Ukuhlaziywa kwezinto ezithinta inqubo yokugcwalisa imbobo ye-PCB electroplating

Inani eliphumayo le-electroplating yomhlaba wonke PCB imboni ilandisa ngokukhula ngokushesha kwengxenye yenani eliphelele lomkhiqizo wemboni yezingxenye ze-elekthronikhi. Yimboni enengxenye enkulu kunazo zonke embonini yezingxenye ze-elekthronikhi futhi inesikhundla esiyingqayizivele. Inani lokukhiphayo lonyaka le-PCB ene-electroplated lingama-dollar ayizigidi eziyizinkulungwane ezingama-60. Umthamo wemikhiqizo ye-elekthronikhi uya uba lula, ube mncane, ube mfushane futhi ube mncane, futhi ukunqwabelana okuqondile kwama-vias ku-vias eyimpumputhe kuyindlela yokuklama yokuthola ukuxhumana okunokuminyana okuphezulu. Ukwenza umsebenzi omuhle wokupakisha izimbobo, phansi kwembobo kufanele kube flat. Kunezindlela eziningana zokwenza indawo evamile yembobo yesicaba, futhi inqubo yokugcwalisa imbobo ye-electroplating ingenye yabameleli. Ngaphandle kokunciphisa isidingo sokuthuthukiswa kwenqubo eyengeziwe, inqubo ye-electroplating nokugcwalisa ibuye ihambisane nemishini yenqubo yamanje, ehambisana nokuthola ukwethembeka okuhle.

ipcb

Ukugcwaliswa kwembobo ye-Electroplating kunezinzuzo ezilandelayo:

(1) Okuhambisana nokwakhiwa kwezimbobo ezistakiwe (Ezistakiwe) kanye nezimbobo ezikudiski (Via.on.Pad);

(2) Thuthukisa ukusebenza kukagesi futhi usize ukuklama kwefrikhwensi ephezulu;

(3) Faka isandla ekushiseni;

(4) Imbobo yepulaki kanye nokuxhumana kukagesi kuqedwa ngesinyathelo esisodwa;

(5) Izimbobo eziyizimpumputhe zigcwele ithusi elenziwe nge-electroplated, elinokwethenjelwa okuphezulu kanye ne-conductivity engcono kune-glue conductive.

Imingcele yethonya lomzimba

Amapharamitha angokomzimba adinga ukufundwa yilezi: uhlobo lwe-anode, isikhala se-anode-cathode, ukuminyana kwamanje, ukuyaluza, izinga lokushisa, isilungisisi kanye ne-waveform, njll.

(1) Uhlobo lwe-anode. Uma kukhulunywa ngezinhlobo ze-anode, akukho okudlula ama-anode ancibilikayo nama-anode angancibiliki. I-anode encibilikayo imvamisa iyibhola lethusi le-phosphorus, okulula ukukhiqiza udaka lwe-anode, lingcolise isisombululo se-plating, futhi lithinte ukusebenza kwesisombululo sokucwenga. I-anode engancibilikiyo, eyaziwa nangokuthi i-inert anode, ivamise ukwakhiwa nge-titanium mesh embozwe ngama-oxide axubile e-tantalum ne-zirconium. I-anode engancibiliki, ukuzinza okuhle, akukho ukugcinwa kwe-anode, akukho kukhiqizwa kodaka lwe-anode, i-pulse noma i-DC electroplating iyasebenza; Nokho, ukusetshenziswa kwezithasiselo kukhulu uma kuqhathaniswa.

(2) Ibanga phakathi kwe-cathode ne-anode. Ukuklanywa kwesikhala phakathi kwe-cathode kanye ne-anode kwinqubo yokugcwalisa imbobo ye-electroplating kubaluleke kakhulu, futhi ukuklama kwezinhlobo ezahlukene zemishini akufani. Kodwa-ke, kufanele kuphawulwe ukuthi kungakhathaliseki ukuthi umklamo unjani, akufanele wephule umthetho wokuqala kaFara.

3) Ukunyakazisa. Kunezinhlobo eziningi zokunyakazisa, okuhlanganisa ukunyakazisa kwemishini, ukunyakaziswa kukagesi, ukunyakaziswa komoya, ukunyakazisa komoya, kanye nejethi (Eductor).

Nge-electroplating kanye nezimbobo zokugcwalisa, ngokuvamile kuthambekele ekwandiseni umklamo we-jet ngokusekelwe ekucushweni kwesilinda sethusi sendabuko. Kodwa-ke, kungakhathaliseki ukuthi i-jet engezansi noma i-jet eseceleni, indlela yokuhlela i-jet tube kanye neshubhu elishukumisa umoya kusilinda; kuyini ukugeleza kwe-jet ngehora; lingakanani ibanga phakathi kwe-jet tube kanye ne-cathode; uma i-jet eseceleni isetshenziswa, i-jet i-anode Front noma emuva; uma i-jet engezansi isetshenziswa, ingabe izobangela ukuxuba okungalingani, futhi isisombululo se-plating sizoshukunyiswa ngobuthakathaka futhi siqine phansi; inombolo, isikhala, kanye ne-engeli yamajethi e-jet tube yizo zonke izici okufanele zicatshangelwe lapho uklama isilinda sethusi. Kudingeka ukuhlola okuningi.

Ngaphezu kwalokho, indlela ekahle kakhulu ukuxhuma ishubhu ngayinye ye-jet kumitha yokugeleza, ukuze kufezwe injongo yokuqapha izinga lokugeleza. Ngenxa yokuthi ukugeleza kwejethi kukhulu, isisombululo kulula ukukhiqiza ukushisa, ngakho ukulawula izinga lokushisa nakho kubaluleke kakhulu.

(4) Ukuminyana kwamanje nezinga lokushisa. Ukuminyana okuphansi kwamanje nezinga lokushisa eliphansi kunganciphisa izinga lokumiswa kwethusi, kuyilapho kuhlinzeka nge-Cu2 eyanele kanye nesicwebezeli esingena emgodini. Ngaphansi kwalesi simo, ikhono lokugcwalisa imbobo liyathuthukiswa, kodwa ngesikhathi esifanayo ukusebenza kahle kwe-plating kuyancipha.

(5) Umlungisi. I-rectifier iyisixhumanisi esibalulekile kunqubo ye-electroplating. Njengamanje, ucwaningo lokugcwaliswa kwembobo ye-electroplating lukhawulelwe ku-electroplating egcwele yamapuleti. Uma iphethini yokugcwalisa imbobo ye-electroplating ibhekwa, indawo ye-cathode izoba yincane kakhulu. Ngalesi sikhathi, kubekwa izidingo eziphakeme kakhulu zokunemba kokukhishwayo kwesilungisisi.

Ukunemba kokuphumayo kwesilungisi kufanele kukhethwe ngokuya ngomugqa womkhiqizo kanye nosayizi we-via. Uma imigqa ibe mincane futhi izimbobo zibe zincane, ziphakama izidingo zokunemba zesilungisi. Ngokujwayelekile, isilungisisi esinokunemba kokukhishwayo okungaphansi kuka-5% kufanele kukhethwe. Ukunemba okuphezulu kwesilungisi esikhethiwe kuzokhuphula ukutshalwa kwezimali kwesisetshenziswa. Ukuze uthole izintambo zekhebula okukhiphayo zesilungisi, qala ngokubeka isilungisisi ngasohlangothini lwethangi lokucwenga ngangokunokwenzeka, ukuze ubude bekhebula lokukhiphayo buncishiswe futhi sincishiswe isikhathi sokukhuphuka kwe-pulse yamanje. Ukukhethwa kwezichasiselo zekhebula elikhiphayo lokulungisa kufanele kwenelise ukuthi ukwehla kwamandla kagesi kalayini wekhebuli yokukhiphayo kungaphakathi kuka-0.6V lapho umkhawulo ophumayo wamanje ungama-80%. Indawo enqamula ikhebula edingekayo imvamisa ibalwa ngokuvumelana nomthamo wamanje wokuthwala ongu-2.5A/mm:. Uma indawo ephambanayo yekhebula incane kakhulu noma ubude bekhebula buyinde kakhulu, futhi ukwehla kwamandla kagesi kumugqa kukhulu kakhulu, ukudluliswa kwamanje ngeke kufinyelele inani lamanje elidingekayo ekukhiqizeni.

Emathangeni okucwenga anobubanzi begroove engaphezu kuka-1.6m, indlela yokuphakelwa kwamandla ezinhlangothi ezimbili kufanele icatshangelwe, futhi ubude bezintambo ezinezinhlangothi ezimbili kufanele bulingane. Ngale ndlela, kungaqinisekiswa ukuthi iphutha lamanje lamazwe amabili lilawulwa phakathi kwebanga elithile. I-rectifier kufanele ixhunywe ohlangothini ngalunye lwe-flybar ngayinye yethangi lokucwenga, ukuze okwamanje ezinhlangothini ezimbili zocezu kulungiswe ngokuhlukana.

(6) I-Waveform. Njengamanje, ngokombono wamagagasi, kunezinhlobo ezimbili zokugcwalisa imbobo ye-electroplating: i-pulse electroplating kanye ne-DC electroplating. Zombili izindlela ze-electroplating kanye nokugcwalisa ziye zafundwa. Ukugcwalisa imbobo ye-electroplating eqondile yamanje kwamukela isilungisi sendabuko, okulula ukusebenza, kodwa uma ipuleti likhulu, akukho lutho olungenziwa. Ukugcwaliswa kwembobo ye-Pulse electroplating kusebenzisa isilungisi se-PPR, esinezinyathelo eziningi zokusebenza, kodwa esinamandla okucubungula aqinile wamabhodi angaphakathi kwenqubo.

Umthelela we-substrate

Umthelela we-substrate ekugcwaliseni imbobo ye-electroplated futhi akufanele indiva. Ngokuvamile, kunezici ezifana ne-dielectric layer material, ukwakheka kwembobo, isilinganiso sobukhulu-to-diameter, kanye ne-chemical copper plating.

(1) Impahla yongqimba lwe-dielectric. Izinto zesendlalelo se-dielectric zinomthelela ekugcwaliseni umgodi. Uma kuqhathaniswa nezinto eziqinisiwe ze-glass fiber, izinto ezingezona ingilazi eziqinisiwe kulula ukugcwalisa izimbobo. Kuyaqapheleka ukuthi i-glass fiber protrusions emgodini inomthelela omubi ethusi lamakhemikhali. Kulesi simo, ubunzima be-electroplating ukugcwaliswa kwembobo ukuthuthukisa ukunamathela kwesendlalelo sembewu ye-electroless plating layer, kunokuba inqubo yokugcwalisa imbobo ngokwayo.

Eqinisweni, i-electroplating kanye nezimbobo zokugcwalisa ku-glass fiber reinforced substrates zisetshenziswe ekukhiqizeni kwangempela.

(2) Isilinganiso sobukhulu nobubanzi. Njengamanje, bobabili abakhiqizi nabathuthukisi banamathisela ukubaluleka okukhulu kubuchwepheshe bokugcwalisa izimbobo zomumo nobukhulu obuhlukahlukene. Ikhono lokugcwalisa imbobo lithinteka kakhulu isilinganiso sobukhulu bembobo kuya kububanzi. Uma sikhuluma nje, izinhlelo ze-DC zisetshenziswa kakhulu kwezohwebo. Ekukhiqizeni, ububanzi bosayizi wembobo buzoba mncane, ngokuvamile bungu-80pm~120Bm ububanzi, 40Bm~8OBm ukujula, futhi isilinganiso sokujiya kuya kububanzi akumele sidlule u-1:1.

(3) Ungqimba lwethusi olungenawo ugesi. Ugqinsi nokufana kongqimba lwe-electroless copper plating kanye nesikhathi sokubeka ngemuva kokufakwa kwethusi okungena-electroless konke kuthinta ukusebenza kokugcwalisa imbobo. I-electroless copper incane kakhulu noma ayilingani ngokuqina, futhi umphumela wayo wokugcwalisa imbobo awulungile. Ngokuvamile, kunconywa ukugcwalisa imbobo lapho ubukhulu bekhopha yamakhemikhali bu> 0.3pm. Ngaphezu kwalokho, i-oxidation yethusi yamakhemikhali nayo inomthelela omubi emthonjeni wokugcwalisa umgodi.