Tus nqi tso zis ntawm lub ntiaj teb electroplating PCB kev lag luam tso nyiaj rau qhov nce sai ntawm qhov sib piv ntawm tag nrho cov txiaj ntsig ntawm cov khoom siv hluav taws xob hauv kev lag luam. Nws yog kev lag luam nrog qhov loj tshaj plaws ntawm cov khoom siv hluav taws xob hauv kev lag luam thiab ua haujlwm tshwj xeeb. Tus nqi txhua xyoo ntawm electroplated PCB yog 60 billion US dollars. Lub ntim ntawm cov khoom siv hluav taws xob tau dhau los ua sib dua, nyias, luv thiab me dua, thiab ncaj qha stacking ntawm vias ntawm qhov muag tsis pom vias yog ib txoj hauv kev tsim kom tau txais kev sib txuas ntawm qhov siab. Txhawm rau ua haujlwm zoo ntawm stacking qhov, hauv qab ntawm lub qhov yuav tsum tiaj tus. Muaj ntau ntau txoj hauv kev los ua ib qho chaw tiaj tus, thiab cov txheej txheem electroplating qhov filling yog ib qho ntawm cov neeg sawv cev. Ntxiv nrog rau kev txo cov kev xav tau ntawm kev txhim kho cov txheej txheem ntxiv, cov txheej txheem electroplating thiab filling yog sib xws nrog cov txheej txheem txheej txheem tam sim no, uas yog qhov tsim nyog kom tau txais kev ntseeg tau zoo.

Electroplating qhov filling muaj qhov zoo hauv qab no:

(1) Conducive rau tsim ntawm stacked qhov (Stacked) thiab on-disk qhov (Via.on.Pad);

(2) Txhim kho hluav taws xob kev ua tau zoo thiab pab tsim cov khoom siv ntau zaus;

(3) Pab txhawb kom kub dissipation;

(4) Lub qhov ntsaws ntsaws thiab hluav taws xob sib txuas tau ua tiav hauv ib kauj ruam;

(5) Lub qhov muag tsis pom kev yog ntim nrog electroplated tooj liab, uas muaj kev ntseeg siab dua thiab ua tau zoo dua li cov kua nplaum conductive.

Lub cev tsis muaj zog

Cov yam ntxwv ntawm lub cev uas yuav tsum tau kawm yog: hom anode, anode-cathode spacing, tam sim no ceev, agitation, kub, rectifier thiab waveform, thiab lwm yam.

(1) Hom Anode. Thaum nws los txog rau hom anode, tsis muaj dab tsi ntau tshaj li soluble anodes thiab insoluble anodes. Soluble anode feem ntau yog phosphorous tooj liab pob, uas yog ib qho yooj yim los tsim cov av nkos anode, paug cov tshuaj plating, thiab cuam tshuam rau kev ua haujlwm ntawm cov tshuaj plating. Insoluble anodes, tseem hu ua inert anodes, feem ntau yog tsim los ntawm titanium mesh coated nrog tov oxides ntawm tantalum thiab zirconium. Insoluble anode, zoo stability, tsis muaj anode txij nkawm, tsis muaj anode av nkos tiam, mem tes los yog DC electroplating muaj feem xyuam; Txawm li cas los xij, kev noj cov additives kuj loj heev.

(2) Qhov kev ncua deb ntawm cathode thiab anode. Kev tsim ntawm qhov sib nrug ntawm cov cathode thiab cov anode hauv cov txheej txheem electroplating qhov filling yog qhov tseem ceeb heev, thiab kev tsim cov khoom siv sib txawv tsis zoo ib yam. Txawm li cas los xij, nws yuav tsum tau taw qhia tias txawm tias tus qauv tsim zoo li cas, nws yuav tsum tsis txhob ua txhaum Fara thawj txoj cai.

3) Sib tov. Muaj ntau hom kev nplawm, suav nrog kev sib tsoo tshuab, hluav taws xob co, cua co, cua stirring, thiab dav hlau (Eductor).

Rau electroplating thiab filling qhov, nws yog feem ntau inclined mus nce lub dav hlau tsim raws li configuration ntawm cov tsoos tooj liab lub tog raj kheej. Txawm li cas los xij, txawm tias nws yog lub dav hlau hauv qab lossis sab dav hlau, yuav ua li cas npaj lub dav hlau raj thiab cua tshuab raj hauv lub tog raj kheej; dab tsi yog lub dav hlau ntws ib teev; Dab tsi yog qhov kev ncua deb ntawm lub dav hlau raj thiab lub cathode; Yog hais tias lub dav hlau sab siv, lub dav hlau nyob ntawm lub anode pem hauv ntej los yog rov qab; yog siv lub dav hlau hauv qab, nws puas yuav ua rau tsis sib xws, thiab cov tshuaj plating yuav tsum nplawm kom tsis muaj zog thiab muaj zog; tus naj npawb, qhov sib nrug, thiab lub kaum sab xis ntawm lub dav hlau ntawm lub dav hlau raj yog txhua yam uas yuav tsum tau xav txog thaum tsim lub tog raj kheej tooj liab. Yuav tsum muaj kev sim ntau.

Tsis tas li ntawd, txoj hauv kev zoo tshaj plaws yog txuas txhua lub dav hlau mus rau lub ntsuas dej ntws, kom ua tiav lub hom phiaj ntawm kev saib xyuas tus nqi ntws. Vim tias lub dav hlau ntws loj, qhov kev daws teeb meem yog yooj yim los ua kom sov, yog li kev tswj qhov kub thiab txias kuj tseem ceeb heev.

(4) Tam sim no ceev thiab kub. Tsis tshua muaj tam sim no ceev thiab tsawg kub yuav txo tau qhov chaw tooj liab deposition tus nqi, thaum muab txaus Cu2 thiab brightener rau hauv lub qhov. Nyob rau hauv cov xwm txheej no, lub qhov filling muaj peev xwm txhim kho, tab sis tib lub sij hawm lub plating efficiency txo.

(5) Rectifier. Lub rectifier yog qhov txuas tseem ceeb hauv cov txheej txheem electroplating. Tam sim no, kev tshawb fawb ntawm electroplating qhov filling yog feem ntau txwv rau tag nrho cov phaj electroplating. Yog hais tias tus qauv electroplating qhov filling raug txiav txim siab, thaj tsam ntawm cathode yuav dhau los ua me me. Lub sijhawm no, cov kev xav tau siab heev tau muab tso rau pem hauv ntej rau qhov tseeb ntawm cov khoom siv rectifier.

Cov zis qhov tseeb ntawm lub rectifier yuav tsum raug xaiv raws li cov khoom kab thiab qhov loj ntawm qhov ntawm. Qhov thinner cov kab thiab qhov me me, qhov siab dua qhov yuav tsum tau muaj ntawm cov rectifier. Feem ntau, lub rectifier nrog cov zis qhov tseeb ntawm tsawg dua 5% yuav tsum tau xaiv. Lub siab precision ntawm cov xaiv rectifier yuav nce cov cuab yeej peev. Rau cov zis cable thaiv ntawm lub rectifier, ua ntej tso lub rectifier nyob rau sab ntawm lub plating tank kom ntau li ntau tau, thiaj li hais tias qhov ntev ntawm cov zis cable yuav txo tau thiab cov mem tes tam sim no nce lub sij hawm yuav txo tau. Kev xaiv ntawm lub rectifier tso zis cable specifications yuav tsum txaus siab hais tias cov kab voltage poob ntawm cov zis cable nyob rau hauv 0.6V thaum lub siab tshaj plaws tso zis tam sim no yog 80%. Qhov xav tau cable hla ntu feem ntau yog xam raws li qhov tam sim no-nqa peev ntawm 2.5A / mm: . Yog hais tias qhov cross-sectional cheeb tsam ntawm lub cable yog me me dhau los yog qhov ntev ntawm cable ntev dhau lawm, thiab cov kab hluav taws xob poob siab dhau lawm, qhov kev xa tawm tam sim no yuav tsis ncav cuag tus nqi tam sim no rau kev tsim khoom.

Rau plating tso tsheb hlau luam nrog ib tug zawj dav dav dua 1.6m, yuav tsum tau txiav txim siab rau ob-sided fais fab mov txoj kev, thiab qhov ntev ntawm ob-sided cables yuav tsum sib npaug. Nyob rau hauv txoj kev no, nws tuaj yeem ua kom ntseeg tau tias qhov kev ua yuam kev ob tog tam sim no raug tswj nyob rau hauv ib qho kev sib tw. Lub rectifier yuav tsum tau txuas rau txhua sab ntawm txhua lub flybar ntawm lub plating tank, kom cov tam sim no ntawm ob sab ntawm cov khoom tuaj yeem hloov kho nyias.

(6) Waveform. Tam sim no, los ntawm kev xav ntawm waveforms, muaj ob hom electroplating qhov filling: mem tes electroplating thiab DC electroplating. Ob qho tib si electroplating thiab filling txoj kev tau kawm. Qhov ncaj qha tam sim no electroplating qhov filling txais cov tsoos rectifier, uas yooj yim rau kev khiav lag luam, tab sis yog tias lub phaj tuab dua, tsis muaj dab tsi ua tau. Pulse electroplating qhov filling siv PPR rectifier, uas muaj ntau cov kauj ruam ua haujlwm, tab sis muaj peev xwm ua tau zoo rau cov txheej txheem tuab dua.

Kev cuam tshuam ntawm substrate

Kev cuam tshuam ntawm lub substrate ntawm lub electroplated qhov filling yog tseem tsis tau ignored. Feem ntau, muaj ntau yam xws li dielectric txheej khoom, lub qhov zoo, thickness-rau-diameter ratio, thiab tshuaj tooj liab plating.

(1) Cov khoom ntawm cov txheej txheem dielectric. Cov khoom ntawm cov txheej dielectric muaj qhov cuam tshuam rau lub qhov txhaws. Piv nrog cov iav fiber reinforced cov ntaub ntawv, cov ntaub ntawv uas tsis yog iav yog yooj yim rau sau qhov. Nws yog ib nqi sau cia hais tias cov iav fiber ntau protrusions nyob rau hauv lub qhov muaj ib tug tsis zoo tshwm sim ntawm cov tshuaj tooj liab. Nyob rau hauv rooj plaub no, qhov nyuaj ntawm electroplating lub qhov filling yog los txhim kho cov adhesion ntawm cov noob txheej ntawm electroless plating txheej, es tsis yog lub qhov filling txheej txheem nws tus kheej.

Qhov tseeb, electroplating thiab filling qhov ntawm iav fiber reinforced substrates tau siv nyob rau hauv qhov tseeb ntau lawm.

(2) Thickness rau txoj kab uas hla. Tam sim no, ob qho tib si manufacturers thiab cov neeg tsim khoom tau muab qhov tseem ceeb rau cov tshuab filling rau qhov sib txawv thiab qhov ntau thiab tsawg. Qhov muaj peev xwm ntawm lub qhov muaj peev xwm cuam tshuam zoo heev los ntawm lub qhov thickness-rau-inch ratio. Hais txog kev hais lus, DC systems tau siv ntau dua kev lag luam. Hauv kev tsim khoom, qhov loj ntawm lub qhov yuav nqaim, feem ntau 80pm ~ 120Bm hauv txoj kab uas hla, 40Bm ~ 8OBm hauv qhov tob, thiab qhov sib piv ntawm thickness rau txoj kab uas hla yuav tsum tsis pub tshaj 1: 1.

(3) Electroless tooj liab plating txheej. Lub thickness thiab uniformity ntawm electroless tooj liab plating txheej thiab lub sij hawm tso kawm tom qab electroless tooj liab plating tag nrho cuam tshuam rau lub qhov filling kev ua tau zoo. Cov electroless tooj liab yog nyias los yog tsis sib npaug hauv thickness, thiab nws lub qhov filling nyhuv tsis zoo. Feem ntau, nws raug pom zoo kom sau lub qhov thaum lub thickness ntawm cov tshuaj tooj liab yog> 0.3pm. Tsis tas li ntawd, oxidation ntawm cov tshuaj tooj liab kuj muaj kev cuam tshuam tsis zoo rau lub qhov filling nyhuv.