kakhulu, ngakumbi iindleko ezinxulumene noko kunyango oluthile lwenkunkuma kunye nokusetyenziswa. Ukongeza, kuthatha ixesha elide ukufotwa kweplasma ukwenza ii-vias ezincinci ezingqinelanayo nezithembekileyo xa kusekelwa inkqubo entsha. Uncedo lwale nkqubo kukuthembeka okuphezulu. Kuxelwe ukuba inqanaba elifanelekileyo lemicro nge-100%. Ke ngoko, ukutsalwa kweplasma kusenentengiso ethile kwizixhobo zonyango nakwii-avionics div>

Ngokwahlukileyo koko, kungamampunge vias micro yi laser yinkqubo elula kunye nexabiso eliphantsi. Utyalo-mali lwezixhobo ze-laser ziphantsi kakhulu, kwaye i-laser sisixhobo esingadibaniyo. Ngokungafaniyo nokubhola ngoomatshini, kuya kubakho iindleko zokubuyisela izixhobo ezibizayo. Ukongeza, i-CO2 yanamhlanje etywiniweyo kunye ne-UV-dpss lasers ayinasondlo, enokunciphisa ixesha lokuphumla kunye nokuphucula kakhulu imveliso.

Indlela yokuvelisa ii-vias ezincinci kwibhodi yesekethe eguqukayo iyafana naleyo kwi-pcb engqongqo, kodwa ezinye iiparameter ezibalulekileyo zelaser kufuneka zitshintshwe ngenxa yomahluko we-substrate kunye nobukhulu. I-CO2 etywiniweyo kunye ne-UV-dpss lasers zinokusebenzisa itekhnoloji yokuskena i-vector efanayo nokubumba ukubhola ngqo kwibhodi yesekethe eguqukayo. Umahluko kuphela kukuba isicelo sokomba isoftware iya kucima i-laser ngexesha lokuskena isipili ukuskena ukusuka kwenye encinci ukuya kwenye. Umqadi we-laser awuyi kuvulwa ude ufike kwenye indawo yokomba. Ukwenza umngxunya ojikeleze umphezulu webhodi yesekethe eguqukayo, umqadi we-laser kufuneka ukhanye ngokuthe nkqo kwibhodi yesekethe, enokufezekiswa ngokusebenzisa inkqubo yelensi ye-telecentric phakathi kwesipili sokuskena kunye ne-substrate (Ikhiwane. 2 div>

Imingxunya eyombiweyo kwiKapton isebenzisa i-UV laser

I-CO2 laser inokusebenzisa itekhnoloji engqinelanayo yokumba ii-vias ezincinci. Xa usebenzisa obu buchwephesha, umphezulu wobhedu usetyenziswa njengesigqumathelo, imingxunya ibotshelelwe kuyo ngendlela eqhelekileyo yokuprinta, kwaye ke umqadi we-laser we-CO2 ukhanyisiwe kwimingxunya yefoyile yobhedu ukuze ususe izinto ezibonakalayo ze-dielectric.

Ii-vias ezincinci zinokwenziwa ngokusebenzisa i-laser ye-excimer ngendlela yemaski yokuqikelela. Obu buchwephesha budinga ukwenza imephu yomfanekiso wento encinci okanye yonke imicro ngokudweliswa kwe-substrate, emva koko i-excimer laser beam ityibilikisa imask ukwenza imephu yemaski kumhlaba ongaphantsi, ukuze ugqobhoze umngxunya. Umgangatho excimer laser ukubhola intle kakhulu. Ukungancedi kwayo sisantya esisezantsi kunye neendleko eziphezulu.

Ukukhethwa kweLaser nangona uhlobo lwelaser ekuqhubeni ibhodi yesekethe eguqukayo iyafana naleyo yokuqhubekeka i-pcb engqongqo, umahluko kwizinto ezibonakalayo kunye nobukhulu ziya kuchaphazela kakhulu iiparameter zokulungisa kunye nesantya. Ngamanye amaxesha i-laser excimer kunye negesi enqamlezayo (iti) i-CO2 laser ingasetyenziswa, kodwa ezi ndlela zimbini zinesantya esicothayo kunye neendleko zokugcina eziphezulu, ezithintela ukuphuculwa kwemveliso. Xa kuthelekiswa, ii-lasers ze-CO2 kunye ne-UV-dpss zisetyenziswa ngokubanzi, iindleko ezikhawulezayo nezisezantsi, ke zisetyenziswa kakhulu ekuqambeni nasekuqhubeni ii-vias ezincinci zeebhodi zesekethe eziguqukayo.

Umahluko kwindlela yokuhamba kwerhasi ye-CO2 laser, etywiniweyo CO2 laser （http://www.auto-alt.cn technology Itekhnoloji yokukhupha ibhloko yamkelwe ukunciphisa umxube wegesi ye-laser kumngxunya we-laser ochazwe ziipleyiti ezimbini zoxande ze-electrode. Isisu se-laser sitywinwe ngexesha lobomi bonke benkonzo (ngesiqhelo malunga neminyaka emi-2 ~ 3). Isimbo se-laser esitywiniweyo sinesakhiwo esihambelanayo kwaye asidingi kutshintshiselwano lomoya. Intloko ye-laser inokusebenza ngokuqhubekayo ngaphezulu kweeyure ezingama-25000 ngaphandle kwesondlo. Olona ncedo lukhulu kuyilo lokutywina kukuba inokuvelisa ukubetha okukhawulezayo. Umzekelo, ibhloko yokukhutshwa kwelaser inokukhupha ukubetha okuphezulu (100kHz) ngamandla aphezulu e-1.5KW. Ngamandla aphakamileyo kunye namandla aphakamileyo aphezulu, ukukhawulezisa ngokukhawuleza kunokwenziwa ngaphandle kokuthotywa kwe-thermal div>

I-laser ye-UV-dpss sisixhobo esomeleleyo esiqhubeka ngokufunxa i-neodymium vanadate (Nd: YVO4) intonga yekristale ene-diode array. Ivelisa imveliso ye-pulse nge-acousto-optic Q-switch, kwaye isebenzisa i-harmonic crystal generator yesithathu ukutshintsha imveliso ye-Nd: YVO4 laser ukusuka kwi-1064nm & nbsp; Ubungakanani obude be-IR buncitshisiwe baba yi-355 nm ye-UV wavelength. Ngokubanzi 355nm </ div>

Umndilili wamandla okuphuma kwe-UV-dpss laser kwi-20kHz yokubiza izinga lokuphindaphinda ukubetha kungaphezulu kwe-3W div>

I-UV-dpss laser

Zombini i-dielectric kunye nobhedu zinokufumana ngokulula i-uv-dpss laser ngokuvelisa ubude be-355nm. I-laser ye-UV-dpss inendawo encinci yokukhanya kunye namandla asezantsi okuphuma kune-CO2 laser. Kwinkqubo yokulungiswa kwe-dielectric, i-UV-dpss laser ihlala isetyenziselwa ubungakanani obuncinci (ngaphantsi kwe-50%) μ m) Ke ngoko, ububanzi obungaphantsi kwama-50 kufuneka buqhubekiswe kwi-substrate yebhodi yesekethe eguqukayo yoxinaniso μ M encinci nge , ukusebenzisa i-UV laser kulunge kakhulu. Ngoku kukho amandla aphezulu e-UV-dpss laser, anokunyusa ukuqhubekeka kunye nokubola kwesantya se-UV-dpss laser div>

Uncedo lwe-UV-dpss laser kukuba xa amandla ayo aphezulu e-UV ekhanya kuninzi olungaphezulu kwesinyithi, anokulophula ngokuthe ngqo ikhonkco leemolekyuli, agudise umda wokusika ngenkqubo yokubanda “ebandayo”, kunye nokunciphisa iqondo umonakalo we-thermal kunye nokutshisa. Ke ngoko, ukusika okuncinci kwe-UV kufanelekile kwiminyhadala yemfuno ephezulu apho unyango lwasemva kwexesha lungenakwenzeka okanye ngokungeyomfuneko kwi-div>

I-laser ye-CO2 (ezizezinye ezizenzekelayo)

I-laser ye-CO2 etywiniweyo inokukhupha ubude be-10.6 μ M okanye i-9.4 μ M ye-MOTO laser, nangona zombini ilungiso zilula ukufunxwa zii-dielectri ezinjenge-polyimide substrate yefilimu, uphando lubonisa ukuba i-9.4 μ Isiphumo se-M wavelength silungisa olu hlobo lwezixhobo kubhetele kakhulu. I-dielectric 9.4 μUkulungelelaniswa kokufakwa kwamaza ubude be-M kuphezulu, okungcono kune-10.6 yokomba okanye yokusika izinto μ M ubude obude ngokukhawuleza. Amanqaku alithoba amane μ M laser ayaneli nje ukuba neenzuzo ezicacileyo ekubhobhozeni nasekusikeni, kodwa ikwanesiphumo sokukrola okubalaseleyo. Ke ngoko, ukusetyenziswa kwelade emfutshane ye-laser kunokuphucula imveliso kunye nomgangatho.

Ukuthetha ngokubanzi, ubude be-fir buxutywa ngokulula yi-dielectrics, kodwa iya kubonakala ibuye ngobhedu. Ke ngoko, uninzi lwe-CO2 lasers zisetyenziselwa ukulungiswa kwe-dielectric, ukubumba, ukusika kunye ne-delamination ye-dielectric substrate kunye ne-laminate. Kuba amandla emveliso ye-CO2 laser iphezulu kunale ye-DPSS laser, i-CO2 laser isetyenziselwa ukuhambisa i-dielectric kwiimeko ezininzi. I-laser ye-CO2 kunye ne-UV-dpss laser zihlala zisetyenziswa kunye. Umzekelo, xa kusombiwa ii-vias ezincinci, kuqala susa umaleko wobhedu nge-laser ye-DPSS, emva koko ukroboze ngokukhawuleza imingxunya kuludwe lwe-dielectric nge-laser ye-CO2 kude kubonakale umaleko wobhedu olandelayo, emva koko uphinde inkqubo.

Ngenxa yokuba ubude be-UV ye-UV buqu bufutshane kakhulu, indawo ekhanyayo ekhutshwe yi-UV laser icolile kunaleyo ye-CO2 laser, kodwa kwezinye izicelo, indawo enkulu yokukhanya enobubanzi eveliswe yi-CO2 laser iluncedo ngakumbi kune-laser ye-UV-dpss. Umzekelo, sika izinto ezinkulu zommandla ezinje ngemijelo kunye neebhloko okanye ukubhola imingxunya emikhulu (ububanzi obungaphezulu kwe-50) μ m) Kuthatha ixesha elincinci ukwenza kunye ne-CO2 laser. Ngokubanzi, umyinge wokuvula ungama-50 μ Xa m mkhulu, i-CO2 laser processing ifaneleke ngakumbi, kwaye ukuvula kungaphantsi kwama-50 μ M, ifuthe le-UV-dpss laser lingcono.