Intshayelelo kwimveli I-PCB Assembly inkqubo

Icandelo elisisiseko le-PCB (eyaziwa ngokuba yi-PCBA) lwenziwa ngale ndlela ilandelayo.

Ukusetyenziswa kwe-solder paste: faka i-solder paste particles exutywe ne-flux kwisitya esisezantsi se-PCB. Sebenzisa iitemplate ezinobungakanani obahlukeneyo kunye neemilo ukuqinisekisa ukuba uncamathiselo lusetyenziswa kuphela kwiindawo ezithile.

L Ukubekwa kwecandelo: ngesandla okanye ngokuzenzekelayo beka izinto ezincinci zombane wesekethe kwipleyiti yokuncamathelisa ye-solder ngokukhetha nokukothula izixhobo ezizenzekelayo.

L Reflow: ukuphiliswa kwencam ye-solder yenziwa ngexesha lokuvuselelwa. Ukupasa ibhodi ye-PCB enento efakiweyo kwisithando somlilo esinefuthe lobushushu ngaphezulu kwe-500 ° F. Xa i-solder paste inyibilikile, ibuyiselwa kumthuthi kwaye iqiniswe ngokuyivelisa kwindawo epholileyo.

L Ukuhlolwa: Oku kwenziwa emva kokufakwa kwakhona kwe-welding. Yenza uhlolo ukukhangela ukusebenza kwecandelo. Eli nqanaba libalulekile kuba linceda ekuchongeni izinto ezibekwe endaweni engeyiyo, unxibelelwano olubi kunye neesekethe ezifutshane. Rhoqo, ukubekwa endaweni engeyiyo kwenzeka ngexesha le-reflux. Abavelisi bePCB basebenzisa uhlolo lwencwadi, uhlolo lwe-X-ray kunye nohlolo oluzenzekelayo lovavanyo kweli nqanaba.

Ukufakwa kwento engena ngaphakathi: Iibhodi ezininzi zesekethe zifuna zombini ukungena emngxunyeni kunye nomphezulu wokunyuka komhlaba ukuze kufakwe. Ke ngoko wenziwe kweli nqanaba. Ngokubanzi, ukufakwa emngxunyeni kwenziwa kusetyenziswa ukugoba nge-soldering okanye nge-welding yesandla.

L Ukuhlolwa kokugqibela nokucoca: Okokugqibela, jonga amandla e-PCB ngokuyivavanya kwimisinga eyahlukeneyo nakwimithambo. Nje ukuba i-PCB idlule kweli nqanaba lokuhlola, yicoce ngamanzi angcolileyo, njengoko i-welding izakushiya intsalela. Emva kokuhlamba, iyomiswa phantsi komoya oxinzelelweyo kwaye ihlanganiswe kakuhle.

Oku kulandela inkqubo yendibano yendibano ye-PCB. Njengoko kubonisiwe, uninzi lweePCBS zihlanganisene kusetyenziswa itekhnoloji ye-hole-hole (THT), itekhnoloji yokuphakama komphezulu (SMT), kunye neenkqubo zendibano ye-hybrid. Ezi nkqubo ze-PCBA ziya kuxoxwa ngakumbi.

NgeNkomfa yeTekhnoloji yeHole (i-THT): Ukwaziswa kwamanyathelo abandakanyekayo

Ngokusebenzisa umngxunya wetekhnoloji (i-THT) yahlukile kuphela kumanyathelo ambalwa e-PCBA. Makhe sixoxe nge-THA ngamanyathelo e-PCBA.

L Ukubekwa kwecandelo: Ngexesha lale nkqubo, izinto zifakwa ngesandla ziinjineli ezinamava. Inkqubo yofakelo yokucholwa ngesandla nokubeka izinto kufuna ukuchaneka okuphezulu kunye nesantya sokuqinisekisa ukubekwa kwezinto. Iinjineli kufuneka zilandele imigangatho nemigaqo ye-THT ukufezekisa ukusebenza ngokukuko.

L Ukuhlolwa kunye nokulinganiswa kwamacandelo: Iibhodi ze-PCB ziyalinganiswa ukuyila izakhelo zothutho ukuqinisekisa ukubekwa ngokuchanekileyo kwezinto. Ukuba kufumaneke ukungahanjiswa gwenxa kwezinto, kulungiswa kuphela emva koko. Ulungelelwaniso lulula ngaphambi kwentsimbi, ke izikhundla zecandelo ziyalungiswa kweli nqanaba.

I-Wave soldering: Kwi-THT, i-soldering ye-wave iyenziwa ukuze kuqiniswe uncamathiselo kwaye kugcinwe indibano kwindawo yayo. Kwi-soldering ye-wave, i-PCB kunye necandelo elifakelweyo lihamba ngaphezulu kwe-solder ehamba kancinci ehamba nobushushu obungaphezulu kwe-500 ° F. Iyavezwa kwindawo epholileyo yokuqinisa unxibelelwano.

Umhlangano weNtaba yeTekhnoloji (SMT): Ngawaphi amanyathelo ahlukeneyo abandakanyekayo

Amanyathelo e-PCBA anokulandelwa kwindibano ye-SMT ngala alandelayo:

Ukusetyenziswa / ukuprintwa kwencam ye-solder: faka uncamathiselo we-solder kwipleyiti ngokusebenzisa umshicileli we-solder, ngokubhekisele kwitemplate yoyilo. Oku kuqinisekisa ukuba i-solder paste iprintwe ngobungakanani obonelisayo kwindawo enikiweyo.

L Ukubekwa kwecandelo: Ukubekwa kwecandelo kumacandelo e-SMT ngokuzenzekelayo. Ibhodi yesekethe ithunyelwa isuka kumshicileli iye kwindibano yendibano apho indibano ithathwa khona kwaye ibekwe ngumatshini ozenzekelayo wokuthwebula kunye nokwehla kwendlela. Obu buchule bonga ixesha xa kuthelekiswa nenkqubo yesikhokelo, kwaye buqinisekisa nokuchaneka kwiindawo ezithile zecandelo.

L Reflow ngelotha: Emva kokufakwa kwendibano, i-PCB ibekwa eziko apho i-solder paste inyibilika kwaye yafakwa kwindibano. I-PCB idlula kwindawo epholileyo yokubamba icandelo endaweni yalo.

Itekhnoloji yokunyuka komhlaba (SMT) isebenza ngakumbi kwiinkqubo zebandla ze-PCB.

Ngenxa yokwanda kokuntsokotha kwezixhobo ze-elektroniki kunye noyilo lwe-PCB, iindidi zebandla ezixubeneyo ziyasetyenziswa nakwishishini. Nangona, njengoko igama lisitsho, inkqubo yendibano ye-hybrid PCB kukudibana kwe-THT kunye ne-SMT.