Isingeniso sendabuko I-PCB Assembly inqubo

Ingxenye ye-PCB eyisisekelo (eyaziwa kakhulu njenge-PCBA) yenziwa ngale ndlela elandelayo.

Ukusetshenziswa kokunamathisela kwe-solder: faka izinhlayiya ze-solder paste ezixubeke nokugeleza kupuleti eliphansi le-PCB. Sebenzisa izifanekiso ezinobukhulu obuhlukile nobubunjwa ukuqinisekisa ukuthi ukunamathisela kusetshenziswa kuphela ezindaweni ezithile.

L Ukubekwa kwento: ngesandla noma ngokuzenzakalela beka izinto ezincane ze-elektroniki zesekethe kupuleti lokunamathisela le-solder ngokukha nokuthulula indlela ezenzakalelayo.

L Reflow: ukwelashwa kokunamathisela i-solder kwenziwa ngesikhathi sokugcwaliswa kabusha. Dlula ibhodi le-PCB elinengxenye efakiwe ngesithando somlilo esinezinga lokushisa elingaphezu kuka-500 ° F. Lapho i-solder paste incibilika, ibuyiselwa kumdlulisi futhi iqiniswe ngokuyibeka endaweni epholile.

L Ukuhlola: Lokhu kwenziwa ngemuva kokufaka kabusha i-welding. Yenza amasheke ukuze uhlole ukusebenza kwengxenye. Lesi sigaba sibalulekile ngoba sisiza ukukhomba izinto ezingafakwanga kahle, ukuxhumana okungekuhle namasekhethi amafushane. Imvamisa, ukufakwa okungahambi kahle kwenzeka ngesikhathi se-reflux. Abakhiqizi be-PCB basebenzisa ukuhlolwa okwenziwa ngesandla, ukuhlolwa kwe-X-ray nokuhlolwa okuzenzakalelayo kokukhanya kulesi sigaba.

Ukufakwa kwengxenye yomgodi: Amabhodi amaningi wesifunda adinga ukufakwa kwezinto zombili zomgodi nezingaphezulu. Ngakho-ke, usuqedile kulesi sinyathelo. Ngokuvamile, ukufakwa ngembobo kwenziwa ngokusebenzisa i-wave soldering noma i-welding yesandla.

L Ukuhlolwa kokugcina nokuhlanzwa: Okokugcina, hlola amandla we-PCB ngokuyihlola kumagagasi ahlukahlukene nemithamo. Lapho i-PCB isidlulile lesi sigaba sokuhlola, sihlanze ngamanzi akhethiwe, ngoba i-welding izoshiya ezinye izinsalela. Ngemuva kokuwashwa, iyomiswa ngaphansi komoya onomfutho futhi ihlanganiswe kahle.

Lokhu kulandela inqubo yenhlangano yendabuko ye-PCB. Njengoba kukhonjisiwe, ama-PCBS amaningi aqoqiwe kusetshenziswa i-through-hole technology (THT), surface-mount technology (SMT), kanye nezinqubo zomhlangano we-hybrid. Lezi zinqubo ze-PCBA zizoxoxwa ngokuqhubekayo.

Nge-Hole Technology Conference (THT): Isingeniso sezinyathelo ezithintekayo

Ngokusebenzisa imbobo ubuchwepheshe (i-THT) ihluke kuphela ezinyathelweni ezimbalwa ze-PCBA. Ake sixoxe nge-THA ngezinyathelo ze-PCBA.

L Ukubekwa kwengxenye: Ngale nqubo, izingxenye zifakwa ngesandla ngonjiniyela abanolwazi. Inqubo yokufaka yokuqoqa ngesandla nokubeka izinto idinga ukucacisa okuphezulu nesivinini ukuqinisekisa ukubekwa kwezinto. Onjiniyela kufanele balandele amazinga nemithethonqubo ye-THT ukufeza ukusebenza okuhle.

L Ukuhlolwa kanye nokulinganiswa kwezingxenye: Amabhodi e-PCB afaniswe nokuklama ozimele bezokuthutha ukuqinisekisa ukubekwa okunembile kwezingxenye. Uma kutholakala ukungabiwa kahle kwezinto ezithile, kulungiswa lapho kuphela. Ukulinganisa kulula ngaphambi kokushisela, ngakho-ke izikhundla zezingxenye ziyalungiswa kulesi sigaba.

I-Wave soldering: Ku-THT, i-wave soldering yenziwa ukuze kuqiniswe unamathisele futhi kugcinwe umhlangano usendaweni yawo ethile. Ku-soldering wave, i-PCB enengxenye efakiwe ihamba ngaphezu kwe-solder ehamba kancane ehamba kancane efudunyezwa emazingeni okushisa angaphezu kwe-500 ° F. Ngemuva kwalokho ivezwa kupholile ukuze kuqiniswe ukuxhumana.

Umhlangano weSurface Mount Technology (SMT): Yiziphi izinyathelo ezihlukile ezithintekayo

Izinyathelo ze-PCBA ezizolandelwa emhlanganweni weSMT zimi kanje:

Ukusebenza / ukuphrinta kokunamathisela kwe-solder: faka okunamathiselwe kwe-solder kupuleti ngokusebenzisa iphrinta yokunamathisela ye-solder, ubhekise kusifanekiso sokwakha. Lokhu kuqinisekisa ukuthi ukunamathisela kwe-solder kuprintwe ngobuningi obenelisayo endaweni enikeziwe.

L Ukubekwa kwengxenye: Ukubekwa kwento ezingxenyeni ze-SMT kuyazenzakalela. Ibhodi lesifunda lithunyelwa lisuka kwiphrinta liye entabeni yomhlangano lapho umhlangano uthathwa khona futhi ubekwe ngomshini ozenzekelayo wokuthwebula nokudonsa. Le ndlela yokonga isikhathi iqhathaniswa nenqubo yesandla, futhi iqinisekisa nokunemba ezindaweni ezithile zezinto.

L Ukugeleza kokugeleza kabusha: Ngemuva kokufakwa komhlangano, i-PCB ibekwa esithandweni somlilo lapho i-solder paste incibilika khona futhi ifakwa nxazonke zomhlangano. I-PCB idlula endaweni epholile ukuze ibambe ingxenye yayo endaweni.

Ubuchwepheshe be-Surface mount (SMT) busebenza kangcono ezinkambisweni zomhlangano eziyinkimbinkimbi ze-PCB.

Ngenxa yokukhula okwandayo kwemishini ye-elekthronikhi nedizayini ye-PCB, izinhlobo zomhlangano we-hybrid nazo ziyasetshenziswa embonini. Yize, njengoba igama lisho, inqubo yomhlangano we-hybrid PCB ukuhlanganiswa kwe-THT ne-SMT.