Ukusetshenziswa kobuchwepheshe bokucubungula i-laser ku ibhodi lesifunda eliguquguqukayo

Ubuningi bebhodi lesifunda eliguquguqukayo liyingxenye yebhodi lesifunda eliguquguqukayo, okuvame ukuchazwa njengezikhala zomugqa ezingaphansi kuka-200 μ M noma ezincane ngebhodi lesifunda eliguquguqukayo elingaphansi kuka-250 μ M. Ibhodi lesifunda eliguquguqukayo eliphakeme linezinhlelo eziningi zokusebenza, njengokuxhumana ngocingo, amakhompyutha, amasekethe ahlanganisiwe nemishini yezokwelapha. Ihlose izakhiwo ezikhethekile zezinto eziguquguqukayo zebhodi lesifunda, leli phepha lethula ezinye zezinkinga ezibalulekile ezizocatshangelwa ekusetshenzisweni kwelaser kwe-high-density flexible circuit board kanye ne-micro nge-drilling p>

Izici ezihlukile zebhodi lesifunda eliguquguqukayo zikwenza kube okuhlukile kubhodi yesifunda eqinile kanye nohlelo lwentambo lwendabuko ezikhathini eziningi. Ngasikhathi sinye, iphinda ithuthukise ukuthuthukiswa kwemikhakha eminingi emisha. Ingxenye ekhula ngokushesha kakhulu ye-FPC ulayini wokuxhuma wangaphakathi we-hard disk drive (HDD) yekhompyutha. Inhloko kazibuthe yediski eliqinile izohamba iye emuva naphambili kudiski ejikelezayo yokuskena, futhi isekethe eliguquguqukayo lingasetshenziswa ukumiselela ucingo ukubona ukuxhumana phakathi kwekhanda likazibuthe weselula nebhodi lesifunda elilawulayo. Abakhiqizi behard disk bakhulisa ukukhiqizwa futhi banciphise izindleko zomhlangano ngobuchwepheshe obubizwa nge- “suspended flexible plate” (FOS). Ngaphezu kwalokho, ubuchwepheshe bokumiswa okungenantambo bunokumelana kangcono nokuzamazama komhlaba futhi kungathuthukisa ukuthembeka komkhiqizo. Elinye ibhodi lesifunda eliguquka kakhulu elisetshenziswa kwi-hard disk yi-interposer flex, esetshenziswa phakathi kokumiswa nesilawuli.

Inkambu yesibili ekhulayo ye-FPC yiphakethe elisha lesifunda elihlanganisiwe. Amasekethe aguquguqukayo asetshenziselwa ukufakwa kwezinga le-chip (CSP), i-multi chip module (MCM) ne-chip ebhodini lesifunda eliguquguqukayo (COF). Phakathi kwabo, i-CSP yangaphakathi inemakethe enkulu, ngoba ingasetshenziswa kumadivayisi we-semiconductor nakwimemori ye-flash, futhi isetshenziswa kakhulu kumakhadi we-PCMCIA, ama-disk drive, abasizi be-digital (PDAs), omakhalekhukhwini, i-pager Digital camera nekhamera yedijithali . Ngaphezu kwalokho, i-liquid crystal display (i-LCD), i-polyester film switch kanye ne-ink-jet printer cartridge ezinye izinkambu ezintathu zokukhula okuphezulu zebhodi lesifunda eliguquguqukayo \

Ithuba lemakethe lobuchwepheshe bolayini obuguquguqukayo kumadivayisi aphathekayo (njengamaselula) likhulu kakhulu, okungokwemvelo kakhulu, ngoba lawa madivayisi adinga ivolumu elincane nesisindo esincane ukuhlangabezana nezidingo zabathengi; Ngaphezu kwalokho, ukusetshenziswa kwakamuva kobuchwepheshe obuguquguqukayo kufaka phakathi ukubonisa kwamaphaneli ayizicaba namadivayisi wezokwelapha, angasetshenziswa ngabaqambi ukunciphisa ivolumu nesisindo semikhiqizo efana nezinsiza-kuzwa nokufakwa kwabantu.

Ukukhula okukhulu kule mikhakha engenhla kuholele ekwandeni kokukhishwa komhlaba wonke kwamabhodi wesifunda aguquguqukayo. Isibonelo, umthamo wokuthengisa wonyaka wamadiski aqinile kulindeleke ukuthi ufinyelele kumayunithi ayizigidi ezingama-345 ngonyaka we-2004, cishe cishe kabili kunowe-1999, futhi inani lokuthengisa lomakhalekhukhwini ngo-2005 kulinganiselwa ukuthi lingamayunithi ayizigidi ezingama-600. Lokhu kukhuphuka kuholela ekwenyukeni kwaminyaka yonke kwama-35% ekuphumeni kwamabhodi wesekethe aguquguqukayo aphakeme, afinyelela kumamitha-skwele ayizigidi ezingama-3.5 ngonyaka we-2002. Isidingo esikhulu sokukhishwa okunjalo sidinga ubuchwepheshe bokucubungula obusebenza kahle futhi obuphansi, futhi ubuchwepheshe bokucubungula i-laser ngenye yazo .

I-Laser inemisebenzi emithathu eyinhloko enqubeni yokukhiqiza yebhodi lesifunda eliguquguqukayo: ukucubungula nokwakha (ukusika nokusika), ukusika nokubhola. Njengethuluzi lokuthinta elingathintani, i-laser ingasetshenziswa ekugxileni okuncane kakhulu (100 ~ 500) μ m) Amandla wokukhanya aphezulu (650MW / mm2) asetshenziswa kulokho okuqukethwe. Amandla anjalo aphezulu angasetshenziselwa ukusika, ukubamba, ukumaka, ukuwelda, ukumaka nokunye ukucubungula. Ijubane lokucubungula nekhwalithi kuhlobene nezakhiwo zento esetshenzisiwe kanye nezici ze-laser ezisetshenzisiwe, ezinjenge-wavelength, amandla we-energy, amandla we-peak, ububanzi be-pulse nobuningi. Ukuqhutshwa kwebhodi lesifunda eliguquguqukayo kusebenzisa imisebe ye-ultraviolet (UV) kanye ne-infrared (FIR). Owokuqala uvame ukusebenzisa i-excimer noma i-UV diode ekhishwe i-solid-state (uv-dpss) lasers, kuyilapho eyokugcina isebenzisa kakhulu i-CO2 lasers div>

Ubuchwepheshe bokuskena iVector busebenzisa ikhompyutha ukulawula isibuko esifakelwe imitha yokugeleza kanye nesoftware ye-CAD / CAM ukukhiqiza imidwebo yokusika nokumba, futhi sisebenzisa uhlelo lwelensi ye-telecentric ukuqinisekisa ukuthi i-laser ikhanya iqonde mpo kumphezulu wokusebenzela </ div>

Laser Drilling ukucubungula kunokunemba okuphezulu nokusetshenziswa okubanzi. Kuyithuluzi elihle lokwakha ibhodi lesifunda eliguquguqukayo. Noma ngabe i-laser ye-CO2 noma i-DPSS, okokusebenza kungacutshungulwa kube yiluphi uhlobo ngemuva kokugxila. Idubula i-laser beam egxilwe noma ikuphi endaweni yokusebenza ngokufaka isibuko kwi-galvanometer, bese yenza ukulawula kwamanani ekhompyutha (i-CNC) ku-galvanometer ngokusebenzisa ubuchwepheshe bokuskena i-vector, futhi yenza ihluzo zokusika ngosizo lwe-software ye-CAD / CAM. Leli “thuluzi elithambile” lingalawula kalula i-laser ngesikhathi sangempela lapho ukwakhiwa kuguqulwa. Ngokulungisa ukuncipha kokukhanya namathuluzi ahlukahlukene wokusika, ukucutshungulwa kwe-laser kungazala ngokunembile imidwebo yemidwebo, okungenye inzuzo ebalulekile.

Ukuskena kweVector kungasika ama-substrates afana nefilimu ye-polyimide, usike isifunda sonke noma ususe indawo ebhodini lesifunda, njenge-slot noma ibhulokhi. Enqubweni yokucubungula nokwakha, i-laser beam ihlala ivuliwe lapho isibuko sihlola yonke indawo yokucubungula, ephambene nenqubo yokumba. Ngesikhathi sokubhola, i-laser ivulwa kuphela ngemuva kokuthi isibuko simiswe endaweni ngayinye yokubhola div>

ingxenye

“Ukusika” ku-jargon inqubo yokususa ungqimba olulodwa lwento komunye nge-laser. Le nqubo ifaneleka kakhulu nge-laser. Ubuchwepheshe obufanayo bokuskena i-vector bungasetshenziswa ukususa i-dielectric futhi kuveze iphedi eqhubayo engezansi. Ngalesi sikhathi, ukucacisa okuphezulu kokucutshungulwa kwe-laser futhi kukhombisa izinzuzo ezinkulu. Njengoba imisebe ye-FIR laser izokhonjiswa nge-foil yethusi, i-CO2 laser ivame ukusetshenziswa lapha.

umgodi wokubhola

Yize ezinye izindawo zisasebenzisa imishini yokugaya, ukugxusha noma ukufakwa kweplasma ukwakha okuncane ngemigodi, i-laser drilling iseyindlela esetshenziswa kakhulu kunazo zonke ngokusebenzisa indlela yokwenza imbobo yebhodi lesifunda eliguquguqukayo, ikakhulukazi ngenxa yokukhiqiza kwayo okuphezulu, ukuguquguquka okunamandla nokusebenza isikhathi eside okujwayelekile .

Ukubhola ngomshini nokugxivizwa kuthola izingcweti zokunemba okuphezulu futhi kufe, okungenziwa ebhodini lesifunda eliguquguqukayo elinobubanzi obucishe bube yi-250 μ M, kepha lawa madivayisi wokunemba okuphezulu ayabiza kakhulu futhi anempilo yensizakalo emfushane. Ngenxa yebhodi lesifunda eliguquguqukayo eliphakeme kakhulu, isilinganiso sokuvula esidingekayo siyi-250 μ M sincane, ngakho-ke ukubhola ngomshini akukhethiswa.

Ukufakwa kwe-Plasma kungasetshenziswa ku-50 μ M ubukhulu be-polyimide film substrate enosayizi ongaphansi kuka-100 μ M, kepha izindleko zokutshalwa kwemali nezindleko zenqubo ziphakeme impela, futhi izindleko zokugcinwa kwenqubo ye-plasma etching nayo iphezulu kakhulu, ikakhulukazi izindleko ezihlobene ekwelashweni kwamanye amakhemikhali nokwelashwa. Ngaphezu kwalokho, kuthatha isikhathi eside ukuthi i-plasma etching yenze ama-vias amancane angaguquki futhi athembekile lapho kusungulwa inqubo entsha. Ubuhle bale nqubo ukuthembeka okuphezulu. Kubikwa ukuthi isilinganiso esifanelekayo se-micro nge ngu-98%. Ngakho-ke, i-plasma etching isenemakethe ethile kwimishini yezokwelapha neye-avionics div>

Ngokuphambene nalokho, ukwenziwa kwama-micro vias nge-laser kuyinqubo elula futhi ebiza izindleko. Ukutshalwa kwemali kwemishini ye-laser kuphansi kakhulu, futhi i-laser iyithuluzi lokuxhumana okungathintwa nalo. Ngokungafani nokubhola ngomshini, kuzoba nezindleko zokubuyisela amathuluzi ezibizayo. Ngaphezu kwalokho, i-lasers yanamuhla evaliwe ye-CO2 kanye ne-UV-dpss ayihlinzekwa mahhala, enganciphisa isikhathi sokuphumula futhi ithuthukise kakhulu umkhiqizo.

Indlela yokwenza ama-vias amancane ebhodini lesifunda eliguquguqukayo iyafana naleyo ku-pcb eqinile, kepha eminye imingcele ebalulekile ye-laser idinga ukuguqulwa ngenxa yomehluko we-substrate nobukhulu. Ama-lasers we-CO2 afakwe uphawu futhi we-UV-dpss angasebenzisa ubuchwepheshe obufanayo bokuskena i-vector njengokubumba ukubhola ngqo ebhodini lesifunda eliguquguqukayo. Umehluko kuphela ukuthi isoftware yokufaka uhlelo lokusebenza izocisha i-laser ngesikhathi kuthwetshulwa isibuko kuthwetshulwa kusuka ku-micro eyodwa kuya kwenye. I-laser beam ngeke ivulwe ize ifinyelele kwenye indawo yokumba. Ukuze wenze umgodi ubhekane ngqo nobuso be-substrate yebhodi yesifunda eguquguqukayo, ugongolo lwe-laser kufanele lukhanye lubheke phezulu ku-substrate yebhodi lesifunda, elingatholwa ngokusebenzisa uhlelo lwelensi ye-telecentric phakathi kwesibuko sokuskena ne-substrate (I-Fig. 2 div>

Imigodi eboshwe eKapton kusetshenziswa i-UV laser

I-CO2 laser nayo ingasebenzisa ubuchwepheshe bokufanisa imaski ukubhola ama-vias amancane. Lapho usebenzisa lobu buchwepheshe, indawo yethusi isetshenziswa njengesifihla-buso, izimbobo zigxiliwe kuyo ngendlela ejwayelekile yokuphrinta, bese kuthi i-CO2 laser beam ikhanyiselwe emigodini yocingo lwethusi ukususa okokuvezwa kwe-dielectric okuveziwe.

Ama-vias amancane angenziwa futhi ngokusebenzisa i-excimer laser ngendlela yesifihla-buso sokuqagela. Lobu buchwepheshe budinga ukwenza imephu isithombe se-micro nge noma yonke i-micro nge-array eya ku-substrate, bese kuthi i-excimer laser beam ikhanyise imaski ukudweba isithombe se-mask endaweni engaphansi, ukuze kubhobozwe imbobo. Izinga excimer laser imishini muhle kakhulu. Ububi bayo ijubane eliphansi nezindleko eziphezulu.

Ukukhethwa kwe-Laser yize uhlobo lwe-laser lokucubungula ibhodi lesifunda eliguqukayo liyafana nelokucubungula i-pcb eqinile, umehluko ezintweni ezibonakalayo nasekujiyweni kuzothinta kakhulu imingcele yokucubungula nejubane. Kwesinye isikhathi kungasetshenziswa i-laser ye-excimer negesi ejabulisayo (itiye) i-CO2 laser, kepha lezi zindlela ezimbili zinejubane elihamba kancane nezindleko eziphakeme zokulungisa, ezikhawulela ukuthuthuka komkhiqizo. Uma kuqhathaniswa, ama-lasers e-CO2 ne-UV-dpss asetshenziswa kabanzi, izindleko ezisheshayo neziphansi, ngakho-ke zisetshenziswa kakhulu ekwenziweni nasekusebenzeni kwama-vias amancane amabhodi wesifunda aguquguqukayo.

Kwehlukile ekugelezeni kwegesi i-CO2 laser, uphawu lwe-CO2 laser （http://www.auto-alt.cn） Ubuchwepheshe bokukhishwa kwebhulokhi bumukelwa ukukhawulela ingxube yegesi ye-laser emgodini we-laser ocaciswe amapuleti ama-electrode angama-rectangular amabili. Umgodi we-laser uvaliwe phakathi nayo yonke impilo yenkonzo (imvamisa cishe iminyaka emi-2 ~ 3). Umugqa we-laser ovaliwe unesakhiwo esihlanganisiwe futhi awudingi ukushintshaniswa komoya. Ikhanda le-laser lingasebenza ngokuqhubekayo amahora angaphezu kwama-25000 ngaphandle kwesondlo. Inzuzo enkulu yokuklanywa kokufaka uphawu ukuthi ingakhiqiza izingqinamba ezisheshayo. Isibonelo, i-block block laser ingakhipha amapulse aphezulu (100kHz) ngamandla amakhulu we-1.5KW. Ngemvamisa ephezulu namandla aphakeme kakhulu, imishini esheshayo ingenziwa ngaphandle kokucekelwa phansi okushisayo kwe-div>

I-UV-dpss laser iyisimo esiqinile esimunca ngokuqhubekayo i-neodymium vanadate (Nd: YVO4) induku yekristalu ene-laser diode array. Ikhiqiza ukukhishwa kwe-pulse nge-acousto-optic Q-switch, futhi isebenzisa i-generator yesithathu ye-harmonic crystal ukushintsha ukukhishwa kwe-Nd: YVO4 laser kusuka ku-1064nm & nbsp; I-wave wavelength eyisisekelo yehliswe yaba ngu-355 nm UV wavelength. Ngokuvamile i-355nm </ div>

Amandla wokukhipha amaphakathi we-uv-dpss laser ku-20kHz izinga lokuphindaphinda lokuphindaphinda lingaphezu kuka-3W div>

I-UV-dpss laser

Kokubili i-dielectric nethusi kungamunca kalula i-UV-dpss laser nge-wavevel yobude obungu-355nm. I-UV-dpss laser inendawo encane yokukhanya namandla okukhipha aphansi kune-CO2 laser. Enqubeni yokucubungula i-dielectric, i-UV-dpss laser ivame ukusetshenziselwa usayizi omncane (ngaphansi kuka-50%) μ m) Ngakho-ke, ubukhulu obungaphansi kuka-50 kufanele busetshenzwe ku-substrate yebhodi lesifunda eliguquguqukayo eliphakeme kakhulu μ M micro nge , ukusebenzisa i-UV laser kuhle kakhulu. Manje kukhona i-laser ephezulu ye-uv-dpss laser, engakhuphula isivinini sokucubungula nokumba kwe-UV-dpss laser div>

Inzuzo ye-UV-dpss laser ukuthi lapho ama-photon ayo aphezulu e-UV ekhanya ezingxenyeni eziningi ezingezona zensimbi, angakwazi ukunqamula ngqo ukuxhumana kwama-molecule, ashelele umphetho ngenqubo “ebandayo” ye-lithography, futhi anciphise izinga ukushisa nokushisa. Ngakho-ke, ukusika okuncane kwe-UV kufanelekile ngezikhathi zokufunwa okuphezulu lapho ukwelashwa ngemuva kungenakwenzeka noma i-div> engadingekile

I-CO2 laser (izindlela ezizenzakalelayo)

I-laser ye-CO2 evaliwe ingakhipha ubude be-10.6 μ M noma i-9.4 μ M laser laser, yize womabili la ma-wavelength kulula ukuwamunca ngama-dielectri afana ne-polyimide film substrate, ucwaningo lukhombisa ukuthi i-9.4 μ Umphumela we-M wavelength icubungula lolu hlobo lwezinto kungcono kakhulu. I-dielectric 9.4 μ I-coefficient yokumunca ye-M wavelength iphezulu, okungcono kune-10.6 yokumba noma ukusika izinto μ M wavelength ngokushesha. amaphoyinti ayisishiyagalolunye amane μ M laser ayinazo izinzuzo ezisobala kuphela ekubhodini nasekusikeni, kepha futhi inomphumela omuhle wokusika. Ngakho-ke, ukusetshenziswa kwe-laser wavelength emfushane kungathuthukisa umkhiqizo nekhwalithi.

Ngokuvamile, ubude be-fir bubanjwa kalula ngama-dielectric, kepha buzobonakala emuva ngethusi. Ngakho-ke, ama-lasers amaningi e-CO2 asetshenziselwa ukucubungula i-dielectric, ukubumba, ukusika kanye ne-delamination ye-dielectric substrate ne-laminate. Ngoba amandla okukhipha e-CO2 laser aphezulu kunalawo we-DPSS laser, i-CO2 laser isetshenziselwa ukucubungula i-dielectric ezimweni eziningi. I-CO2 laser ne-UV-dpss laser zivame ukusetshenziswa ndawonye. Isibonelo, lapho kubhola ama-vias amancane, qala ngokususa ungqimba wethusi nge-DPSS laser, bese ubhoboza ngokushesha izimbobo kusendlalelo lwe-dielectric nge-CO2 laser kuze kuvele ungqimba olandelayo ogqoke ithusi, bese uphinda inqubo.

Ngoba ubude be-UV laser uqobo bufushane kakhulu, indawo ekhanyayo ekhishwa yi-UV laser icole kakhulu kunaleyo ye-CO2 laser, kepha kwezinye izinhlelo zokusebenza, indawo yokukhanya enkulu enobubanzi obukhulu eyenziwe yi-CO2 laser ilusizo kakhulu kune-UV-dpss laser. Isibonelo, sika izinto zokwakha ezinkulu ezifana nama-grooves namabhulokhi noma ukubhoboza izimbobo ezinkulu (ububanzi obukhulu kune-50) μ m) Kuthatha isikhathi esincane ukucubungula nge-CO2 laser. Ngokuvamile, isilinganiso sokuvula siyi-50 μ Lapho m inkulu, i-CO2 laser processing ifaneleka ngokwengeziwe, futhi ukuvula kungaphansi kwama-50 μ M, umphumela we-UV-dpss laser ungcono.