PCB Ukwenza i-cloning, elingana nebhodi yekopi ye-PCB, ibhodi yekopi ye-PCB yenye indlela yokuthetha, sele ikwimeko yeemveliso ze-elektroniki kunye nebhodi yesekethe, ukusetyenziswa kophando olubuyela umva kunye netekhnoloji yophuhliso iindlela zokwenza uhlalutyo kwibhodi yesekethe, Iimveliso zokuqala zefayile ye-PCB kunye noluhlu lwezinto (i-BOM), amaxwebhu acwangcisiweyo njengamaxwebhu obuchwephesha kunye nefayile yePCB kwimveliso yokuprinta kwescreen 1: 1 ukunciphisa, emva koko uphinde usebenzise ezi fayile zobuchwephesha kunye nokuveliswa kwenkqubo yebhodi yePCB, izinto zokuwelda, uvavanyo lwenqwelo moya , ukulungisa ingxaki kwisekethe, imodeli epheleleyo yekopi yoqobo yesekethe.

Ukukhuphela i-PCB kubhekisa kwinkqubo yokufumana kunye nokubuyisela iifayile ze-PCB zeebhodi zesekethe zombane kunye neebhodi zesekethe ezisebenzisa ngokusebenzisa iifayile. Ikopi yebhodi ayibandakanyi kuphela itekhnoloji yefayile ye-PCB efana nokukhupha, ukwenza i-PCB, inkqubo ye-PCB, kodwa kunye nokuguqula utshintsho lwefayile ye-PCB (ibhodi ye-PCB), iimveliso zombane zazo zonke iintlobo zezinto ze-elektroniki kwiibhodi zesekethe eziprintiweyo zokukhupha ulwazi kunye nokuhlela, Iitshipsi ezifihliweyo kwibhodi yesekethe okanye kuyo yonke itekhnoloji enje ngenkqubo yokuchithwa kwe-chip enye.

Inkqubo yokukopa i-PCB:

Inkqubo yokuphunyezwa kwetekhnoloji yebhodi ye-PCB ngamagama alula, kukuqala ukuskena iibhodi zebhodi yesekethe, ukurekhoda iinkcukacha zamacandelo, kunye nezinto ezisusiweyo ukwenza uluhlu lwezinto (i-BOM) kwaye zilungiselele ukuthengwa kwezinto, umfanekiso weplate ongenanto uskenwe kwisoftware ukuqhubekeka kwakhona kwifayile yefayile yebhodi yePCB, emva koko uthumele ifayile yePCB kwipleyiti yokwenza umzi-mveliso, Emva kokuba ibhodi yenziwe, izinto ezithengiweyo ziya kufakwa nge-welding kwibhodi ye-PCB eyenziwe, kwaye emva kokuvavanywa kwe-PCB kunye nokulungiswa kwe-debugging.

Ibhodi PCB indlela yokukopa:

Inyathelo lokuqala: fumana i-PCB, okokuqala ephepheni ukurekhoda onke amacandelo emodeli, iiparameter, kunye nokuma, ngakumbi i-diode, ulwalathiso lombhobho amathathu, ulwalathiso lwe-IC. Kukulungele ukuthatha imifanekiso emibini yesimo se-ski ngekhamera yedijithali. Ngoku ibhodi yesekethe iqhubela phambili nangaphezulu kwe-diode triode ezinye azihoyi ngokungaboni.

Inyathelo 2: Ukususwa kweBhodi: Susa zonke izinto kwaye ususe i-tin kumngxuma wePAD. Coca i-PCB ngotywala okanye ngebhodi yokuhlamba amanzi, emva koko uyibeke kwiskena kwifom ye-BMP), kwaye uqinisekise umfanekiso ocacileyo. Shayela ecaleni kwesilika, gcina ifayile kwaye uyiprinte ukuze uyisebenzise kamva.

Inyathelo 3: Yenza i-BOM: ngokomfanekiso webhodi yesekethe kwinyathelo loku-1, rekhoda imodeli, ipharamitha kunye nokuma kwawo onke amacandelo ephepheni, ngakumbi ulwalathiso lwediode, ityhubhu yeenjini ezintathu kunye nenotshi ye-IC, kwaye ekugqibeleni wenze iBOM.

Inyathelo 4: Ukusila ipleyiti: Pholisha i-inki ye-TOP LAYER kunye ne-BOTTOM LAYER ngephepha lomsonto kude kukhanye ifilimu yobhedu, emva koko uyibeke kwiskena kwaye uqhubeke ukuskena imifanekiso elungileyo nembi (Qaphela ukuba i-PCB kufuneka ibekwe ngokuthe tye kwaye iqonde kwiskena, kungenjalo umfanekiso oskeniweyo uya kutsala, kwaye kuya kuba yingxaki ukulungisa umfanekiso kamva) kwaye ugcine ifayile.

Inyathelo 5: Hlela: Baleka iFOTOTHO ukuvula umfanekiso ovavanyiweyo, hlengisa umahluko kunye nomthunzi weseyile, ukuze indawo enefilimu yobhedu kunye nenxalenye ngaphandle kobhedu lwefilimu ngokungafaniyo, jonga ukuba ingaba imigca icacile, ukuba akunjalo, phinda oku inyathelo. Ukuba icacile, umfanekiso uyagcinwa njengombala weefayile zefomathi zeBMP top.bmp kunye bot.bmp. Ukuba kukho ingxaki ngomfanekiso, unokulungiswa kwaye ulungiswe ngeFOTSHOPHOP.

Inyathelo 6: Ukulinganiswa kwemifanekiso: Qalisa ukukopa isoftware ye-PCB QuickPcb2005 kwaye ungenise imifanekiso ye-PCB ekhethiweyo kwimenyu yefayile. Umzekelo, isikhundla se-PAD kunye ne-VIA ngamanqanaba amabini ahambelana ngokuchanekileyo, ebonisa ukuba amanyathelo angaphambili enziwe kakuhle. Ukuba kukho nakuphi na ukuphambuka, phinda inyathelo lesi-5.

Inyathelo 7: ukuveliswa kwemveliso kunye nomgca wokuzoba: ngenisa umfanekiso we-BMP womaleko we-TOP kwi-software ye-QuickPcb2005, ngokwahlukeneyo kulungelelwaniso oluhambelanayo, emva koko ubeke isixhobo, ngokulandelelana sibonisa umaleko we-TOP kunye nongqameko lwe-BOTTOM yomgca.

Inyathelo 8: Thumela ifayile yePCB: Emva kokuba uninzi lomzobo wenziwe kwisoftware ye-QuickPC 2005, thumela ngaphandle ifayile kwaye uyigcine njenge. Ifomathi yePCB.

Inyathelo 9: Ukucwangciswa kwefayile kunye nokulungiswa: Ngenisa ngaphandle. Ifomathi yefomathi ye-PCB kwisoftware ye-EDA yokusebenza. Kuyacetyiswa ukuba kusetyenziswe i-Alitum Desiger 19 yokwandisa iifayile kunye nokujonga i-DRC, kunye nokuvelisa ifayile ye-PCB EGENERATED.