Ixabiso lemveliso ye-electroplating yehlabathi PCB ishishini libalela ukunyuka okukhawulezileyo komlinganiselo wexabiso lilonke lemveliso yoshishino lwecandelo lombane. Lishishini elinelona candelo likhulu kwishishini lecandelo le-elektroniki kwaye likwindawo eyodwa. Ixabiso lemveliso yonyaka ye-PCB efakwe kwi-electroplated yi-60 yeebhiliyoni zeedola zaseMelika. Umthamo weemveliso zombane uya usiba khaphukhaphu, ubhitye, ube mfutshane kwaye ube mncinci, kwaye ukupakishwa ngokuthe ngqo kwe-vias kwi-vias eyimfama yindlela yoyilo lokufumana uqhagamshelo olunoxinaniso oluphezulu. Ukwenza umsebenzi omhle wokupakisha imingxuma, umphantsi womngxuma kufuneka ube mcaba. Kukho iindlela ezininzi zokwenza umngxuma oqhelekileyo we-flat flat, kwaye inkqubo yokuzalisa umngxuma we-electroplating yenye yabameli. Ukongeza ekunciphiseni imfuno yophuhliso lwenkqubo eyongezelelweyo, inkqubo ye-electroplating kunye nokuzaliswa kwayo iyahambelana nezixhobo zenkqubo yangoku, ekulungele ukufumana ukuthembeka okulungileyo.

Ukuzaliswa komngxuma we-Electroplating kunezi nzuzo zilandelayo:

(1) Ukulungelelaniswa koyilo lwemingxuma egciniweyo (i-Stacked) kunye nemingxuma kwidiski (Via.on.Pad);

(2) Ukuphucula ukusebenza kombane kunye nokunceda uyilo lwe-high-frequency;

(3) Yiba negalelo ekugqithiseni ubushushu;

(4) Umngxuma weplagi kunye noqhagamshelo lombane lugqityiwe kwinyathelo elinye;

(5) Imingxuma eyimfama izaliswe ngobhedu lwe-electroplated, olunokuthembeka okuphezulu kunye ne-conductivity engcono kune-glue conductive.

Iiparamitha zempembelelo yomzimba

Iiparamitha ezibonakalayo ezifuna ukufundwa zezi: uhlobo lwe-anode, isithuba se-anode-cathode, ukuxinana kwangoku, ukuphazamiseka, ubushushu, isilungisi kunye ne-waveform, njl.

(1) Uhlobo lwe-Anode. Xa kuziwa kwiindidi ze-anode, akukho nto ingaphezulu kwe-anode enyibilikayo kunye ne-anode enganyibilikiyo. I-anode e-soluble idla ngokuba yibhola yobhedu ye-phosphorous, elula ukuvelisa udaka lwe-anode, ukungcolisa isisombululo se-plating, kunye nokuchaphazela ukusebenza kwesisombululo se-plating. I-anode enganyibilikiyo, ekwabizwa ngokuba yi-inert anodes, ngokubanzi yenziwe nge-titanium mesh eqatywe ngee-oxides ezixubeneyo ze-tantalum kunye ne-zirconium. I-anode engaxutywanga, ukuzinza okulungileyo, akukho kugcinwa kwe-anode, akukho sizukulwana sodaka lwe-anode, i-pulse okanye i-DC electroplating iyasebenza; nangona kunjalo, ukusetyenziswa kwezongezo kukhulu kakhulu.

(2) Umgama phakathi kwe-cathode kunye ne-anode. Uyilo lwesithuba phakathi kwe-cathode kunye ne-anode kwinkqubo yokuzalisa umngxuma we-electroplating kubaluleke kakhulu, kwaye ukuyila kweentlobo ezahlukeneyo zezixhobo azifani. Nangona kunjalo, kufuneka kucaciswe ukuba kungakhathaliseki ukuba uyilo lunjani, akufanele luphule umthetho wokuqala weFara.

3) Ukuvuselela. Kukho iintlobo ezininzi zokuvuselela, kubandakanywa ukuxubha ngomatshini, ukuxubha kombane, ukushukuma komoya, ukushukumisa umoya, kunye nejethi (uMfundisi).

I-electroplating kunye nemingxuma yokuzalisa, ngokuqhelekileyo ithambekele ekwandiseni i-jet design esekelwe kuqwalaselo lwe-cylinder yethusi yendabuko. Nangona kunjalo, ingaba i-jet ephantsi okanye i-jet yecala, indlela yokulungisa ityhubhu ye-jet kunye ne-tube yokuvuselela umoya kwi-cylinder; yintoni ukuhamba kwejethi ngeyure; yintoni umgama phakathi kwe-jet tube kunye ne-cathode; ukuba ijethi yecala isetyenzisiwe, ijethi ikwi-anode Front okanye ngasemva; ukuba i-jet ephantsi isetyenzisiwe, ngaba iya kubangela ukuxubana okungalinganiyo, kwaye isisombululo sokucoca siya kuxutywa sibuthathaka kwaye siqine phantsi; inani, isithuba, kunye ne-angle yeejethi kwi-jet tube zizinto zonke ekufuneka ziqwalaselwe xa kuyilwa isilinda sobhedu. Kufuneka uvavanyo oluninzi.

Ukongezelela, eyona ndlela ifanelekileyo kukudibanisa ityhubhu yejethi nganye kwimitha yokuhamba, ukwenzela ukufezekisa injongo yokubeka iliso kwisantya sokuhamba. Ngenxa yokuba ukuhamba kwejethi kukhulu, isisombululo kulula ukuvelisa ubushushu, ngoko ke ulawulo lobushushu lubaluleke kakhulu.

(4) Ubuninzi bangoku kunye nobushushu. Uxinzelelo lwangoku oluphantsi kunye nobushushu obuphantsi bunokunciphisa izinga lokubekwa kobhedu, ngelixa libonelela nge-Cu2 eyaneleyo kunye ne-brightener emngxunyeni. Ngaphantsi kwesi simo, ukukwazi ukuzaliswa komngxuma kuphuculwe, kodwa kwangaxeshanye ukusebenza kakuhle kweplating kuyancipha.

(5) Umlungisi. I-rectifier iyikhonkco ebalulekileyo kwinkqubo ye-electroplating. Okwangoku, uphando malunga nokuzaliswa komngxuma we-electroplating lukhawulelwe kakhulu kwi-electroplating epheleleyo. Ukuba ipateni yokuzaliswa komngxuma we-electroplating iqwalaselwa, indawo yecathode iya kuba ncinci kakhulu. Ngeli xesha, iimfuno eziphezulu kakhulu zibekwe phambili ukwenzela ukuchaneka kwemveliso yomlungisi.

Ukuchaneka kwemveliso ye-rectifier kufuneka kukhethwe ngokomgca wemveliso kunye nobukhulu be-via. Imigca emincinci kwaye imingxuma encinci, iphakamisa iimfuno zokuchaneka komlungisi. Ngokuqhelekileyo, umlungisi onokuchaneka kwemveliso engaphantsi kwe-5% kufuneka akhethwe. Ukuchaneka okuphezulu komlungisi okhethiweyo kuya kwandisa utyalo-mali lwezixhobo. Kwi-output cable wiring ye-rectifier, okokuqala beka isilungisi kwicala letanki yokucoca kangangoko kunokwenzeka, ukwenzela ukuba ubude bentambo yokuphuma buncitshiswe kwaye ixesha lokunyuka kwe-pulse yangoku lingancitshiswa. Ukukhethwa kweenkcazo zentambo yokuphuma yokuhlaziya kufuneka kwanelise ukuba ukwehla kwamandla ombane wentambo yokuphuma kungaphakathi kwe-0.6V xa ubuninzi bemveliso yangoku bungama-80%. Indawo efunekayo ye-cable cross-sectional idla ngokubalwa ngokuhambelana nomthamo wangoku we-2.5A / mm:. Ukuba indawo enqamlezayo yentambo incinci kakhulu okanye ubude bentambo bude kakhulu, kwaye ukuhla kwamandla ombane kukhulu kakhulu, ukuhanjiswa kwangoku akuzukufikelela kwixabiso langoku elifunekayo kwimveliso.

Ukulungiselela iitanki zokucoca kunye nobubanzi be-groove enkulu kune-1.6m, indlela yokunikezelwa kwamandla amabini kufuneka ithathelwe ingqalelo, kwaye ubude beentambo eziphindwe kabini kufuneka zilingane. Ngale ndlela, kunokuqinisekiswa ukuba impazamo yangoku yamazwe amabini ilawulwa kuluhlu oluthile. I-rectifier kufuneka idibaniswe kwicala ngalinye le-flybar ye-plating tank, ukwenzela ukuba i-current kumacala amabini esiqhekeza ingalungiswa ngokwahlukileyo.

(6) Ukuma kwamaza. Okwangoku, ngokwembono yeefom zamaza, kukho iindidi ezimbini zokuzaliswa komngxuma we-electroplating: i-pulse electroplating kunye ne-DC electroplating. Zombini iindlela ze-electroplating kunye nokuzaliswa ziye zafundwa. Ukuzaliswa kwemingxuma ye-electroplating yangoku yamkela i-rectifier yendabuko, ekulula ukuyisebenzisa, kodwa ukuba ipleyiti inzima, akukho nto inokwenziwa. Ukuzaliswa komngxunya we-Pulse electroplating kusebenzisa isilungisi sePPR, esinamanyathelo amaninzi okusebenza, kodwa sinamandla okusebenza okuqinileyo kwiibhodi ezishinyeneyo kwinkqubo.

Impembelelo ye-substrate

Impembelelo ye-substrate yokuzaliswa komngxuma we-electroplated nayo ayifanele ingahoywa. Ngokubanzi, kukho izinto ezinje ngezixhobo zomaleko we-dielectric, ukumila komngxuma, umlinganiselo wokutyeba ukuya kububanzi, kunye nokufakwa kweekhemikhali zobhedu.

(1) Izinto eziphathekayo zoluhlu lwe-dielectric. Izinto eziphathekayo zoluhlu lwe-dielectric zinefuthe lokuzaliswa komngxuma. Xa kuthelekiswa nezixhobo eziqiniswe kwifiber yeglasi, izinto eziqiniswayo ezingenaglasi zilula ukuzalisa imingxuma. Kuyafaneleka ukuba uqaphele ukuba i-glass fiber protrusions emngxunyeni inefuthe elibi kwimichiza yobhedu. Kule meko, ubunzima be-electroplating yokuzaliswa komngxuma kukuphucula ukunamathela komgca wembewu ye-electroless plating layer, kunokuba inkqubo yokuzalisa umngxuma ngokwayo.

Enyanisweni, i-electroplating kunye nokuzalisa imingxuma kwi-glass fiber reinforced substrates isetyenziswe kwimveliso yangempela.

(2) Ukutyeba kumlinganiselo wedayamitha. Okwangoku, bobabini abavelisi kunye nabaphuhlisi bafakela ukubaluleka okukhulu kwitekhnoloji yokuzalisa imingxuma yeemilo ezahlukeneyo kunye nobukhulu. Ikhono lokuzalisa umngxuma lichaphazeleka kakhulu ngumlinganiselo wobukhulu bomngxuma ukuya kwi-diameter. Xa sithetha, iinkqubo ze-DC zisetyenziswa kakhulu kurhwebo. Kwimveliso, uluhlu lobungakanani bomngxuma luya kuba luncinci, ngokubanzi 80pm ~ 120Bm ububanzi, 40Bm～8OBm ngobunzulu, kwaye umlinganiselo wobunzima ukuya kwidayamitha akufanele udlule i-1: 1.

(3) Umaleko wokutyabeka wobhedu ongenambane. Ubukhulu kunye nokufana kwe-electroless copper plating layer kunye nexesha lokubeka emva kokutyalwa kwe-electroless copper konke kuchaphazela ukusebenza kokuzaliswa komngxuma. Ubhedu lwe-electroless luncinci kakhulu okanye alulingani ngobukhulu, kwaye umphumo walo wokuzalisa umngxuma awubi. Ngokuqhelekileyo, kuyacetyiswa ukuba ugcwalise umngxuma xa ubukhulu bobhedu bemichiza bu> 0.3pm. Ukongezelela, i-oxidation yobhedu lweekhemikhali nayo inefuthe elibi kwisiphumo sokuzalisa umngxuma.